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Jing-en Luan

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2010 – 2019

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2010
[j2]
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  - journals/mr/GuojunRLB10
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  - https://dblp.org/rec/journals/mr/GuojunRLB10
Hu Guojun, Roberto Rossi, Jing-en Luan, Xavier Baraton:
Interface delamination analysis of TQFP package during solder reflow. Microelectron. Reliab. 50(7): 1014-1020 (2010)

2000 – 2009

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What is the meaning of the colors in the publication lists?

2007
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Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong:
Dynamic responses and solder joint reliability under board level drop test. Microelectron. Reliab. 47(2-3): 450-460 (2007)

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