Magnetic Penetration Depth and Coherence Length in A Single-Crystal Yba Cu O
Magnetic Penetration Depth and Coherence Length in A Single-Crystal Yba Cu O
Magnetic Penetration Depth and Coherence Length in A Single-Crystal Yba Cu O
Historical Issues
• By the Paris Agreement goal, global warming is set to be reduced to <1.50 0C by reducing
45% of carbon dioxide emissions (CO2). In doing so, renewable energy-based technologies
such as solar panels have been employed
• Dielectric capacitors possess high power density and are more efficient as a viable candidate
to be used as energy storage devices for the goal rather than renewable energy sources
energy materials such as solar panel, this is because they have higher charging and
discharging properties, high power, and energy density, as required by this kind of energy
technology.
• electro ceramics show good matching behaviors. Per the needed characteristics, the electro
ceramics must have a density greater than 10 Jcm-3, 90% conversion efficiency, endure a
wide temperature range of -500C to 2500C, 1-1kHz, and others.
Principles
• The intrinsic band gap is also a factor that affects the energy density of energy saving
devices, generally, the activation energy and the band gap may be increased by doping or
forming solid solutions which in turn increase the energy density and breakdown strength of
the capacitors.
• Electrical homogeneity can reduce the energy density and breakdown strength by forming
pathways of high conducting regions of the microstructure and eliminating the
heterogeneity, which in turn, increases the work density and the breakdown strength. This
may be done by heat treatment.
Ceramics with low densities consists of voids that cause short-circuiting. High-density
electroceramics are obtained by optimization of sintering conditions including its temperature,
temperature time, heating, and cooling rate.
Summary of the paper: Low-power Silicon Devices
Low-power electronics had its beginnings in 1947 when the transistor was invented and replaced
power hungry vacuum tubes. Integrated circuits (ICs) reduced power consumption further,
because numerous devices could be placed on one chip, alleviating the interconnection problem
and reducing power consumption. However, the key low-power breakthrough was the invention
of the complementary metal-oxide-semiconductor (CMOS) integrated circuit. The need for low-
power electronics is driven by three distinct applications: (i) portable electronic products (ii)
enhanced performance with a low power dissipation; and (iii) conservation of power in desktop
systems where a competitive life cycle cost-top performance ratio demands low power for
reduced power supply and cooling costs. The building block of CMOS is the metal oxide-
semiconductor field-effect transistor (MOSFET) which is the
building block of low power electronics. The diagram below
shows a MOSFET. The two most critical dimensions of a
MOSFET are its gate length, often called the channel length,
and gate oxide thickness. They vary widely, but gate lengths are
typically 0.2–5.0x 10 -4 cm and oxide thickness
2–10x 10-7 cm. The CMOS circuits, helps irradicate the current drainage problem in MOSFET
by initiating the standby current, i.e., the current during either one of its two logic states, is very
low, making for low power dissipation in steady state. The energy consumed per unit time by a
device is the power used by the device. A better improvement of the energy consumption of
electronic circuit devises is the silicon-on-insulator. These are produced by making ICs on
silicon wafers. There are two methods for producing SOI wafers: (i) Separation by Implanted
Oxygen (SIMOX) wafers are formed by oxygen implantation into bulk silicon wafers followed
by appropriate anneals. (ii) Bond and Etch Back SOI (BESOI) wafers are formed by bonding two
oxidized wafers followed by annealing, lapping, and etching or cleaving of hydrogen implanted
wafers
REFERENCES
[1] Ahmed Abou El Hassan et el, Magnetic Penetration Depth and Coherence Length in a Single-Crystal
YBa2Cu3O7δ, Advanced Science news, 2016.
[2] Chandrakasan A P, Sheng S, Brodersen R W 1995 Minimizing power consumption in digital CMOS
circuits. Proc. IEEE 83,498–523
[3] Ge Wang, et el. Electroceramics for High-Energy Density Capacitors: Current Status
and Future Perspectives. Chemical reviews, https://doi.org/10.1021/acs.chemrev.0c01264
Chem. Rev. 2021, 121, 6124-6172