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Memory

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MEMORY
INTRODUCTION
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 The system memory is the place where the computer


holds current programs and data that are in use.

 Types of computer memory


 Primary Memory

 Secondary Memory

 Virtual Memory
MEMORY CLASSIFICATIONS
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TYPES OF MEMORY
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 Random Access Memory (RAM)

 Read Only Memory (ROM)


RAM
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 A collection of memory chips - functions as primary workspace.

 RAM is a read/write memory which stores data temporarily.

 Data gets erased when the machine is turned off


Features
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 All data in RAM is lost when the computer is switched off


 Described as being ”Volatile“
 It is direct access as it can be both written to or read from in any
order
Features…
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 RAM typically resides on Memory Modules

 A RAM Memory chip is an IC made of millions of Transistors and


Capacitors

 Types of RAM
 DRAM
 SRAM

 Virtual Memory - An extension of RAM on hard drive


TYPES OF RAM
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 Static RAM (SRAM)

 Dynamic RAM (DRAM)


Static RAM (SRAM)
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 SRAM (Static Random Access Memory) is a type of


semiconductor memory.

 SRAM is used only where access speed is extremely


important.

 The word "static" indicates that the memory retains its


contents as long as power is continuously applied.
Static RAM (SRAM)..
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 Very fast but more expensive

 Used as cache memory due to its speed

 Cache Memory stores frequently used data and


instructions

 Constant power should be applied

 Servers and workstations can have at least 2MB of


L2 or L3 cache.
Levels of Caches
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 Level 1 Cache - (8KB to 128KB)

 Level 2 Cache - (64KB to 4MB)

 Level 3 Cache is separate from the microprocessor chip


and is on the motherboard.

 L3 Cache exists only on computers that use the L2


Advanced Transfer Cache.
Dynamic RAM(DRAM)
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 This type of memory is dynamic because its storage


cells must be refreshed, i.e. receive a new electronic
charge every few milliseconds in order for the memory
state to be maintained.

 It is a type of random access memory that stores each


bit of data in a separate capacitor.
Dynamic RAM(DRAM)..
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 Since capacitors leak charge, the data fades unless the


capacitor charge is refreshed periodically.
 Only one transistor and a capacitor are required per
bit, compared to four or six transistors in SRAM.
 Contents are constantly refreshed 1000 times per
second
 Access time 60 – 70 nanoseconds

 Note: a nanosecond is one billionth of a second!


Dynamic RAM(DRAM)…
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 Stores 1’s and 0’s on capacitors


 Must be recharged every millisecond, or every one
thousandth of a second
 The standard refresh time is 15ms.
 Most RAM must be recharged constantly
Types of SDRAM
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 DDR1
 DDR2
 DDR3
 DDR4

 DDR4 currently being designed and anticipated to be


available in 2015.
DDR SDRAM
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 Double-Data-Rate Synchronous Dynamic Random


Access Memory

 It is designed to double the clock speed of the memory.

 It achieves greater bandwidth by transferring data on


both the rising and falling edges of the clock signal.
 DDR SDRAM DIMMs has 184 pins

 DDR operates at a voltage of 2.5V, compared to 3.3V


for SDRAM.
DDR2 SDRAM
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DDR3 SDRAM
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 DDR3 is the latest memory standard.


 DDR3 memory runs on only 1.5V, which is nearly 20%
less than the 1.8V that DDR2 memory uses.
 240-pin DDR3 modules are similar in pin count, size,
and shape to the DDR2 modules.
 DDR3 modules are incompatible with the DDR2 are
designed with different keying structure.
 DDR3 continues the trend, doubling the minimum
read or write unit to 8 consecutive words.
DDR4 SDRAM
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 DDR4 SDRAM will be the successor to DDR3

SDRAM.

 Expected to be released in 2015.

 The new chips are expected to run at 1.2 v or less.

 Speed - 2 billion data transfers per second.


MEMORY MODULES
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 SIMM (Single-Inline Memory Module)

 DIMM(Dual Inline Memory Module)

 RIMM (Rambus Inline Memory Module)

 SO-DIMM(Single-Outline Dual-Inline Memory Module)


Memory Modules
SIMM
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 A typical 30-pin SIMM.

 A typical 72-pin SIMM.


Memory Modules
DIMM
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 A typical 168-pin SDRAM DIMM

 A typical 184-pin DDR DIMM

 A typical 240-pin DDR2 DIMM


Memory Modules..
DIMM
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 A typical 240-pin DDR3 DIMM

 A typical 184-pin RIMM (RIMM modules uses RDRAM)


Examples of Memory Modules
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Memory Modules – DDR3 [aXeRam Series]
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 DDR3-2400: 4GB ~ 8GB

 DDR3-2133: 8GB

 DDR3-2000: 4GB~6GB
ROM – READ ONLY MEMORY
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 Data can be hold Permanently or semi-permanently.

 It is called read-only.

 ROM is non-volatile.

 Up to 128KB in size

 Virtually all systems the ROMs are shadowed.

 Motherboard ROM-BIOS: Contains the startup programs and


drivers and act as the interface to the basic hardware in the
system.
Motherboard ROM-BIOS
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Contents of ROM
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 POST

 BIOS

 CMOS Setup

 BSL
Contents of ROM..
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 POST –Power-On Self-Test


 Tests complete computer’s hardware
 POST Phases
Phase I
Processor, memory, chipset, video adapter

Phase II
Disk controllers, Disk drives, Keyboard, and
other crucial components.
Contents of ROM…
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 BIOS – Basic Input Output System


 Contains the collection of actual drivers
 Act as a basic interface between the OS and your hardware
when the system is booted and running.
 CMOS Setup – Complimentary Metal-Oxide Semiconductor
 A menu driven program.
 Enables you to configure the motherboard and chipset
settings
 Date and time,
 Passwords
 Disk drives
 Other basic system settings
Contents of ROM….
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 BSL - Boot Strap Loader


 A routine that reads the first physical sector of various
disk drives.
 First sector - Master Boot Record [MBR]
 MBR contains VBR .
 VBR loads the first OS startup file
 IO.SYS for Windows 9x/Me
 ntldr for Windows XP/2000/NT
 bootmgr for Windows 7/Vista/8/2008/2012
ROM Chip Types
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 ROM—Read-only memory

 PROM—Programmable ROM

 EPROM—Erasable PROM

 EEPROM—Electrically erasable PROM(flash ROM)


PROM
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 PROMs are a type of ROM


 Blank when new
 Must be programmed with whatever data you want.
 Programmed by manufacturers.
 Uses special machine called a device programmer,
ROM programmer, or ROM burner.
 They are technically preloaded with binary 1’s.
 Available in sizes from 1KB (8Kb) to 2MB (16Mb) or
more.
 One-Time Programmable (OTP) chips.
EPROM
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 An Erasable ROM.

 Easily recognized by the Clear Quartz Crystal Window set


in the chip package directly over the die.
 The purpose of the window is to allow Ultraviolet Light

 EPROM is erased by exposure to intense UV light.

 The UV light causes a chemical reaction, which essentially


melts the fuses back together.
 Crystal window is typically covered by tape, which prevents
accidental exposure to UV light.
EEPROM/Flash ROM
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 Electrically Erasable PROM.

 Can be erased and reprogrammed directly in the circuit board


they are installed in.
 No special equipment required.

 Can be erased without removing the chip.

 No need a U.V eraser or device programmer.

 Advantage we can upgrade the motherboard ROM.

 Download the updated ROM from the motherboard


manufacturer’s Website.
ROM BIOS Manufacturers
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 American Megatrends Inc.(AMI)

 Phoenix Technologies, and Award Software

 Original Equipment Manufacturer (OEM)


Virtual Memory
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• Uses backing storage to store programs and data


temporarily.
• Used where insufficient RAM available.

• Swaps programs and data between the hard-disk and


RAM.
• Speed: CPU can access RAM in nanoseconds but
hard-disk in milliseconds.
• Virtual memory is much slower than RAM.
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Thank You

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