Luminus SBT-90-Gen2 Datasheet
Luminus SBT-90-Gen2 Datasheet
Product Datasheet
SBT-90-WxS
Specialty White LED
•E
xtremely high optical output: up to 5,400 lumens at 18 A from a single Binning Structure. . . . . . . . . . . . . . . . . . . 3
chip
Absolute Maximum Ratings . . . . . . . . . 5
•U
n-encapsulated die ideal for optical coupling in Etendue-limited
applications
Device Characteristics . . . . . . . . . . . . . . 6
• 5700K typical color temperature
Angular Distribution and Typical
•H
igh thermal conductivity package - junction to case thermal resistance Spectrum. . . . . . . . .. . . . . . . . . . . . . . . . . 8
of only 0.35°C/W
Soldering Profile. . . . . . .. . . . . . . . . . . . . 9
• Compact 10 x 11 mm2 isolated surface mount package
Mechanical Dimensions. . . . . . .. . . . 10
Shipping Label . .. . . . . . . . . . . . . . . . 12
Notes . .. . . . . . . . . . . . . . . . . . . . . . . . 13
Ordering Information
Ordering Part Numbers1
Luminous Flux
Color Chromaticity Bins Ordering Part Number
Min. Flux Bin Min. Flux
W: White
<x>: Color Temperature
D: Daylight Internal package code Refer to ordering
SBT: Surface Mount
90: 9 mm 2
C: Cool White F71: Ceramic Package part numbers in this
(Window)
S: Stage White F72: Second generation document
<y>: CRI
S: Standard
Note:
1. Flux Bin listed is minimum bin shipped, higher bins may be included at Luminus’ discretion.
Binning Structure
All SBT-90 LEDs are tested for luminous flux/dominant wavelength and placed into one of the following flux/wavelength bins. The
binning structure is universally applied across each color of the SBT-90 product line.
Flux Bins1,2
RB 2,600 2,780
SA 2,780 2,990
SB 2,990 3,200
WDS
White Daylight Standard CRI TA 3,200 3,400
(typ. 70)
TB 3,400 3,680
UA 3,680 3,955
UB 3,955 4,230
Note:
3. Individual bins are not orderable. Please refer to the Product Ordering information page for a list of orderable bin kits.
Binning Structure
All SBT-90 LEDs are tested for luminous flux/ dominant wavelength and placed into one of the following flux/wavelength bins. The
binning structure is universally applied across each color of the SBT-90 product line.
CCT Bin Code CIEx CIEy Bin Code CIEx CIEy Bin Code CIEx CIEy
0.380
5700
EH
0.355 BB Locus
6500 J4
H4
EF
G4 J3
H3
CIEy
0.330 F4
G3 DJ
F3 DG2 600
DG
DE
0.305
DF
0.280
0.270 0.295 0.320 0.345 0.370
CIEx
If min 0.2
Forward Current (CW)1,2 A
If max 18
Ts min -40
Storage Temperature °C
Ts max 100
Note:
2. Device is designed and optimized for operation near 9 A and operation at low current may result in variable performance. Contact Luminus for more information.
4. Sustained operation at maximum operating Tj will result is shortened lifetime and may cause premature product failure.
Device Characteristics
Vf min 2.8
Vf max 3.8
Thermal Characteristics
Thermal Resistance (junction to case)-Real3 Rth j-c_real 0.35 °C/W
Note:
1. Unless otherwise noted, values listed are typical. All ratings are based on operation with a constant temperature = 25ºC.
2. For specific minimum and maximum values, use bin tables. For product roadmap and future performance of devices, contact Luminus.
3. Measurements are in accordance with JEDEC 51-14. For more about thermal resistance calculation, please see https://luminusdevices.zendesk.com/hc/en-us/
articles/4416807960717-Thermal-Heatsink-Required-Rth-Calculator.
180% 103%
Relative Luminous Flux
20% 88%
-20% 85%
0 5 10 15 20 25 0 10 20 30 40 50 60 70 80 90
If (A) Tc (°C)
Forward Voltage
Forward current: Vf = V(If), Tc = 25°C Temperature: ΔVf = V(Tc) - V(25°C), If = 9 A
0.60 0.09
0.40 0.06
Δ Forward Voltage (Vf )
0.20 0.03
0.00 0.00
-0.20 -0.03
-0.40 -0.06
-0.60 -0.09
0 5 10 15 20 25 0 10 20 30 40 50 60 70 80 90
If (A) Tc (°C)
Relative Chromaticity
Forward current: ΔCIEx,y= CIEx,y(If) - CIEx,y(9 A), Tc = 25°C Temperature: ΔCIEx,y= CIEx,y(Tc) - CIEx,y(25°C), If = 9 A
0.030 0.006
Δ CIEx Δ CIEx
Δ CIEy 0.004 Δ CIEy
0.020
0.002
Δ CIEx, Δ CIEy
Δ CIEx, Δ CIEy
0.010
0.000
0.000
-0.002
-0.010
-0.004
-0.020 -0.006
0 5 10 15 20 25 0 10 20 30 40 50 60 70 80 90
If (A) Tc (°C)
Typical Spectrum
Φref = f(λ); If = 9 A; Tc = 25°C
1.0
0.8
0.6
Relative Intensity
0.4
0.2
0.0
380 430 480 530 580 630 680 730 780
Wavelength (nm)
Soldering Profile
Peak Temperature (235 - 245°C)
Time
SMT Rework Guideline Manual Hotplate Reflow Hot Air Gun Reflow
Note:
2. The numbers in the table are specific to SAC305. Luminus recommends using an SAC305 solder paste with a no-clean flux for RoHS compliant products.
3. During the pick and place process, axial forces on the dome (or window) should not exceed 0.5 Newtons (N).
5. Time-temperature profile of the reflow process showing the four functional profile zones are defined in IPC-7801. Temperature is referenced to the center of the
PCB.
6. Luminus recommends to use the solder paste data sheet information as a starting point in time-temperature process development.
7. These are general guidelines. Consult the solder paste manufacturer’s datasheet for guidelines specific to the alloy and flux combination used in your application.
For more information, please refer to:
https://luminusdevices.zendesk.com/hc/en-us/articles/360060306692-How-do-I-Reflow-Solder-Luminus-SMD-Components-
8. For any technical questions about soldering process, please contact Luminus at techsupport@luminus.com.
8 7 6
Mechanical Dimensions 5 4 3 2 1
REVISION HISTORY
REV ECO DESCRIPTION OF CHANGE BY DATE
B C
ENG-
00748
CHANGED DIE TILT SPEC FROM 1 TO 1.25 MEH 09/14/09
ENG-
D ADDED NOTE 3 SKK 10/26/11
.23±.03
03214
ECO-
01 RELEASE TO PRODUCTION SKK 1/21/15
04904
.009±.001
D
D
+.15 DATUM B TO TOP OF
10.00 DIE EMITTING AREA .86±.10
- .00
.034±.004
+.006
.394 DATUM B TO TOP
- .000 .63±.14 OF WINDOW 3X 9.0
.025±.006 .354
A E TOP OF DIE NOTCH INDICATES
EMITTING AREA TO ANODE (+)
TOP OF WINDOW
1.4
.055
C C
+.15 7.1
11.00
- .00 .280 5.1
+.006 9.9 .201
.433
- .000 .390
B B
1.54±.17
.061±.007
8 7 6 5 4 3 2 1
E SECTION E-E
4.46
PROPRIETARY AND 1100 TECHNOLOGY PARK DRIVE
CONFIDENTIAL BILLERICA, MA 01821
.176 4.46
This document and its contents .176 CENTER OF FRAME
978-528-8000
NOTES: EMITTING AREA CENTER OF DIE EMITTING AREA are confidential information of DESCRIPTION: AND WINDOW
A Luminus Devices, Inc. CENTER OF FRAME
A CENTER TO .15[.006] M A B Copyright 2005 Luminus Device,Inc.
A
D
1 SUFACE AREA SHOWN ARE DATUM AND WINDOW .25[.010]
DRAWING, OUTLINE, 001505, M A B
SBT-90 D
DATUM A B. All rights reserved.
2. WINDOW MATERIAL: SCHOTT D263T. UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN (UNLESS OTHERWISE SPECIFIED): SIZE: SHEET:
1 OF 3 REV:
B 3.00 B
.118 8.5
8 7 6 5 4 3 2 1
DIE EMITTING AREA .335
D
9.0
1100 TECHNOLOGY PARK DRIVE
.354 BILLERICA, MA 01821
978-528-8000
DESCRIPTION:
A A
1.4
NOTES: .055 DRAWING, OUTLINE, 001505, SBT-90
1. DIE TILT: 1.25 MAXIMUM. DIMENSIONS ARE IN (UNLESS OTHERWISE SPECIFIED): SIZE: SHEET:
2 OF 3 REV:
M. HADLEY DWG-001505
8 7 6 5 4 3 2 1
C
9.9 7.1 5.1
.390 .280 .201
Mechanical Dimensions
Note:
4. All anode pads on board are interconnected. All cathode pads on board are interconnected.
Shipping Label
Label Fields:
XXX-XX-XXXX-XXXX-XXXXXXXXX
• CPN: Luminus ordering part number
• CID: Customer’s part number
• QTY: Quantity of devices in pack
• Flux: Bin as defined on page 3
• Voltage: NA
• Color: Bin as defined on page 3
XXX
50 • CRI: NA
Reel ID
Packing Configuration:
• Partial pack or tray may be shipped
• Each pack is enclosed in anti-static bag
• Shipping label is placed on top of each pack
Notes
Static Electricity
This product is sensitive to static electricity, and care should be taken when handling them. Static electricity or surge voltage will
damage the LEDs. It is recommended to wear an anti-electrostatic wristband or anti-electrostatic gloves when handling the LEDs.
All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken to isolate LED
processing equipment from potential sources of voltage surges.
Revision History