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2020 – today
- 2024
[c8]Seunghwan Lee, Jeongjin Cho, Shinyoung Choi, Sung Yoon Min, Eunjung Lee, Minji Jung, Kyoungmok Son, Hyunchaul Jeong, Heetak Han, Sachoun Park, Sanghyuck Moon, Seungki Jung, Junseok Yang, Taesub Jung, Howoo Park, Bumsuk Kim, Kyungho Lee, Jesuk Lee:
A Temporal Noise Reduction via 40% Enhanced Conversion Gain in Dual-Pixel CMOS Image Sensor with Full-Depth Deep-Trench Isolation and Locally Lowered-Stack Technology. VLSI Technology and Circuits 2024: 1-2- 2023
- [c7]Hyuncheol Kim, Yun Hyeok Kim, Sanghyuck Moon, Hwanwoong Kim, Byeongjun Yoo, Jueun Park, Seyoung Kim, June-Mo Koo, Sewon Seo, Hye Ji Shin, Younghwan Choi, Jinwoo Kim, Kyungil Kim, Jae-Hoon Seo, Seunghyun Lim, Taesub Jung, Howoo Park, Sangil Jung, Juhyun Ko, Kyungho Lee, JungChak Ahn, Joonseo Yim:
A 0.64μm 4-Photodiode 1.28μm 50Mpixel CMOS Image Sensor with 0.98e- Temporal Noise and 20Ke- Full-Well Capacity Employing Quarter-Ring Source-Follower. ISSCC 2023: 96-97 - 2022
- [c6]Jungbin Yun, Seungjoon Lee, Seungwon Cha, Jihun Kim, Jeongho Lee, Hanseok Kim, Eungkyu Lee, Seonok Kim, Seunghan Hong, Hyungchae Kim, Jinsuk Huh, Sungchul Kim, Kazunori Kakehi, Jae-Ho Kim, June-Mo Koo, Eunsang Cho, Heegeun Jeong, Howoo Park, Kyungho Lee, JungChak Ahn, Joonseo Yim:
A 0.6 ㎛ Small Pixel for High Resolution CMOS Image Sensor with Full Well Capacity of 10, 000e- by Dual Vertical Transfer Gate Technology. VLSI Technology and Circuits 2022: 351-352 - [c5]Hye Yeon Park, Yunki Lee, Jonghoon Park, Hyunseok Song, Taesung Lee, Hyung Keun Gweon, Yunji Jung, Jeongmin Bae, Boseong Kim, Junwon Han, Seungwon Kim, Cheolsang Yoon, Jeongki Kim, Changkeun Lee, Sehoon Yoo, Euiyeol Kim, Hyunmin Baek, Howoo Park, Bumsuk Kim, JungChak Ahn, Joonseo Yim:
Advanced novel optical stack technologies for high SNR in CMOS Image Sensor. VLSI Technology and Circuits 2022: 353-354 - 2021
- [c4]Jungwook Lim, Jihun Kim, Long Yan, Hyunpil Noh, Seungki Jung, Doosik Seol, Junghyung Pyo, Taesub Jung, Jungbin Yun, Dukseo Park, Howoo Park, Kyungho Lee, Takashi Nagano, JungChak Ahn:
A single chip PPG sensor with enhanced IR sensitivity for low power and small size. Imaging Sensors and Systems 2021: 1-5 - [c3]Jongeun Park, Sungbong Park, Kwansik Cho, Taehun Lee, Changkyu Lee, Donghyun Kim, Beomsuk Lee, SungIn Kim, Ho-Chul Ji, Dongmo Im, Haeyong Park, Jinyoung Kim, Jungho Cha, Tae-Hoon Kim, Insung Joe, Soojin Hong, Chongkwang Chang, Jingyun Kim, WooGwan Shim, Taehee Kim, Jamie Lee, Donghyuk Park, Euiyeol Kim, Howoo Park, Jaekyu Lee, Yitae Kim, JungChak Ahn, Youngki Chung, ChungSam Jun, Hyunchul Kim, Chang-Rok Moon, Ho-Kyu Kang:
7.9 1/2.74-inch 32Mpixel-Prototype CMOS Image Sensor with 0.64μ m Unit Pixels Separated by Full-Depth Deep-Trench Isolation. ISSCC 2021: 122-124 - [c2]Eun Sub Shim, Kyungho Lee, Junghyung Pyo, Wooseok Choi, Jungbin Yun, Taesub Jung, Kyungduck Lee, Seyoung Kim, Chanhee Lee, Seungki Baek, Hyuncheol Kim, Sungsoo Choi, Junseok Yang, Kyoungmok Son, Jongwon Choi, Howoo Park, Bumsuk Kim, JungChak Ahn, Duckhyun Chang:
All-Directional Dual Pixel Auto Focus Technology in CMOS Image Sensors. VLSI Circuits 2021: 1-2
2010 – 2019
- 2013
- [c1]Sung Ho Choi, Yi Tae Kim, Min Seok Oh, Younghwan Park, Jeongjin Cho, Youngheup Jang, Hyungjun Han, Jongwon Choi, Howoo Park, Sangil Jung, Hoon Sang Oh, Jung Chak Ahn, Hiroshige Goto, Chi-Young Choi, Yonghan Roh:
A novel pixel design with hybrid type isolation scheme for low dark current in CMOS image sensor. Sensors, Cameras, and Systems for Industrial and Scientific Applications 2013: 86590F
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