PCB Design Specifications

S. No. Particulars Value

1. Job Number IRG-8262
2. Type Rigid-Flex PCB
3. Material All Polyimide (both rigid and flex)
4. Flex laminate thickness 4mil (min)
5. PCB thickness 1.6mm
6. No. of layers 8
7. No. of flex layers 4
8. Size – (cm) 39.6 X 14.2
9. Finish HASL
10. Green Mask No
11. Legend print No
12. Controlled Impedance Yes
13. Fine line (< 6mil) No
14. Fine drills (<0.4mm) No
15. Drill Table Size Plate Through Count
0.500 Yes 344
0.800 Yes 400
0.900 Yes 312
3.000 No 11
3.200 No 8
3.500 No 4
7.200 No 4
16. Annular Ring (as per actual design) 0.35mm
17. High TG Yes
18. Via filling (type 6) No
19. Via filling and capping (type 7) No
20. Construction Laminate
21. Outer basic copper 1 Oz
22. Inner basic copper 1 Oz
23. Blind/buried vias No
24. PCB Quantity 02
25. Batch Acceptance Test at vendor’s end (refer Required
section 7 of Annexure B)
26. Batch coupons to be delivered at SAC I. Standard Batch Acceptance Test
coupons
II. Two nos. of flex coupons with the
following configurations,
a. One should be with identical
build up configuration i.e. with
2 leafs
b. Another should be with single-
leaf

27. Delivery schedule 28 working days

 Dual flex layers

Single flex layers

Isometric View

Tentative Rigid-Flex stackup

Tentative Flex stackup

 Annexure-A

Annexure-A: Generic PCB Quality Specifications

Sr.
Parameters Requirements
No.

High Tg (≥ 170°C) Polyimide laminate as per IPC 4101 or

Printed Rigid Portion High Tg (≥ 170°C) FR-4 / Glass Polyimide laminate, as per
Circuit IPC-4101, as specified in PO
1.0
Board base
Material Flexible copper-clad polyimide laminate (IPC-4204A
Flex Portion
complied) and Cover-lay (IPC-4203A complied)

2.0 Visual Aspects

A General

Pattern Matching 100% with respect to the approved PCB layout

B Rigid Section

Nicks, burrs, & crazing along the edges of Rigid section

shall be acceptable if penetration not exceeding 50% of
Edges
distance from edge to nearest conductor or 2.5 mm
whichever is less

Scratches, Dents & Tool marks No expose conductor or disrupt fiber

Weave texture, chipping, haloing, cut, (1) Laminate fiber not to be disturbed or exposed
scratches, pits / dents (2) Defect not to bridge patterns
(3) Dielectric spacing between the defect and pattern be ≥
0.15 mm
(4) The imperfections do not propagate as a result of
testing (such as rework simulation & thermal shock)
Measling/Crazing (1) Shall be < 10 Sq mm continuous,
(2) Shall not bridge > 25% between pad & conductor
(3) Shall not affect > 2% areas of PCB per side
Blistering, Delamination NIL

Laminate Surface Pits & Voids Min 0.15 mm clearance from conductor and no bigger
than 0.8 mm in the longest dim.

Solder coating appearance Smooth uniform without wrinkles and bumps

Other unacceptable defects Non wetting, pad lifting, solder splashes, foreign material
imbedded, extra plating material on bare laminate,
disturbed coating, burrs & nodules in PTH, white residue
etc.

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 Annexure-A

Sr.
Parameters Requirements
No.

Pattern defects (isolated) (a) Nicks, cuts, edge roughness, voids, pin holes, dents,
scratches all combined shall not change the conductor
width by more than 20%
(b) Tears/cracks should not be there.
(c) Projections on conductor shall be ≤ 10% of width and
shall meet conductor spacing requirements

C Flexible Section

Edges The trimmed edges of flexible section of finished rigid-flex

PCB shall be free of burrs, nicks or delamination.
Subsurface imperfection such as (1) Defect not to bridge patterns
adhesive Voids, Foreign inclusion (2) Dielectric spacing between the defect and pattern be
≥ 0.127 mm. The imperfections do not propagate as a
result of testing such as thermal shock
(3) Wrinkles on cover-lay - NIL
D Transition Zone (Rigid to Flexible)

Shall be free from delamination, crazing & haloing.

However, visual imperfections inherent to the fabrication
Transition Zone technique i.e. adhesive squeeze-out, localized deformation
of di-electric & conductors (non-functional), & protruding
di-electric material shall be accepted.

Strain Relief Fillet length (Horizontal,

1.0mm to 2.5mm from the rigid to flex interface
along the flex)

3.0 Dimensional Characteristics

Board Overall (End to End) ± 0.2 mm

Dimension
tolerance Flex Portion + 0.4 mm, - 0 mm

Board Rigid Portion ±10 % or ±0.15mm, whichever is minimum (Metal to

Thickness Metal)
tolerance
Flex Portion
± 20 % (Including Cover-layer)

Conductor Pattern width ± 10 %

Tolerance Spacing ± 10 %

±0.05mm up to 1mm dia

Tolerance on diameter of PTH
+0.10/-0.05mm beyond 1mm dia

PTH Pad Diameter Specified ± 0.1 mm

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 Annexure-A

Sr.
Parameters Requirements
No.

4.0 Land Pattern & Plated Through Hole (PTH) Requirements

Basic 11/25/56µm respectively for 17/35/70 µm of as

Rigid Portion
Copper designed base copper
Thickness
(minimum) Flex Portion 31 µm

Basic copper thickness in internal 11/25/56µm respectively for 17/35/70 µm of as

layer (Rigid Portion) designed base copper

Conductor Under cut ≤ Total Cu thickness

Conductor Overhang Nil

Insulation thickness between two 70 µm (min.)

consecutive layers of Rigid Portion

13 microns (preferred)
Etch back (positive) However, Good desmearing ensuring 100% connectivity of
PTH barrel with inner layers.

5 microns
Negative etch back
(max.)

< 0.1 mm preferred, 0.25 mm max., with minimum annular

Layer to layer Registration
ring criteria of pads meeting at all locations

Internal Annular Ring 0.05 mm (minimum)

External Annular Ring for PTH 0.125 mm (minimum)

External Annular Ring for NPTH 0.250 mm (minimum)

Drill hole perpendicularity 90° ± 5°

Drilling irregularity 0.080 mm (max.)

Lifted Lands (As received) Nil

Resin smear Nil

0.080 mm in width or 20% of total base material thickness

Resin recession in cumulative length as applicable

Laminate void 0.080 mm max. in any direction

Max. 3 nos. with combined length < 5% of wall length &

combined area < 10% of total wall area; no circumferential
No. of plating voids in PTH wall
void; none at interconnection: none in same plane on
opposite sides of a hole

Nodules in PTH wall or solder coating The nodule shall not reduce specified hole diameter

6
 Annexure-A

Sr.
Parameters Requirements
No.

Nail heading < 1.5 times the internal layer cu thickness

Plating along the fiber 80 μm maximum

PTH wall crack, separation of PTH Nil

wall with internal layers

5.0 Plating/Coating Requirements

A Electrolytic Copper Plating

Minimum purity 99.5 %

Tensile Strength 276MPa

Elongation 18%

Cu Thickness on Surface Pattern 25 to 45 μm

Cu Thickness in PTH 25 to 45 μm

B Tin lead plating after HASL

Tin content of alloy Sn60/Pb40 meeting QQ-S-571

Thickness of surface 8 to 30 μm

Thickness of PTH 8 to 30 μm

At PTH Knee ≥ 1 µm

6.0 Mechanical Characteristics

(a) ≤ 1% (In-general)
Warp & Twist (b) ≤ 0.75 % (for boards having land patterns of grid
array devices like BGA & CCGA)
Conductor adhesion/Peel Strength
≥ 12 N/cm or as specified in the laminate datasheet
(minimum)

Resistance to bending cycles/Flexible

Endurance (when tested in accordance ≥ 250 cycles for static application
with method 2.4.3 or 2.4.3.1 of IPC- (With a mandrel Diameter of 10mm)
TM-650)

Bending test for rigid flex board (when

tested in accordance with method ≥ 25 cycles
given in MIL-PRF-31032/4B para no. (With a mandrel Diameter of 10mm)
A.3.7.4.7)

7.0 Electrical Characteristics

Intra layer ≥ 104 MΩ

Insulation resistance
Interlayer ≥ 105 MΩ

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 Annexure-A

Sr.
Parameters Requirements
No.

Withstanding voltage for (intra & inter

layers) per mm spacing between 1500 Vrms
conductors

8
Annexure-B

Annexure-B: General Terms and Conditions

1 PO Execution Procedure
a) In bidding phase, no CAD/CAM details will be provided to vendor and vendor has to
quote based on PCB design specifications and quantity mentioned in this document only.
After PO placement, the necessary data related to PCB fabrication will be provided to the
vendor through electronic media.
b) All the deliverables (which includes finished product, inspection reports, invoices etc.)
and input material will be delivered to SAC, Ahmedabad.
c) Invoices along with covering letter certifying the work carried out under those invoices
will be forwarded to SAC Accounts for payment to the Vendor. Copy of above will also
be forwarded to SAC Purchase.

2 Applicable Documents
• The ISRO Technical Standard for Manufacture, Procurement and Qualification of Printed
Circuit Boards, SAC-PCB-06, Issue – 1
• ISRO-PAX-304, any updates thereof.

3 PCB Specifications
Fabricated PCB shall meet the following specifications:
1. PCB Design Specifications: As per the fabrication data (Gerber, Drill, Stackup etc.)
provided to the vendor.
2. PCB Quality Specifications: As per the relevant specification requirements laid-down in
Annexure-A.

4 SAC Responsibilities
All required fabrication details will be submitted to the vendor after placement of PO through
electronic media. Following fabrication data will be provided:
i. Extended Gerber format (RS-274X, Gerber X2) for each layer, ODB++, IPC-2581 etc.
ii. Excellon-2 format for drills (PTH, NPTH, blind, buried and Microvias) and routing
(outline and cutouts) with drill tool table.
iii. PCB stackup with base material and impedance details, if required.
iv. PCB mechanical drawing in PDF or DXF format
v. Any other relevant details required for PCB fabrication

5 Vendor Responsibilities
Following are the vendor’s responsibilities:
a) Vendor should acknowledge receipt of order.
b) Vendor shall check submitted Gerber files, carryout DFM checks, accept data within
two working days, and provide the feedback to SAC/ISRO for its acceptance. The final
acceptance of data shall be mandatorily communicated to SAC.
c) In case of any query, proper feedback shall be provided to SAC/ISRO.
d) Based on the final acceptance of data, vendor shall ensure the delivery of PCBs as per
delivery schedule (section 9 of Annexure B).
e) Procurement and proper storage of laminate(s) and other raw-materials/chemicals
needed to fabricate the PCBs

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Annexure-B

6 Handling, Packaging, Storage & Transportation of Final PCB

As per standard guidelines for High-Rel products, refer to ISRO-PAX-304 guidelines.

7 PCB Acceptance Test and Required Reports

For acceptance of delivered PCBs at SAC, vendors must comply/provide the following:
Basic Acceptance Testing for PCB Delivery
For acceptable deliverables, vendors have to carry out following basic tests at their end and
submit the relevant reports along with the fabricated PCBs:
A. BBT Test report for each PCB with 100% net coverage
B. Visual inspection report for all individual PCBs
C. Impedance test report for each PCB/panel along with impedance coupons (if
impedance required)
Only visual inspection and the dimensional measurement shall be done as per relevant
sections of ISRO-RAX-304 (latest version).
Batch Acceptance
Complete PCB inspection, testing and acceptance related procedures to be followed by the
vendor as per the applicable documents under section 2 and all relevant and necessary reports
have to be submitted along with the deliverables.
A. PCB Acceptance Test Procedure at Vendor’s End
1) Mechanical Inspection/Evaluation: Mechanical evaluation tests shall be
carried out with respect to defined specifications and report shall be submitted in
the given format (refer to ISRO standards as per section 2).
2) Final PCB Inspection Report: Final PCB inspection remarks shall be filled in the
given format.
3) Batch testing for Space grade PCBs shall be conducted for each panel of the batch
as per the reference documents and submit the reports along with the PCBs
4) Typical Non Conformance Control Format
5) Typical Route Card Format: While processing the production batch all the
events shall be recorded in the Route Card for each card type.
B. PCB Acceptance Test Procedure at SAC/ISRO: Will be carried out as per ISRO
guidelines. SAC/ISRO will be the final authority for acceptance of the PCBs.

8 PCB Rejection
Non-conformance of PCB quality with reference to Annexure-A, if any, will cause rejection of
the PCBs. Rejected PCB batch shall be re-fabricated by the vendor without any extra cost
and to be supplied as per schedule mentioned in section 9, after receiving information
regarding PCB rejection from SAC/ISRO. LD clause will be applicable in this case.

9 Delivery Schedule
The delivery date commences from the date of receipt of acceptable inputs from SAC. The
finished PCBs shall be delivered at SAC/ISRO, Ahmedabad in 28 working days.

10 Deliverable
Based on PO, vendor shall deliver following items F.O.R. at SAC/ISRO, Ahmedabad:
1. Finished bare PCBs.
2. Reports of tests listed as part of batch acceptance testing in reference documents
under section 2.

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Annexure-B

3. One set of remaining test coupons (1 vertical and 1 horizontal) and Impedance
coupon (If applicable) per panel for all the processed panels of a batch.
4. Two nos. of flex coupons with the following configurations:
a. One should be with identical build up configuration i.e. with 2 leafs
b. Another should be with single-leaf
5. Molds of Micro-sectioning samples tested at Vendor’s end.
6. Detailed Route Card and Approved Layer Stack-up (with impedance details).
7. Certificate of Compliance for all Laminates & Pre-preg.
8. Non-conformance report if any.

11 Vendor Eligibility Criteria

1. Vendor must be based in India. Representatives, agents of foreign-based fabricators
are not allowed to bid.
2. Only SAC/ISRO certified vendors shall quote.
3. Vendor must maintain inventory of all base materials required to execute this
contract.

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Annexure-C

Annexure-C: Vendor’s Compliance Table

S. No. Compliance to all points mentioned in Complied
1 PCB Design Specifications Yes/No
2 Annexure A: Generic PCB Quality Specifications Yes/No
3 Annexure B: Generic Terms and Conditions Yes/No
4 Delivery Schedule Yes/No

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