This document presents an overview of computer-aided design (CAD) for microelectromechanical systems (MEMS). It discusses the need for CAD in MEMS to accelerate the design process. The evolution of early MEMS CAD packages is described. The key components of a MEMS CAD package include electromechanical, material, and fabrication databases. Common steps in a MEMS design process using CAD are outlined, such as substrate selection, deposition, lithography, and etching. Factors for choosing a suitable CAD package and an example MEMS gripper design are also summarized.
This document presents an overview of computer-aided design (CAD) for microelectromechanical systems (MEMS). It discusses the need for CAD in MEMS to accelerate the design process. The evolution of early MEMS CAD packages is described. The key components of a MEMS CAD package include electromechanical, material, and fabrication databases. Common steps in a MEMS design process using CAD are outlined, such as substrate selection, deposition, lithography, and etching. Factors for choosing a suitable CAD package and an example MEMS gripper design are also summarized.
This document presents an overview of computer-aided design (CAD) for microelectromechanical systems (MEMS). It discusses the need for CAD in MEMS to accelerate the design process. The evolution of early MEMS CAD packages is described. The key components of a MEMS CAD package include electromechanical, material, and fabrication databases. Common steps in a MEMS design process using CAD are outlined, such as substrate selection, deposition, lithography, and etching. Factors for choosing a suitable CAD package and an example MEMS gripper design are also summarized.
This document presents an overview of computer-aided design (CAD) for microelectromechanical systems (MEMS). It discusses the need for CAD in MEMS to accelerate the design process. The evolution of early MEMS CAD packages is described. The key components of a MEMS CAD package include electromechanical, material, and fabrication databases. Common steps in a MEMS design process using CAD are outlined, such as substrate selection, deposition, lithography, and etching. Factors for choosing a suitable CAD package and an example MEMS gripper design are also summarized.
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DEPT OF INSTRUMENTATION
TECHNOLOGY, RVCE Presentation on
COMPUTER AIDED DESIGN FOR MEMS BY Bindu Yadav 3rd semester
OUTLINE Need for CAD in MEMS Evolution Components of MEMS CAD package General Structure of CAD for Microsystems Product Design Choosing a CAD Package Design Steps References CAD for MEMS
WHY CAD?
In MEMS technology, CAD is defined as a tightly organized set of
cooperating computer programs that enable the simulation of manufacturing processes, device operation and packaged Microsystems behavior in a continuous sequence.
Need: Lengthy product development and production cycle
Helps design engineers in assessing the effect of design changes and
evaluating the manufacturing and yield of the product.
Solid modeling and animation capabilities provides a virtual prototype
that can simulate the performance of the desired functions of a real product.
Accelerate the design process of microsystem products to meet critical
TTM condition.
CAD for MEMS
Evolution Early 1990s MEMCAD Package at MIT First commercialized CAD tool
CAD for MEMS
specifically for MEMS in 1995-IntelliCad
developed by IntelliSense Microcosm Technologies licensed the code from MIT and released commercial version of MEMCAD MEMSPro from Tanner, MEMSCaP 4
Components of a MEMS CAD Package
A MEMS CAD Package should include at least three major interactive databases
Electromechanical design database
Inference machine for design synthesis
Material database Fabrication database
Electromechanical design database
Codes for Finite Element Analysis (FEA) Codes for Boundary Element Analysis (BEA) CAD for MEMS
Components of a MEMS CAD Package
Material Database
Youngs modulus
Bulk Micromanufacturing
Specific heat Coefficient of thermal expansion Melting point
Fabrication database Surface Micromachining Photolithography Etching CAD for MEMS
General Structure of CAD for Microsystem Product
Design
CAD for MEMS
Choosing a CAD Package
Suitable for their specific MEMS needs User friendliness Adaptability of package to various computers and peripherals Easy interfacing of CAD package with other software Completeness of material database Versatility of the built-in finite element or boundary codes CAD for MEMS
Choosing a CAD Package
Pre- and post- processing of design analyses by the package Capability of producing masks from solid models Provision for design optimization Simulation and animation capability Cost of purchasing and maintenance CAD for MEMS
Design Case: Microcell gripper using
IntelliSuite Material database
substrates
Silicon Polysilicon Gallium Arsenide Quartz Sapphire Alumina CAD for MEMS
Interconnects and mask materials
Aluminum Gold Silver Chromium Silicon dioxide
Insulating materials
Silicon dioxide Silicon nitride
Photoresist materials 10
Design Steps Step 1: Substrate selection
Silicon wafer, 100 mm dia and 500m thick cut from single silicon crystal produced by CZ method
Step 2: Substrate cleaning
Piranha solvent- 75% H2SO4 and 25% H2O2 by submerging in the solvent for 10 minutes
Step 3: Dry SiO2 deposition
1 m thick SiO2 deposited- electrical insulator
Process takes place at temp of 1100C and pressure of 101 KPa CAD for MEMS
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Design Steps Step 4: LPCVD deposition of polysilicon structure layer
1.2m thick deposition on oxide layer
Temp: 600 to 900C and time of 60 min as specified by the package
As lead wire for conducting electrical current
Deposited above the polysilicon layer- 3m thick Estimated time : 10 minutes
Applied over aluminum layer
Step 5: Aluminum sputtering
Step 6: Application of Photoresist At 4000 rpm and 115 C yielding 3m thick layer CAD for MEMS
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Design Steps
Step 7: Photolithography by UV exposure
UV light source at 250 W with = 436 nm is used
Solvent KOH
Special etchant: 75% H2SO4 + 20% C2H4O2 +5% HNO3
Depth 3m and estimated time 15 min
Solvent- KOH
Exposure time: 10 seconds
Step 8:Wet etching to remove photoresist
Step 9: Wet etching to remove aluminum Step 10: Wet etch to remove photoresist from aluminum CAD for MEMS
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Design Steps Step
11: Photoresist deposition and photolithography of
gripper structure Step 12: Remove photoresist by wet etch Step 13: Etch polysilicon by reactive ion etching
Solvents used: chlorine or fluorine in plasma
Etchant: SiH4 and KrF laser
This process releases gripper arms and tips from SiO2 layer
Step 14: Remove the SiO2 sacrificial layer
CAD for MEMS
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Design Steps Step 15: Separation of gripper and Substrate
Removal of in-between SiO2 layer
To check whether gripper performs desired function
Either using thin diamond saw or using etch pit technique
Step 16: Electromechanical analysis
Charge density analysis Finite element Strength analysis CAD for MEMS
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REFERENCES MEMS and Microsystem Design and Manufacture by Tai- Ran
Hsu CAD Application to MEMS Technology, Bruce K. Gale, University of Utah
