TVS Diode Array (SPA® Diodes)

Low Capacitance ESD Protection - SP3031

SP3031 Series 0.8pF 10kV Unidirectional Discrete TVS RoHS Pb GREEN

Description

The SP3031 is a single channel low capacitance diode

that provides protection for electronic equipment that
may experience destructive electrostatic discharges
(ESD). This robust diode can safely absorb repetitive ESD
strikes above the maximum level specified in the IEC
61000-4-2 international standard (Level 4, ±8 kV contact
discharge and ±15 kV air discharge) without performance
degradation. The low loading capacitance makes it ideal for
protecting high speed data lines.

Features
Pinout • RoHS-Compliant, Lead- • Low capacitance of 0.8pF
Free and Halogen-Free @ VR=0V
• ESD protection of ±10kV • L
 ow leakage current of
contact discharge, 1μA at 5V
1 ±15kV air discharge, (IEC • M
 oisture Sensitivity
61000-4-2) Level(MSL-1)
• EFT, IEC 61000-4-4, 40A • AEC-Q101 Qaulified
(5/50ns)
• L
 ightning protection, IEC
61000-4-5, 2nd Edition:
8/20μs Surge, 5A Surge
2
Applications

• USB 2.0, Ethernet • Smart Phones

Functional Block Diagram
• MHL/MIPI/MDDI • External Storage
• HDMI, Display Port, • Ultrabooks, Notebooks
1 eSATA • Tablets, eReaders
• Set Top Boxes, Game • Automotive
Consoles

USB2.0 Application Example

USB2.0 Port USB Controller

2 VBUS
D+
D-
Additional Information SP1003

IC

Datasheet Resources Samples SP3031 (x2)

*Package is shown as transparent

Life Support Note: Signal GND

Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.

© 2020 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 03/23/20
 TVS Diode Array (SPA® Diodes)
Low Capacitance ESD Protection - SP3031

Absolute Maximum Ratings

Symbol Parameter Value Units

IPP Peak Current (tp=8/20μs) 5.0 A

TOP Operating Temperature –40 to 125 °C
TSTOR Storage Temperature –55 to 150 °C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those
indicated in the operational sections of this specification is not implied.

SP3031
Electrical Characteristics (TOP=25ºC)

Parameter Symbol Test Conditions Min Typ Max Units

Reverse Standoff Voltage VRWM I =1μA

R
5.0 V
Breakdown Voltage VBR IR=1mA 6.0 V
Reverse Leakage Current ILEAK VR=5V 1 µA
IPP=1A, tp=8/20µs, I/O to GND 6.9 V
Clamp Voltage1 VC
IPP=2A, tp=8/20µs, I/O to GND 7.5 V
Dynamic Resistance2 RDYN TLP, tp=100ns, I/O to GND 0.6 Ω
IEC 61000-4-2 (Contact) ±10 kV
ESD Withstand Voltage1 VESD
IEC 61000-4-2 (Air) ±15 kV
Diode Capacitance1 CI/O-I/O Reverse Bias=0V, f= 1 MHz 0.8 pF
Note: 1. Parameter is guaranteed by design and/or component characterization.
2.Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns

Insertion Loss (S21) I/O to GND Capacitance vs. Reverse Voltage

0 1.2

-5 1.0
Attenuation (dB)

Capacitance (pF)

-10 0.8
-15
0.6
-20
0.4
-25

-30 0.2

-35 0.0
0.0 1.0 2.0 3.0 4.0 5.0
10 100 1000
Frequency (MHz) DC Bias (V)

8/20µs Waveform 8kV Clamping Voltage

110%
100%

90%
80%
70%
Percent of IPP

60%
50%

40%
30%
20%

10%
0%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)

© 2020 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 03/23/20
 TVS Diode Array (SPA® Diodes)
Low Capacitance ESD Protection - SP3031

Product Characteristics Ordering Information

Lead Plating Pre-Plated Frame Part Number Package Min. Order Qty.
Lead Material Copper Alloy SP3031-01ETG SOD882 10000
Substitute Material Silicon
Body Material Molded Compound
UL Recognized compound meeting
Flammability
flammability rating V-0

Soldering Parameters

Reflow Condition Pb – Free assembly

- Temperature Min (Ts(min)) 150°C
tP
TP Critical Zone
Pre Heat - Temperature Max (Ts(max)) 200°C TL to TP
Ramp-up

Temperature
- Time (min to max) (ts) 60 – 180 secs TL
tL
Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max)
TS(max) to TL - Ramp-up Rate 3°C/second max Ramp-do
Ramp-down
Preheat
- Temperature (TL) (Liquidus) 217°C TS(min)
Reflow
- Temperature (tL) 60 – 150 seconds tS
Peak Temperature (TP) 260 +0/-5
°C
25
Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds time to peak temperature
Time
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260°C

Part Numbering System Part Marking System

SP 3031 – 01 E T G SOD882

TVS Diode Arrays G= Green

(SPA® Diodes)
f
T= Tape & Reel
Series Pin 1 Indicator Product ID
Number of Package
Channels E: SOD882

© 2020 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 03/23/20
 TVS Diode Array (SPA® Diodes)
Low Capacitance ESD Protection - SP3031

Package Dimensions — SOD882

Package SOD882
JEDEC MO-236
Symbol
Millimeters Inches
Min Typ Max Min Typ Max
A 0.90 1.00 1.10 0.035 0.039 0.043
B 0.50 0.60 0.70 0.020 0.024 0.028
C 0.40 0.50 0.60 0.016 0.020 0.024
D 0.45 0.018
E 0.20 0.25 0.35 0.008 0.010 0.012
F 0.45 0.50 0.55 0.018 0.020 0.022

Recommended Soldering
Pad Layout

Embossed Carrier Tape & Reel Specification — SOD882

Symbol Millimeters
A0 0.70±0.045
B0 1.10±0.045
K0 0.65±0.045
F 3.50±0.05
P1 2.00±0.10
W 8.00 + 0.30 -0.10

,Ref.

,Ref.

Notes :
1. All dimensions are in millimeters
,Ref.

Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are
not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/23/20
Mouser Electronics

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SP3031-01ETG