US 20040114327A1

(19) United States

(12) Patent Application Publication (10) Pub. No.: US 2004/0114327 A1
Sri-Jayantha et al. (43) Pub. Date: Jun. 17, 2004
(54) ACTIVE HEAT SINK FOR HIGH POWER (21) Appl. No.: 10/318,700
MICROPROCESSORS
(22) Filed: Dec. 13, 2002
(75) Inventors: Sri M. Sri-Jayantha, Ossining, NY
(US); Gerard MoVicker, Stormville, Publication Classification
NY (US); Vijayeshwar Das Khanna,
Millwood, NY (US) (51) Int. Cl." ....................................................... H05K 7/20
(52) U.S. Cl. ............................................ 361/695; 361/719
Correspondence Address:
Michael J. Buchenhorner Esq., PA. (57) ABSTRACT
1430 Sorolla Avenue A cooling apparatus for cooling a heat Source Such as a
Coral Gables, FL 33134 (US) microprocessor, comprising a mobile heat Sink placed in
close proximity to the heat Source; and a thermal conductor
(73) Assignee: International Business Machines Cor- for conducting heat generated by the heat Source to the
poration, Armonk, NY mobile heat sink.

Proposed Active Heat Sink

2O6 C 2 204

^ Rotating
Shaft
214
200
St. 208
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US 2004/0114327 A1 Jun. 17, 2004

ACTIVE HEAT SINK FOR HIGH POWER increased thermal efficiency (i.e., reduced thermal resistance
MICROPROCESSORS or increased thermal conductivity) is obtained. Fan heat
Sinks (a heat sink with integrated fan) have been used to
FIELD OF THE INVENTION address the greater cooling needs of today's microproces
Sors, and in Some cases they provide the only viable Solution.
0001. The invention disclosed broadly relates to the field An example of this would be the cooling of embedded
of cooling devices for electronic components, and more personal computers (PCs) in hazardous industrial locations
particularly relates to the field of heat Sinks for micropro where particles or corrosive fumes occupy the same envi
CCSSOS.
ronment as the PC. Sealing the chassis is the best way to
ensure long life. Fan heat SinkS can cool Sensitive chips in
BACKGROUND OF THE INVENTION this Sealed environment, offering a Solution where tradi
0002. During the normal operation of a computer, inte tional methods fail. Some low-end personal computers
grated circuit devices generate significant amounts of heat. (PCs) use fan heat sinks in place of a system fan. This
This heat must be continuously removed, or the integrated Solution lowers the Overall cost and provides a quieter
circuit device may overheat, resulting in damage to the System. Since office noise level requirements are stricter in
device and/or a reduction in operating performance. Cooling Europe, many PCs made for the European market use fan
devices, Such as heat Sinks, have been used in conjunction heat SinkS Specifically to lower the noise level
with integrated circuit devices in order to avoid Such over 0007 An integrated fan improves the performance of any
heating. Generally, a passive heat Sink in combination with heat sink by about 50 to 100%. The directional airflow
a System fan has provided a relatively cost-effective cooling provided by the fan ensures more efficient heat transfer from
Solution. In recent years, however, the power of integrated the fins 102 to the ambient air. When fan heat sinks are
circuit devices Such as microprocessors has increased expo engineered into the System they can provide many years of
nentially, resulting in a significant increase in the amount of uninterrupted service.--From “Fan Heat Sinks for High
heat generated by these devices, thereby necessitating a Performance Socket ICs” by Chris Chapman, Vivek Mahns
more efficient cooling Solution. ingh and Prabhu Sathyamurthy, 2002. However, as func
0.003 Heat sinks operate by conducting heat from the tionality and processor Speed increase, conventional fan heat
processor to the heat Sink and then radiating it into the air. SinkS will no longer be able to Supply the total cooling for
Systems, requiring alternative cooling Strategies.
The better the transfer of heat between the two surfaces (the
processor and the heat Sink metal) the better the cooling. 0008. The effectiveness or heat transfer capability of a
Some processors come with heat sinks glued to them heat sink is a function of its Surface area, the temperature
directly, or are interfaced through a thin and Soft layer of difference between the heat sink and the fluid (air) moving
thermal grease, ensuring a good transfer of heat between the past the heat Sink, and a heat transfer coefficient h. The heat
processor and the heat Sink. transfer coefficient h. in turn depends upon Such factors as
the geometry of the fluid flow and its velocity past the heat
0004 FIG. 1 shows a conventional heat sink assembly Sink Surfaces. The equivalent thermal resistance of an air
100 attached to a microprocessor. This conventional heat flow-based cooling System is governed by three factors:
sink 100 would most commonly be used in conjunction with
a separate fan unit. Directional airflow provided by the fan 0009 1. heat resistance of the heat sink (this is
ensures efficient heat transfer from the fins (102) of the heat determined by the material and the effective distance
sink 100 to the ambient air. Thermal grease 104 is used as to the heat Source);
a conductive Substance to transfer heat from the processor 0010 2. effective surface area exposed to convec
die (chip) 110 to the heat spreader 106 and onto the heat sink tion airflow; and
fins 102. The thermal grease 104 helps bond the two surfaces 0011 3. rate of airflow over heat transfer area.
and transfer the heat more effectively. The processor die 0012 Current heat sinks address the cooling needs of
(chip) 110 is secured to the ceramic base 112 using a die today's microprocessors, but in order to address the increas
attach method incorporating solder balls 120. ingly complex and expensive cooling needs of the next
0005. An enhancement on the above structure is some generation microprocessors, there is a need for a thermal
times achieved by adding a fan (not shown) that blows cooling System which can overcome the shortcomings of the
cooling air at the chip package. Such a conventional fan heat prior art by providing Superior cooling efficiency in a
sink assembly suffers from two types of inefficiencies. First, compact form factor.
the airflow generated by the fan blades diffuses into the open SUMMARY OF THE INVENTION
Space and only a portion of the airflow impinges on the fins
102 of the heat sink 100. Even with proper shrouding, added 0013 Briefly, according to the invention, a cooling appa
to direct the airflow over the fins of a heat sink, the fins ratus (Active Heat Sink) for cooling a heat Source Such as a
located downstream from the airflow See leSS Vigorous microprocessor, comprises a mobile heat Sink placed in
thermal interaction with the impinging air due to the decel close proximity to the heat Source; and a thermal conductor
eration of the airflow and the build up of a boundary layer. for conducting heat generated by the heat Source to the
Second, as processing power continues to increase, the mobile heat sink. The mobile heat sink provides the dual
combined mass/volume of the fan-heat Sink System needs to functionality of the heat dissipation Surface (e.g. fins) and
grow in Scale accordingly, thus making the fan-heat Sink the airflow generator (e.g. fan) of the prior art.
configuration less competitive in a size-driven market. BRIEF DESCRIPTION OF THE DRAWINGS
0006 By integrating a fan with a passive heat sink 0014 FIG. 1 is an illustration of a conventional heat sink,
module, a heat Sink configuration of Smaller Size and according to the known art.
US 2004/0114327 A1 Jun. 17, 2004

0.015 FIG. 2 is an illustration of an active heat sink, 0026 Apparatus 200 also comprises a substrate or base
according to an embodiment of the present invention. 212 on which the die 208 is mounted and connected by
0016 FIG. 3 shows is an oblique view of an active heat means of solder connections 214. The fan base housing 202
Sink. is mounted on the base 212 by a mechanical attachment.
According to the preferred embodiment, a thin film of fluid
0017 FIG. 4 shows an exploded view of the components 210 is introduced between the housing 202 and the shaft 206
in an active heat Sink. for assisting the flow of heat from the stationary housing 202
0.018 FIG. 5 shows a top view of an active heat sink. to the rotating shaft 206 and onto the fan blades 204. This
fluid 210 is introduced during assembly of the heat sink 200
0.019 FIG. 6 shows a cross-section view of an active heat and is preferably a Synthetic or mineral oil having high
Sink, according to an embodiment of the invention. thermal capacity and/or high heat conductivity properties
which will not degrade as a result of exposure to high
0020 FIG. 7 shows a cross-section view of a ball bearing temperatures. Water, for example, would not be a good
motor with fluid heat coupling and a rotating shaft, accord choice because water will boil and evaporate when exposed
ing to a further embodiment of the invention. to high heat, thus necessitating replacement of the fluid. The
0021 FIG. 8 shows a cross-section view of a ball bearing fluid film gap in the heat Sink is made as thin as practically
motor with fluid heat coupling and a Stationary Shaft, accord possible.
ing to a still further embodiment of the invention. 0027. By positioning the fluid film 210 between the
DESCRIPTION OF THE PREFERRED
Stationary and moving members a minimum heat resistant
EMBODIMENTS
configuration is developed. The rotation of the shaft 206
causes the fluid 210 to circulate around in its channel; this
0022. It is an advantage of this invention, henceforth in turn augments transfer of heat to the moving shaft 206 and
referred to as an active heat Sink, to provide a more efficient blades 204. The fluid 210 is self-retained within the volume
microprocessor cooling System by transferring heat to a provided for it by virtue of its surface tension at the interface
mobile heat Sink, in particular by dissipating the heat into the where it comes into contact with ambient air. Optionally, a
rotating portions of a fan Such as the Shaft and the fan blades. conventional Sealing method could be employed to further
The drawings described here will serve to illustrate this and contain the fluid 210.
other further uses and advantages of the instant invention. 0028. In one of the preferred embodiments, the thin fluid
0023 Referring to FIG. 2, there is shown a diagram of a layer is preferably 3-10 micrometers (um) in thickness. This
cooling apparatus 200 for a heat Source Such as a micro allows the same fluid to act as a fluid dynamic bearing
processor die 208. This cooling apparatus 200 comprises a (FDB) system and provide the load carrying function for the
mobile heat Sink. The mobile heat Sink comprises a rotating mobile portion of the heat Sink. The load carrying capacity
metallic fan, composed of fan blades 204 and a rotating shaft is conventionally achieved by means of “grooves” or “chan
206, which takes the place of the fins 102 of the conventional nels' etched, Stamped or deposited on either the Stationary
heat Sink 100 shown in FIG. 1. The bottom end of the or the moving portion of the fluid cavity. The grooves
rotating Shaft 206 is placed in close proximity to the pro generate the necessary build up of hydrodynamic pressure to
cessor die, or chip, 208 so that heat generated by the die 208 Support the weight of the mobile portion of the heat Sink.
can effectively flow into the shaft 206 for transport to the 0029. In this embodiment, the fluid 210 is said to be
blades 204. Ideally, the shaft 206 is located above the die Self-circulating, or “Self-pumping,” meaning that the fluid
208 in a location that is as close to the die 208 as possible 210 will continuously distribute itself throughout the chan
without interfering with the rotational properties of the shaft nel thereby covering a greater Surface area. The rotation of
206.
the shaft 206 will agitate the fluid film 210 and disperse it
0024. The fan blades 204 provide airflow in an axial-in, throughout its channel. This fluid distribution can be further
radial-out pattern. This pattern is appropriate for a notebook optimized by etching grooves or adding geometries onto the
computer configuration or other Such configuration where a Surface of the shaft 206 to increase its Surface roughness.
compact form factor would be required. In other applications This surface roughness, combined with the movement of the
where profile height is not critical, the airflow can be rotating shaft 206, optimizes the fluid circulation. The
axial-in, axial-out. Profile height is an important consider amount of fluid circulation is optimized and traded-off with
ation because the heat sink 200 must have Sufficient clear the mechanical torque generation needed. Clearly the more
ance above it in order to perform to Specification. vigorously and extensively the fluid flows within its con
tained volume the better the thermal efficiency, but the
0025. In the preferred embodiment, the fan blades 204 penalty is the electrical power needed to rotate or move the
comprise a geometry and rotation pattern Such that the mobile portion of the heat sink.
airflow is directed away from the die 208 so that the heat
flowing from the die 208 through the shaft 206 and into the 0030. In this embodiment, the fluid film 210 serves three
fan blades 204 is dissipated into the environment surround purposes: 1) it acts as a Superior heat transfer interface Since
ing the cooling apparatus 200. The fan blades 204 and shaft circulating fluid effectively enlarges the high temperature
206 must be constructed from a material with a high rate of Surface of the processor die; 2) it provides rotational Support
thermal conduction, Such as copper or aluminum. In addi for the fan unit; and 3) it provides lubrication for the rotating
tion, the fan blades 204 should have a rough Surface area as shaft 206 of the fan thereby eliminating metal-to-metal
opposed to the Smooth Surface area of conventional fan friction. This lack of metal-to-metal friction means that the
blades. The reason for this will be discussed later with unit can withstand higher rotational Speeds and will increase
reference to FIG. 5. the product life. In addition, by positioning the fluid film 210
US 2004/0114327 A1 Jun. 17, 2004

in close proximity, as low as 100 um, to the heat generating corresponds to an axial-in, radial-out airflow pattern, as
source, (in this case the processor die 208) the distance from discussed earlier. Beginning from the top, the components
the heat source 208 to the airflow region (the fan blades 204) are: the fan 302, a steel flux 20 ring 402, a magnet 404, stator
can be minimized, thus increasing the thermal conductivity assembly 406, base housing 202, rotating shaft 206, thrust
from the heat Source to the ambient air cap 211, and a circuit board 212 on which is disposed a
0031. The proximity of the liquid to the heat source is processor receptacle 304, Supporting a processor die (chip)
governed by the thickness of a thrust cap 211 (explained 208. The function of the thrust cap 211 is to contain the fluid
later) needed to contain the fluid. The thickness of the thrust 210 next to the bottom flange of a rotating shaft 206. In one
cap 211 can be further reduced by choosing an eSoteric embodiment, the flange element provides the thrust resis
material that has both Strength and thermal conductivity. tance necessary to counter-balance the weight of the fan 302
Natural diamond crystal appears to be the most Superior assembly, for instance. Therefore the thrust cap 211 should
material for this function even though the cost can be not only keep the fluid 210 trapped within the FDB without
prohibitive for most commercial embodiments. However, it any leakage, but it should also be able to withstand the fluid
allows the heat to be transferred to the liquid film 210 from preSSure due to the thrust generated, in this case by the
rotation of the shaft.
the surface of the processor die 208 through a maximally
efficient medium. Alternatively, a copper thrust cap 211 with 0036 FIG. 5 shows a top view of the active heat sink 200
a novel coating of wear resistant material may be the more without the circuit board 212. In this diagram you can get a
economical choice. better view of the blade geometry of the fan 302, showing
0032 Referring now to FIG. 3 we see an oblique view the axial-in, radial-out airflow pattern discussed earlier. AS
300 of the active heat sink 200 showing the fan 302, the base shown, the fan 302 is situated on the base housing 202 which
housing 202, a processor receptacle 304 and a circuit board in turn is housed on the processor receptacle 304.
212. The fan 302 shows the blade geometry corresponding 0037 FIG. 6 shows a cross section view of an active heat
to an axial-in, radial-out airflow pattern. An objective would sink 600 that incorporates a motor with fluid dynamic
be to achieve an optimum fin Surface area, number of fins bearing. Beginning from the top, you See the fan 302 housed
(fan blades 204), and Surface roughness in order to maxi over the rotating shaft 206. The stator assembly 406 is
mize heat transfer effectiveness. shown in black to distinguish it from its Surroundings. A
0.033 Blade geometry is important to the cooling effec magnet 404, steel flux ring 402, radial bearings 618, and
tiveness of fans in general. In this embodiment, the blade thrust bearing 608 are all configured on the base housing
geometry shown is different from that used in conventional 202. The base housing 202 in turn is disposed over a thrust
cooling devices. Conventional fans, in accordance with cap 211 which in turn tops a processor die (chip) 208. The
known aerodynamic principles, use Smooth-Surfaced, chip 208 is attached to a die base 602 which in turn is
Streamlined fan blades to achieve maximum airflow and to disposed on a processor receptacle 304 Over a circuit board
avoid turbulence. It is a further advantage of this invention 212.
to use fan blades 204 which are designed to be thermally 0038 Used in an active heat sink, a FDB provides
coupled in an optimal way, in contrast to conventional fan rotational support for the fins (fan blades 204) and also
blades. In a preferred embodiment, the fan blades 204 would provides the heat transfer interface. However, in contrast to
create a lot of turbulence at their Surface in order to
maximize heat transfer from the fan Surface to air molecules. the precision requirements of a hard disk drive, the active
This increased turbulence would be facilitated by creating a heat Sink System does not require mechanical precision of
rough texture to the Surface of the fan blades 204. This could the rotating fan blades 204. Hence the ease of manufacturing
be done by pitting or etching the blades, or by the addition the FDB for use in the above embodiment can be improved,
of bumps, dimples (as in golfballs) or grooves on the Surface while exploiting its Self-pressuring function and Self-con
of the blades 204. taining design features, by increasing the thickness of the
fluid film (to 5 to 10 um) and thereby relaxing the machining
0034. In addition to using surface roughness of the blades tolerances on the bearing components. Also as the hard drive
to create turbulence, heat dissipation is also maximized by industry starts using fluid dynamic bearings in the Spindle
blowing the air away from the heat Source (the processor die, motors of more and more products, it will result in a large
or chip 208). This is why the fan blades 204 are designed to increase in the numbers of FDB manufactured
generate an axial-in, radial-out airflow pattern shown in 0039. Since the requirements of a FDB function can
FIG.3 and also described in FIG. 5. This again is in contrast impose undesirable restrictions on material properties and
to conventional fan blade configurations used in heat Sink tolerances, a ball bearing augmented System, as shown in
fans where the approach is to blow cool air onto the heat FIG. 7, is provided as an alternative embodiment. FIG. 7
Source, or chip, in order to cool it. In this embodiment, it is shows a cross-section of a ball bearing motor with fluid heat
desirable to blow the heated air away from the chip to coupling and a rotating Shaft design. In this design, the ball
maximize heat dissipation. bearings 720 provide the rotational support structure while
0035) We will now show how an embodiment of the a relaxed FDB-like film 210 (with the fluid gap dimensions
invention is constructed and what materials are used. We increased to 10-20 um or more) provides the heat transfer
turn now to FIG. 4 which shows an exploded view 400 of interface. The outer housing for the ball bearings 720 also
the active heat sink 200 components. In addition to contain forms the outer Surface for the fluid film 210. Note that in
ing an FDB element, the active heat sink 200 must also have this configuration a thrust generating element is not needed
a torque generating Structure. Precision Speed control is not Since ball bearings provide both radial and axial load car
a critical requirement for an active heat Sink. The airflow rying function. The cross-section walls 714 (shown with a
path, according to the blade geometry shown of the fan 302, diagonal "\\\\ cross-hatch pattern) do not serve a bearing
US 2004/0114327 A1 Jun. 17, 2004

role but will dissipate the heat carried by the fluid 210. It is a thermal conductor for conducting heat generated by the
understood that the fluid film 210 can be self-pumped to heat Source to the mobile heat Sink.
move through geometries that are optimum for heat transfer 2. The apparatus of claim 1 further comprising a driver
and may have complicated passages. A key invention is the machine for driving the mobile heat Sink into motion Such
use of fluid film 210 to provide a thermal interface that that heat received from the heat Source is dissipated into a
allows the Source to be Stationary but the Sink to be rotating Space in the proximity of the heat Sink.
while Simultaneously generating a desired airflow pattern 3. The apparatus of claim 1 wherein the mobile heat sink
over the fan blades 204 for maximum heat transfer. The comprises a rotating Shaft and one or more fan blades
thermal path 702 shows how the heat is transferred from the attached to the rotating shaft.
source (the chip 208) up through the cap 211. The fluid film 4. The apparatus of claim 1 wherein the thermal conductor
210 absorbs much of this heat and conducts it through the comprises a fluid film disposed between the heat Source and
rotating shaft 206 out onto the fan blade 204. The motor 704 the heat Sink.
controls the movement of the rotating shaft 206. 5. The apparatus of claim 2 wherein the driver machine
0040. This diagram illustrates another benefit and advan comprises a motor for rotating the shaft.
tage to the fluid film 210. In this figure, you can see that the 6. The apparatus of claim 4 wherein the fluid film com
heat source, which in this case is the chip 208, is a small prises a material capable of transporting heat from a Sta
Surface, especially in relation to the amount of heat it can tionary Source to a moving object.
generate. It is an objective of heat dissipation mechanisms to 7. The apparatus of claim 3 wherein the fan blades
map a Small Surface to a much larger Surface in order to comprise a non-Smooth Surface Such that Significant turbu
maximize the potential for heat transfer away from the die lent airflow near the fan blade Surface is generated by
208 into ambient air. New applications can be envisaged rotating the shaft.
where the ambient air is replaced by another fluid medium 8. The apparatus of claim 2 wherein the motor drives the
to maximize heat removal from the fan blades themselves. rotating Shaft to rotate in a direction Such that airflow is
The fluid film 210 aids in this regard by transference of heat generated in a direction away from the heat Source.
from the small chip 208 to the much larger Surface area of 9. The apparatus of claim 1 integrated with the heat
the fan unit. SOCC.

0041 FIG.8 is a cross-sectional view of a ball bearing 10. The apparatus of claim 4 wherein the fluid film
comprises oil.
motor with fluid heat coupling as in FIG. 7, but unlike the 11. The apparatus of claim 1 further comprising a ball
motor of FIG. 7, this motor uses a stationary shaft design. bearing augmented System.
The motor 804 is housed around the stationary shaft 806. 12. The apparatus of claim 3 wherein the thermal con
The fluid film 210, as in other embodiments, is distributed in ductor comprises a fluid film disposed between the heat
a well so that it is in contact with the stationary shaft 806. Source and the heat Sink and wherein the shaft comprises
In this embodiment, the shaft 806 is stationary, so the fluid Surface features So that the fluid is Self-circulating.
film 210 does not serve all of the same purposes as in other 13. The apparatus of claim 3 wherein the fan blades
embodiments which employ a rotating Shaft. For example, comprise an axial-in, radial-out blade geometry.
the fluid film 210 in this example does not serve a lubricating
purpose. It is still effective, however, in helping to conduct 14. The apparatus of claim 3 wherein the fan blades
the heat away from the heat source (the die, or chip 208) and comprise an axial-in, axial-out geometry.
into the rotating blade 204. This underscores the importance 15. An apparatus for cooling a heat Source, comprising
of choosing a fluid with a high heat transfer capability with a fan assembly for attaching to a circuit board for Sup
the help of Self-pumped circulation. The heat is dispersed porting a heat-generating electronic device, the fan
from the chip 208 through the shaft 806. The fan blades 204 assembly comprising a moving member and a Station
help to disperse the heat from the shaft 806 out into the ary member;
ambient air as shown by the thermal path 802. It should be
understood that, while this is an example of an embodiment the fan assembly further comprising a rotating fan posi
wherein the present invention could be used, it is not the tioned in close proximity to the heat-generating elec
ideal configuration. While the embodiment with a rotating tronic device Such that the fan generates airflow in the
shaft shown in FIG. 7 is Superior in terms of cooling direction away from the heat-generating electronic
efficiency, this example is presented here to Show the device;
adaptability of the invention. a fluid film located near the heat-generating electronic
0042. Therefore, while there has been described what is device Such that heat generated by the electronic device
presently considered to be a preferred embodiment, it will be is transferred through the fluid film to the rotating fan,
understood by those skilled in the art that other modifica the fluid being contained in a Space between the mov
tions can be made within the Spirit and Scope of the ing and Stationary members of the fan assembly.
invention. 16. The apparatus of claim 15 wherein the moving mem
We claim:
ber comprises a rotating Shaft and one or more blades
attached to the shaft.
1. A cooling apparatus, for cooling a heat Source, com 17. The apparatus of claim 15 wherein the fluid film
prising: comprises a material with high thermal conductivity.
a mobile heat Sink for placement in close proximity with
the heat Source; and k k k k k