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Tsup3150h A2505

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0% found this document useful (0 votes)
5 views6 pages

Tsup3150h A2505

Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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TSUP3150H

Taiwan Semiconductor

3A, 150V Trench Schottky Surface Mount Rectifier


FEATURES KEY PARAMETERS
● AEC-Q101 qualified PARAMETER VALUE UNIT
● Excellent high temperature stability
IF 3 A
● Low forward voltage
● Lower power loss/ high efficiency VRRM 150 V
● High forward surge capability IFSM 80 A
● Ideal for automated placement
TJ MAX 150 °C
● Moisture sensitivity level: level 1, per J-STD-020
● RoHS Compliant Package TO-277A (SMPC4.6U)
● Halogen-free Configuration Single die

APPLICATIONS
● Switching mode power supply (SMPS)
● Adapters
● DC to DC converter

MECHANICAL DATA
● Case: TO-277A (SMPC4.6U)
● Molding compound meets UL 94V-0 flammability rating
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Meet JESD 201 class 2 whisker test TO-277A (SMPC4.6U)
● Polarity: Indicated by cathode band
● Weight: 0.11g (approximately)

ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)


PARAMETER SYMBOL VALUE UNIT
Repetitive peak reverse voltage VRRM 150 V
Reverse voltage, total rms value VR(RMS) 105 V
Forward current IF 3 A
Peak forward surge current, 8.3ms single half
IFSM 80 A
sine-wave superimposed on rated load
Junction temperature TJ - 55 to +150 °C
Storage temperature TSTG - 55 to +150 °C

1 Version: A2505
TSUP3150H
Taiwan Semiconductor

THERMAL PERFORMANCE
PARAMETER SYMBOL TYP UNIT
Junction-to-lead thermal resistance(1) RӨJL 2.4 °C/W
Junction-to-ambient thermal resistance(2) RӨJA 53.2 °C/W
Junction-to-case thermal resistance(2) RӨJC 12.4 °C/W
Thermal Performance Notes:
1. With ideal heat sink
2. Units mounted on PCB (16mm x 16mm Cu pad test board)

ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)


PARAMETER CONDITIONS SYMBOL TYP MAX UNIT
IF = 1.5A, TJ = 25°C 0.71 - V
IF = 3.0A, TJ = 25°C 0.78 0.85 V
Forward voltage(1) VF
IF = 1.5A, TJ = 125°C 0.56 - V
IF = 3.0A, TJ = 125°C 0.63 0.69 V
TJ = 25°C - 10 μA
Reverse current @ rated VR(2) IR
TJ = 125°C - 5 mA
Junction capacitance 1MHz, VR = 4.0V CJ 140 - pF
Notes:
1. Pulse test with PW = 0.3ms
2. Pulse test with PW = 30ms

ORDERING INFORMATION
ORDERING CODE PACKAGE PACKING
TSUP3150H TO-277A (SMPC4.6U) 6,000 / Tape & Reel

2 Version: A2505
TSUP3150H
Taiwan Semiconductor

CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)

Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance

4 1000
AVERAGE FORWARD CURRENT (A)

CAPACITANCE (pF)
2 100

1
f=1.0MHz
Vsig=50mVp-p
0 10
0 25 50 75 100 125 150 0.1 1 10 100

LEAD TEMPERATURE (°C) REVERSE VOLTAGE (V)

Fig.3 Typical Reverse Characteristics Fig.4 Typical Forward Characteristics


INSTANTANEOUS FORWARD CURRENT (A)

1000 10
INSTANTANEOUS REVERSE CURRENT (μA)

TJ=150°C
TJ=150°C
100

TJ=125°C TJ=125°C
10

(A)
1 TJ=25°C
1

TJ=-55°C
0.1
TJ=25°C Pulse width 300μs
1% duty cycle
0.01 0.1
10 20 30 40 50 60 70 80 90 100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FORWARD VOLTAGE (V)

Fig.5 Typical Forward Power Dissipation vs.


Forward Current
2
δ=1
POWER DISSIPATION (W)

δ = 0.5
1
TJ=150°C
δ = 0.2
δ = 0.1

0
0 1 2 3
FORWARD CURRENT (A)

3 Version: A2505
TSUP3150H
Taiwan Semiconductor

CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)

Fig.6 Typical Transient Thermal Characteristics

10
TRANSIENT THERMAL IMPEDANCE (°C/W)

0.1

0.01
1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00

PULSE DURATION (s)

4 Version: A2505
TSUP3150H
Taiwan Semiconductor

PACKAGE OUTLINE DIMENSIONS

TO-277A(SMPC4.6U)

UP3150
YWF

YW = Date code
F = Factory code

5 Version: A2505
TSUP3150H
Taiwan Semiconductor

Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf
assumes no responsibility or liability for any errors or inaccuracies.

Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability
for application assistance or the design of Purchasers’ products.

Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.

6 Version: A2505

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