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2020 – today
- 2024
[c3]Yuto Lim, Lishuai Yuan, Zhaowei Zhong:
Quantum Error Corrected Fidelity Routing Design for Long-Distance Quantum Networks. ICNC 2024: 1149-1153- 2023
- [j13]Rui Guo
, Zhaowei Zhong:
A customer-centric IoT-based novel closed-loop supply chain model for WEEE management. Adv. Eng. Informatics 55: 101899 (2023)
2010 – 2019
- 2015
- [c2]Bao Huy Huynh, Tegoeh Tjahjowidodo, Zhaowei Zhong, Youyi Wang, Narasimalu Srikanth:
Nonlinearly enhanced vortex induced vibrations for energy harvesting. AIM 2015: 91-96 - 2013
- [c1]Zhaowei Zhong, J.-H. Zhou, Ye Nyi Win:
Correlation analysis of cutting force and acoustic emission signals for tool condition monitoring. ASCC 2013: 1-6
2000 – 2009
- 2007
- [j12]Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong:
Dynamic responses and solder joint reliability under board level drop test. Microelectron. Reliab. 47(2-3): 450-460 (2007) - 2006
- [j11]Meena Kishore Sakharkar, Pandjassarame Kangueane, Kishore R. Sakharkar, Zhaowei Zhong:
Huge Proteins in The Human Proteome and Their Participation in Hereditary Diseases. Silico Biol. 6(4): 275-279 (2006) - [j10]Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi:
Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints. Microelectron. Reliab. 46(2-4): 432-439 (2006) - [j9]Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong:
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA. Microelectron. Reliab. 46(12): 2131-2138 (2006) - 2004
- [j8]Tong Yan Tee, Zhaowei Zhong:
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis. Microelectron. Reliab. 44(1): 105-114 (2004) - [j7]Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong:
Impact life prediction modeling of TFBGA packages under board level drop test. Microelectron. Reliab. 44(7): 1131-1142 (2004) - [j6]Tong Yan Tee, Zhaowei Zhong:
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages. Microelectron. Reliab. 44(12): 1957-1965 (2004) - 2003
- [j5]Tong Yan Tee, Giovanni Frezza, Mayhuan Lim, Hun Shen Ng, Federico Ziglioli, Zhaowei Zhong:
Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn. Int. J. Comput. Eng. Sci. 4(2): 347-350 (2003) - [j4]Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong:
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. Microelectron. Reliab. 43(5): 741-749 (2003) - [j3]Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong:
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. Microelectron. Reliab. 43(7): 1117-1123 (2003) - [j2]Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong:
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages. Microelectron. Reliab. 43(8): 1329-1338 (2003) - 2002
- [j1]Huimin Xie, Anand K. Asundi, Chai Gin Boay, Lu Yunguang, Jin Yu, Zhaowei Zhong, Bryan K. A. Ngoi:
High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package. Microelectron. Reliab. 42(8): 1219-1227 (2002)
Coauthor Index
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