HMC517

v04.0223

GaAs PHEMT MMIC LOW NOISE

AMPLIFIER, 17 - 26 GHz

Typical Applications Features

The HMC517 is ideal for use as a LNA or Driver ampli- Noise Figure: 2.2 dB
fier for:
LOW NOISE AMPLIFIERS - CHIP

Gain: 19 dB
• Point-to-Point Radios OIP3: +24 dBm
• Point-to-Multi-Point Radios & VSAT Single Supply: +3V @ 65 mA
• Test Equipment and Sensors 50 Ohm Matched Input/Output
• Military & Space Die Size: 2.14 x 1.32 x 0.1 mm

Functional Diagram General Description

The HMC517 chip is a high dynamic range GaAs
pHEMT MMIC Low Noise Amplifier (LNA) which
covers the 17 to 26 GHz frequency range. The
HMC517 provides 19 dB of small signal gain, 2.2 dB
of noise figure and has an output IP3 greater than
+24 dBm. The chip can easily be integrated into hy-
brid or MCM assemblies due to its small size. All data
is tested with the chip in a 50 Ohm test fixture con-
nected via 0.075mm (3 mil) ribbon bonds of minimal
length 0.31 mm (12 mil). Two 0.025 mm (1 mil) diameter
bondwires may also be used to make the RFIN and
RFOUT connections.

Electrical Specifications, TA = +25° C, Vdd 1, 2, 3 = +3V

Parameter Min. Typ. Max. Min. Typ. Max. Units
Frequency Range 17 - 22 22 - 26 GHz
Gain 16 19 15 18 dB
Gain Variation Over Temperature 0.015 0.025 0.015 0.025 dB/ °C
Noise Figure 2.2 2.7 2.4 2.9 dB
Input Return Loss 17 15 dB
Output Return Loss 10 10 dB
Output Power for 1 dB Compression (P1dB) 8 11 9.5 12.5 dBm
Saturated Output Power (Psat) 15 15 dBm
Output Third Order Intercept (IP3) 23 24 dBm
Supply Current (Idd)(Vdd = +3V) 65 88 65 88 mA

Information furnished Forbyprice,

Analog delivery, and totoplace
Devices is believed orders:
be accurate and Analog Devices,
reliable. However, no Inc., One Analog Way,delivery,
For price, Wilmington,
and to MA
place01887
orders:
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other Analog Devices, Inc., One Analog Way, Wilmington, MA 01887
Phone: 781-937-1428
rights of third parties that may result from its use. Specifications • Order
subject to change without notice.online
No at www.analog.com
1 license is granted by implication or otherwise under any patent Application Support:
or patent rights
Trademarks and registered trademarks are the property of their respective owners.
of AnalogPhone: Phone:
Devices. 1-800-ANALOG-D781-937-1428 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
 HMC517
v04.0223

GaAs PHEMT MMIC LOW NOISE

AMPLIFIER, 17 - 26 GHz

Broadband Gain & Return Loss Gain vs. Temperature

25 24

LOW NOISE AMPLIFIERS - CHIP

22
15
20
RESPONSE (dB)

S21

GAIN (dB)
5 S11 18
S22

-5 16
+25C
14 +85C
-55C
-15
12

-25 10
12 16 20 24 28 32 16 18 20 22 24 26 28
FREQUENCY (GHz) FREQUENCY (GHz)

Input Return Loss vs. Temperature Output Return Loss vs. Temperature
0 0

+25C +25C
-5 +85C -4 +85C
-55C -55C
RETURN LOSS

RETURN LOSS

-10 -8

-15 -12

-20 -16

-25 -20
16 18 20 22 24 26 28 16 18 20 22 24 26 28
FREQUENCY (GHz) FREQUENCY (GHz)

Noise Figure vs. Temperature Output IP3 vs. Temperature

10 30

25
8
NOISE FIGURE (dB)

20
+25C
IP3 (dBm)

6 +85C
-55C +25C
15 +85C
-55C
4
10

2
5

0 0
16 18 20 22 24 26 16 18 20 22 24 26
FREQUENCY (GHz) FREQUENCY (GHz)

For price, delivery, and to place orders: Analog Devices, Inc., One Analog Way, Wilmington, MA 01887
Phone: 781-937-1428 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D 2
 HMC517
v04.0223

GaAs PHEMT MMIC LOW NOISE

AMPLIFIER, 17 - 26 GHz

P1dB vs. Temperature Psat vs. Temperature

20 20
LOW NOISE AMPLIFIERS - CHIP

16 16
P1dB (dBm)

Psat (dBm)
12 12

+25C
8 8 +85C
-55C

+25C
4 +85C 4
-55C

0 0
16 18 20 22 24 26 16 18 20 22 24 26
FREQUENCY (GHz) FREQUENCY (GHz)

Reverse Isolation vs. Temperature Power Compression @ 21 GHz

0 22
20
Pout (dBm), GAIN (dB), PAE (%)

-10 18
16
+25C 14
ISOLATION (dB)

-20 +85C Pout

-55C 12 Gain
PAE
10
-30
8
6
-40 4
2
-50 0
-2
-60 -4
16 18 20 22 24 26 28 -24 -20 -16 -12 -8 -4 0
FREQUENCY (GHz) INPUT POWER (dBm)

Gain, Noise Figure & Power vs.

Supply Voltage @ 21 GHz
21 6.5
20 6
19 Gain 5.5
18 5
GAIN (dB), P1dB (dBm)

4.5
NOISE FIGURE (dB)

17
16 4
15 3.5
14 3
13 Noise Figure 2.5
12 2
11 1.5
P1dB 1
10
9 0.5
8 0
2.5 2.75 3 3.25 3.5
Vdd (V)

For price, delivery, and to place orders: Analog Devices, Inc., One Analog Way, Wilmington, MA 01887
Phone: 781-937-1428 • Order online at www.analog.com
3 Application Support: Phone: 1-800-ANALOG-D
 HMC517
v04.0223

GaAs PHEMT MMIC LOW NOISE

AMPLIFIER, 17 - 26 GHz

Absolute Maximum Ratings Typical Supply Current vs. Vdd

Drain Bias Voltage (Vdd1, Vdd2, Vdd3) +5.5 Vdc Vdd (Vdc) Idd (mA)
RF Input Power (RFIN)(Vdd = +3.0 Vdc) +19 dBm +2.5 61

LOW NOISE AMPLIFIERS - CHIP

Channel Temperature 175 °C +3.0 65
Continuous Pdiss (T= 85 °C) +3.5 69
1.65 W
(derate 18 mW/°C above 85 °C)
Note: Amplifier will operate over full voltage ranges shown
Thermal Resistance above.
54.6 °C/W
(channel to die bottom)
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C ELECTROSTATIC SENSITIVE DEVICE
ESD Sensitivity (HBM) Class 1A OBSERVE HANDLING PRECAUTIONS

Outline Drawing

Die Packaging Information [1] NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]
Standard Alternate 2. DIE THICKNESS IS .004”
3. TYPICAL BOND IS .004” SQUARE
GP-2 (Gel Pack) [2]
4. BACKSIDE METALLIZATION: GOLD
[1] Refer to the “Packaging Information” section for die 5. BOND PAD METALLIZATION: GOLD
packaging dimensions. 6. BACKSIDE METAL IS GROUND.
[2] For alternate packaging information contact Analog 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
Devices, Inc.

For price, delivery, and to place orders: Analog Devices, Inc., One Analog Way, Wilmington, MA 01887
Phone: 781-937-1428 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D 4
 HMC517
v04.0223

GaAs PHEMT MMIC LOW NOISE

AMPLIFIER, 17 - 26 GHz

Pad Descriptions
Pad Number Function Description Interface Schematic
LOW NOISE AMPLIFIERS - CHIP

This pad is AC coupled

1 RFIN
and matched to 50 Ohms.

Power Supply Voltage for the amplifier. External bypass

2, 3, 4 Vdd1, 2, 3
capacitors of 100 pF and 0.1 µF are required.

This pad is AC coupled

5 RFOUT
and matched to 50 Ohms.

These pads must be connected

6, 7, 8 Vgg3, Vgg2, Vgg1
to RF/DC ground for proper operation.

Die Bottom GND Die Bottom must be connected to RF/DC ground.

Assembly Diagram

Note: Vgg1, Vgg2 and Vgg3 must be connected to RF/DC ground.

For price, delivery, and to place orders: Analog Devices, Inc., One Analog Way, Wilmington, MA 01887
Phone: 781-937-1428 • Order online at www.analog.com
5 Application Support: Phone: 1-800-ANALOG-D
 HMC517
v04.0223

GaAs PHEMT MMIC LOW NOISE

AMPLIFIER, 17 - 26 GHz

Mounting & Bonding Techniques for Millimeterwave GaAs MMICs

The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note). 0.102mm (0.004”) Thick GaAs MMIC

LOW NOISE AMPLIFIERS - CHIP

50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
3 mil Ribbon Bond
thin film substrates are recommended for bringing RF to and from the chip 0.076mm
(Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be (0.003”)
used, the die should be raised 0.150mm (6 mils) so that the surface of the
die is coplanar with the surface of the substrate. One way to accomplish
this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick
molybdenum heat spreader (moly-tab) which is then attached to the RF Ground Plane

ground plane (Figure 2).

Microstrip substrates should brought as close to the die as possible in order
to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm 0.127mm (0.005”) Thick Alumina
to 0.152 mm (3 to 6 mils). Gold ribbon of 0.075 mm (3 mils) width and minimum Thin Film Substrate
< 0.31 mm (<12 mils) is recommended. Figure 1.

Handling Precautions
Follow these precautions to avoid permanent damage. 0.102mm (0.004”) Thick GaAs MMIC
Storage: All bare die are placed in either Waffle or Gel based ESD
3 mil Ribbon Bond
protective containers, and then sealed in an ESD protective bag for 0.076mm
shipment. Once the sealed ESD protective bag has been opened, all die (0.003”)

should be stored in a dry nitrogen environment.

Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems. RF Ground Plane

Static Sensitivity: Follow ESD precautions to protect against ESD strikes.

0.150mm (0.005”) Thick
Transients: Suppress instrument and bias supply transients while bias Moly Tab
is applied. Use shielded signal and bias cables to minimize inductive 0.254mm (0.010”) Thick Alumina
pick-up. Thin Film Substrate
Figure 2.
General Handling: Handle the chip along the edges with a vacuum collet
or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with
vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and flat.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
RF bonds made with 0.003” x 0.0005” ribbon are recommended. These bonds should be thermosonically bonded
with a force of 40-60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are recommended.
Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made
with a nominal stage temperature of 150 °C. A minimum amount of ultrasonic energy should be applied to achieve
reliable bonds. All bonds should be as short as possible, less than 12 mils (0.31 mm).

For price, delivery, and to place orders: Analog Devices, Inc., One Analog Way, Wilmington, MA 01887
Phone: 781-937-1428 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D 6