(19)
*EP003591692A1*
(11) EP 3 591 692 A1
(12) EUROPEAN PATENT APPLICATION
(43) Date of publication: (51) Int Cl.:
08.01.2020 Bulletin 2020/02 H01L 21/48 (2006.01) H05K 7/20 (2006.01)
F28F 3/12 (2006.01) F28F 3/04 (2006.01)
(21) Application number: 19191529.7
(22) Date of filing: 27.09.2011
(84) Designated Contracting States: • Hilton, Leonard
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB Morristown, NJ 07962-2245 (US)
GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO • Gu, Yuandong
PL PT RO RS SE SI SK SM TR Morristown, NJ 07962-2245 (US)
• Park, Jong
(30) Priority: 29.11.2010 US 955449 Morristown, NJ 07962-2245 (US)
(62) Document number(s) of the earlier application(s) in (74) Representative: Boult Wade Tennant LLP
accordance with Art. 76 EPC: Salisbury Square House
11182997.4 / 2 458 625 8 Salisbury Square
London EC4Y 8AP (GB)
(71) Applicant: Honeywell International Inc.
Morris Plains, NJ 07950 (US) Remarks:
This application was filed on 13-08-2019 as a
(72) Inventors: divisional application to the application mentioned
• Yang, Wei under INID code 62.
Morristown, NJ 07962-2245 (US)
(54) FIN FABRICATION PROCESS FOR ENTRAINMENT HEAT SINK
(57) A process to fabricate a fin for a heat sink in- of the substrate. The process further includes placing the
cludes creating an array of micro diameter holes on a substrate onto a plate. The plate includes micro air chan-
substrate, and then coupling the substrate to a mold. The nels such that the micro air channels are in communica-
mold includes angular dimples such that one or more of tion with the micro diameter holes. In another embodi-
the micro diameter holes on the substrate come into con- ment, two pieces of substrate, each with micro diameter
tact with the angular dimples in the mold, thereby forming holes and embossed micro air channels are coupled to-
an angle between the micro diameter holes and a surface gether to form a fin.
EP 3 591 692 A1
Printed by Jouve, 75001 PARIS (FR)
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Description can be formed at the interface between the metal foil and
the metal plate. In another embodiment, two layers of
Technical Field metal foil may be laminated together. Micro air channels
are embossed on each of the metal foil layers.
[0001] The present disclosure relates to a fin fabrica- 5 [0005] FIG. 1 illustrates an example embodiment of
tion process for an entrainment heat sink. such a heat sink and fin combination. The heat sink 100
includes a metal plate 110 that includes micro air chan-
Background nels 120. A metal foil 130 is placed on the metal plate
110. The metal foil 130 includes angular dimples 140 that
[0002] In densely packed electronic systems, heat dis- 10 include on their angular faces air nozzles 150. FIG. 2 is
sipation is a big challenge due to space constraints that a side view of such a heat sink and fin combination 100,
preclude convective thermal solutions involving blowers and illustrates that micro air channels can be positioned
or fans in proximity to the heat sources. For example, on both sides of the metal plate 110 and that a metal foil
avionics systems with densely packed printed board as- 130 can be placed on both sides of the metal plate 110.
semblies (PBA), in which conventional onboard 15 FIG. 3 is a side view of another embodiment that includes
fans/blowers are too bulky to be placed, typically rely on two layers of metal foil 130 laminated to each other, with
conductive heat sinks made of solid metal plates. How- micro air channels 120 embossed on each layer and in
ever, these solid metal plates are heavy and have limited communication with one or more angular dimples 140
performance capability. with air nozzles 150.
20 [0006] The fabrication process starts by creating micro
Brief Description of the Drawings diameter holes on a metal foil using for example chemical
etching, a laser, or electric discharge machining (EDM).
[0003] In an embodiment, the metal foil is a copper foil. The
copper foil has high thermal conductivity and is amenable
FIG. 1 is a perspective view an example embodiment 25 to continuous variation of the jet angle. Other drilling
of a heat sink including fabricated fins on a metal methods such as sandblasting, the use of ultrasonic
plate. waves, a water jet, or micro milling/drilling machines can
FIG. 2 is a side view of another example embodiment be used as well. The EDM method is generally preferred
of a heat sink including fabricated fins on two sides because of better precision and uniformity. These holes
of a metal plate. 30 form the micro nozzles without specified orientations.
FIG. 3 is a side view of another example embodiment The holes are approximately 20 -50 micrometers in di-
of a heat sink including two fabricated fins coupled ameter. The nozzle orientation is created after the EDM
together. drilling by stamping trapezoidal dimples in a mold. In an
FIG. 4 is a flowchart of an example process to man- embodiment, the mold is a steel mold. In the stamping
ufacture a heat sink. 35 process the EDM hole is placed on the slanted side walls
FIGS. 5A and 5B are a flowchart of another example of the dimple, creating an angle from the fin base. Dimple
process to manufacture a heat sink. side walls are slanted from 5 to 30 degrees from the ver-
tical (or 60 to 85 degrees from the fin surface) in different
Detailed Description sets of molds, thus giving various jet angles (polar). This
40 method also allows azimuth control and allows continu-
[0004] This disclosure describes a method to fabricate ous variation of the jet angles.
fins for heat sinks, and in an embodiment, entrainment [0007] The metal foil that contains the micro nozzles
heat sinks. An entrainment heat sink is driven by com- can be laminated to a metal plate or another foil with
pressed air, can be made in extremely low-profile, and similar micro nozzles. Micro-air channels, for the purpose
thus is able to bring convective cooling to tight spaces 45 of delivering compressed air, are formed at the interface
previously only addressable by conductive cooling meth- of the lamination by, for example, machining, forming,
ods. The fins for the entrainment heat sink differ from embossing, or chemical etching trenches on the metal
conventional extruded structures in that they must con- plate or the foil, and forming enclosed channels after lam-
tain micro air flow channels and nozzles that direct air ination.
jets predominately parallel to the fin surface and in the 50 [0008] This fin fabrication process can be used to make
direction of the desired bulk air flow. The micro nozzles entrainment heat sinks that have numerous application
are connected via micro air channels that facilitate com- opportunities in high performance thermal management
pressed air delivery. In an embodiment, the micro noz- systems. Because such fins enable extremely low profile
zles are fabricated on a substrate such as a metal foil heat sinks, it is particularly suitable for space-constrained
and may be laminated on a plate, such as a metal plate, 55 applications such as avionic systems with densely
to form a fin. Other materials that can be used alone or packed printed board assemblies (PBA) wherein conven-
in combination include various metals, graphite, ceram- tional onboard fan/blowers are too bulky to fit.
ics, polymers, and composites. The micro air channels [0009] In an embodiment, the copper foil after the dim-
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ple/nozzle formation is laminated onto a copper core to the mold such that one or more holes on the second
which is about 0.5 mm thick and contains air channels metal foil come into contact with the angular dimples in
that are in fluidic connection with the nozzle arrays. The the mold. As with the first metal foil, this contact forms
fins may have nozzles on one side or both sides of the an angle between the holes of the second metal foil and
core. The fins can be fabricated in standard 1" x 4" format 5 a surface of the second metal foil. At 525, micro air chan-
and cut into various lengths according to specific heat nels are embossed onto the first metal foil. The micro air
sink designs. channels in the first metal foil are in communication with
[0010] FIGS. 4 and 5 are flowcharts of example proc- the micro diameter holes in the first metal foil. Similarly,
esses 400 and 500 for forming fins for an entrainment at 530, micro air channels are embossed onto the second
heat sink. FIGS. 4 and 5 include a number of process 10 metal foil. The micro air channels in the second metal foil
blocks 405 - 465 and 505 - 570 respectively. Though are in communication with the micro diameter holes in
arranged serially in the examples of FIGS. 4 and 5, other the second metal foil. At 535, the first metal foil and sec-
examples may reorder the blocks, omit one or more ond metal foil are laminated together.
blocks, and/or execute two or more blocks in parallel us- [0014] At 540, the micro diameter holes of the first met-
ing multiple processors or a single processor organized 15 al foil are in communication with the micro diameter holes
as two or more virtual machines or sub-processors. of the second metal foil. At 545, the micro diameter holes
Moreover, still other examples can implement the blocks comprise a diameter of approximately 20 - 50 microme-
as one or more specific interconnected hardware or in- ters. At 550, the array of micro diameter holes is created
tegrated circuit modules with related control and data sig- using one or more of a laser, electric discharge machin-
nals communicated between and through the modules. 20 ing, sandblasting, an ultrasonic wave, a water jet, and a
Thus, any process flow is applicable to software, micro milling machine. At 555, the angular dimples com-
firmware, hardware, and hybrid implementations. prise trapezoidal dimples. At 560, the micro diameter
[0011] Referring to FIG. 4, at 405, an array of micro holes of the first metal foil and the micro diameter holes
diameter holes is created on a metal foil. At 410, the metal of the second metal foil form angles ranging from 60 to
foil is coupled to a mold. The mold includes angular dim- 25 85 degrees from a surface of the first meta foil and the
ples such that one or more of the micro diameter holes second metal foil. At 565, the first metal foil and/or the
on the metal foil come into contact with the angular dim- second metal foil comprise a copper foil. At 570, the an-
ples in the mold. This stamping of the metal foil with the gular dimples are stamped into the steel mold.
mold forms an angle between the micro diameter holes [0015] It should be understood that there exist imple-
and a surface of the metal foil. At 415, the metal foil is 30 mentations of other variations and modifications of the
placed onto a metal plate. The metal plate includes micro invention and its various aspects, as may be readily ap-
air channels, and the micro air channels are in commu- parent, for example, to those of ordinary skill in the art,
nication with the micro diameter holes. and that the invention is not limited by specific embodi-
[0012] At 420, the micro diameter holes comprise a ments described herein. Features and embodiments de-
diameter of approximately 20 - 50 micrometers. At 425, 35 scribed above may be combined with each other in dif-
the array of micro diameter holes is created using one or ferent combinations. It is therefore contemplated to cover
more of a laser, electric discharge machining, sandblast- any and all modifications, variations, combinations or
ing, an ultrasonic wave, a water jet, and a micro milling equivalents that fall within the scope of the present in-
machine. At 430, the angular dimples comprise trapezoi- vention.
dal dimples. At 435, the one or more micro diameter holes 40 [0016] The Abstract is provided to comply with 37
form an angle ranging from 60 to 85 degrees from a sur- C.F.R. § 1.72(b) and will allow the reader to quickly as-
face of the metal foil. At 440, the metal foil comprises a certain the nature and gist of the technical disclosure. It
copper foil, at 445, the metal plate comprises a copper is submitted with the understanding that it will not be used
plate, and at 450, the metal plate is approximately 0.5 to interpret or limit the scope or meaning of the claims.
mm thick. At 455, the micro air channels are positioned 45
on a top side and a bottom side of the metal plate. At
460, the metal foil is placed on the top side and the bottom Claims
side of the metal plate. At 465, the angular dimples are
stamped into the mold. 1. A process comprising:
[0013] Referring to FIG. 5, at 505, an array of micro 50
diameter holes is created on a first metal foil, and at 510, creating an array of micro diameter holes on a
an array of micro diameter holes is created on a second substrate (405);
metal foil. At 515, the first metal foil is coupled to a mold. coupling the substrate to a mold, the mold com-
The mold includes angular dimples such that one or more prising angular dimples such that one or more
holes on the first metal foil come into contact with the 55 of the micro diameter holes on the substrate
angular dimples in the mold. This contact forms an angle come into contact with the angular dimples in
between the holes on the first metal foil and a surface of the mold, thereby forming an angle between the
the first metal foil. At 520, the second metal foil is coupled micro diameter holes and a surface of the sub-
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strate; and (410) micrometers. (545)
placing the substrate onto a plate, the plate com-
prising micro air channels such that the micro 8. The process of claim 5, wherein the micro diameter
air channels are in communication with the micro holes of the first substrate and the micro diameter
diameter holes. (415) 5 holes of the second substrate form angles ranging
from 60 to 85 degrees from a surface of the first sub-
2. The process of claim 1, comprising creating the array strate and the second substrate. (560)
of micro diameter holes using one or more of a laser,
electric discharge machining, sandblasting, an ultra- 9. An apparatus comprising:
sonic wave, a water jet, chemical etching, and a mi- 10
cro milling machine. (425) a plate (110) comprising a micro air channel
(120); and
3. The process of claim 1, wherein the angular dimples a substrate (130) comprising a dimple (140), the
comprise trapezoidal dimples. (430) dimple comprising a surface that is between 5
15 and 30 degrees from normal to the substrate,
4. The process of claim 1, wherein the micro air chan- the dimple comprising a micro diameter hole on
nels are positioned on a top side and a bottom side the surface;
of the plate; and comprising placing the substrate on wherein the substrate is coupled to the plate
the top side and the bottom side of the plate. (460) such that the micro air channel is in communi-
20 cation with the micro diameter hole.
5. A process comprising:
10. An apparatus comprising:
creating an array of micro diameter holes on a
first substrate; (505) a first substrate (130) comprising a first angular
creating an array of micro diameter holes on a 25 dimple (140), a first micro diameter hole (150),
second substrate; (510) and a first micro air channel (120), wherein the
coupling the first substrate to a mold comprising first angular dimple comprises a surface that
angular dimples such that one or more holes on forms an angle of between 5 and 30 degrees
the first substrate come into contact with the an- from a normal to the surface, wherein the first
gular dimples in the mold, thereby forming an 30 micro diameter hole is on the surface of the first
angle between the holes on the first substrate angular dimple, and wherein the first micro di-
and a surface of the first substrate; (515) ameter hole is in communication with the first
coupling the second substrate to the mold com- micro air channel;
prising angular dimples such that one or more a second substrate (130) comprising a second
holes on the second substrate come into contact 35 angular dimple (140), a second micro diameter
with the angular dimples in the mold, thereby hole (150), and a second micro air channel
forming an angle between the holes of the sec- (120), wherein the second angular dimple com-
ond substrate and a surface of the second sub- prises a surface that forms an angle of between
strate; (520) 5 and 30 degrees from a normal to the surface,
embossing micro air channels in the first sub- 40 wherein the second micro diameter hole is on
strate, wherein the micro air channels in the first the surface of the second angular dimple, and
substrate are in communication with the micro wherein the second micro diameter hole is in
diameter holes in the first substrate; (525) communication with the second micro air chan-
embossing micro air channels in the second nel;
substrate, wherein the micro air channels in the 45 wherein the first substrate is laminated to the
second substrate are in communication with the second substrate (130, 130).
micro diameter holes in the second substrate;
and (530)
coupling the first substrate to the second sub-
strate. (535) 50
6. The process of claim 5, wherein the micro diameter
holes of the first substrate are in communication with
the micro diameter holes of the second substrate.
(540) 55
7. The process of claim 5, wherein the micro diameter
holes comprise a diameter of approximately 20 - 50
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