ESP32 WROOM 32D & ESP32 WROOM 32U: Recommended FOR NEW Designs (NRND)

ESP32WROOM32D &
ESP32WROOM32U
Datasheet
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Version 2.3
Espressif Systems
Copyright © 2022
www.espressif.com
About This Document
This document provides the specifications for the ESP32-WROOM-32D and ESP32-WROOM-32U
modules.
Document Updates
Please always refer to the latest version on https://www.espressif.com/en/support/download/documents.
Revision History
For revision history of this document, please refer to the last page.
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Certification
Download certificates for Espressif products from www.espressif.com/en/certificates.
Not Recommended For New Designs (NRND)

Contents
1 Overview 6
2 Pin Definitions 8
2.1 Pin Layout 8
2.2 Pin Description 8
2.3 Strapping Pins 10
3 Functional Description 12
3.1 CPU and Internal Memory 12
3.2 External Flash and SRAM 12
3.3 Crystal Oscillators 12
3.4 RTC and Low-Power Management 13
4 Peripherals and Sensors 14
5 Electrical Characteristics 15
5.1 Absolute Maximum Ratings 15
5.2 Recommended Operating Conditions 15
5.3 DC Characteristics (3.3 V, 25 °C) 15
5.4 Wi-Fi Radio 16
5.5 Bluetooth LE Radio 17
5.5.1 Receiver 17
5.5.2 Transmitter 17
5.6 Reflow Profile 18
6 Schematics 19
7 Peripheral Schematics 21
8 Physical Dimensions 23
9 Recommended PCB Land Pattern 25
10 Dimensions of External Antenna Connector 27
11 Related Documentation and Resources 28
Revision History 29

List of Tables
1 ESP32-WROOM-32D vs. ESP32-WROOM-32U 6
2 ESP32-WROOM-32D and ESP32-WROOM-32U Specifications 7
3 Pin Definitions 8
4 Strapping Pins 10
5 Absolute Maximum Ratings 15
6 Recommended Operating Conditions 15
7 DC Characteristics (3.3 V, 25 °C) 15
8 Wi-Fi Radio Characteristics 16
9 Receiver Characteristics – Bluetooth LE 17
10 Transmitter Characteristics – Bluetooth LE 17

List of Figures
1 ESP32-WROOM-32D Pin Layout (Top View) 8
2 Reflow Profile 18
3 ESP32-WROOM-32D Schematics 19
4 ESP32-WROOM-32U Schematics 20
5 ESP32-WROOM-32D & ESP32-WROOM-32U Peripheral Schematics 21
6 Physical Dimensions of ESP32-WROOM-32D 23
7 Physical Dimensions of ESP32-WROOM-32U 24
8 Recommended PCB Land Pattern of ESP32-WROOM-32D 25
9 Recommended PCB Land Pattern of ESP32-WROOM-32U 26
10 Dimensions of External Antenna Connector of ESP32-WROOM-32U 27

1 Overview
1 Overview
ESP32-WROOM-32D and ESP32-WROOM-32U are powerful, generic Wi-Fi + Bluetooth + Bluetooth LE MCU
modules that target a wide variety of applications, ranging from low-power sensor networks to the most
demanding tasks, such as voice encoding, music streaming and MP3 decoding.
ESP32-WROOM-32U is different from ESP32-WROOM-32D in that ESP32-WROOM-32U integrates a connector

to connect an external antenna. For detailed information of the connector please see Chapter 10. Note that the
information in this data sheet is applicable to both modules. Any differences between them will be clearly
specified in the course of this document. Table 1 lists the difference between ESP32-WROOM-32D and
ESP32-WROOM-32U.
Table 1: ESP32WROOM32D vs. ESP32WROOM32U
Module ESP32-WROOM-32D ESP32-WROOM-32U

Core ESP32-D0WD ESP32-D0WD
SPI flash 32 Mbits, 3.3 V 32 Mbits, 3.3 V
Crystal 40 MHz 40 MHz
external antenna connector (which needs to be
Antenna on-board PCB antenna
connected to an external antenna)
Dimensions
18 × 25.5 × 3.1 (See Figure 6 for details) 18 × 19.2 × 3.2 (See Figure 7 for details)
(Unit: mm)
Schematics See Figure 3 for details. See Figure 4 for details.
At the core of the two modules is the ESP32-D0WD chip that belongs to the ESP32 series* of chips. The chip
embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled,
and the CPU clock frequency is adjustable from 80 MHz to 240 MHz. The chip also has a low-power
coprocessor that can be used instead of the CPU to save power while performing tasks that do not require much
computing power, such as monitoring of peripherals. ESP32 integrates a rich set of peripherals, ranging from
capacitive touch sensors, Hall sensors, SD card interface, Ethernet, high-speed SPI, UART, I2S and I2C.
Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.
The integration of Bluetooth® , Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for
battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.
The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.
Table 2 provides the specifications of ESP32-WROOM-32D and ESP32-WROOM-32U.

Espressif Systems 6 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
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1 Overview
Table 2: ESP32WROOM32D and ESP32WROOM32U Specifications
Categories Items Specifications

See certificates for ESP32-WROOM-32D and
RF Certification
ESP32-WROOM-32U
Certification Wi-Fi Certification Wi-Fi Alliance
Bluetooth certification BQB
Green Certification REACH/RoHS
Test Reliablity HTOL/HTSL/uHAST/TCT/ESD
802.11 b/g/n (802.11n up to 150 Mbps)
Protocols A-MPDU and A-MSDU aggregation and 0.4 µs guard
Wi-Fi
interval support
Center frequency range of operating
2412 ~ 2484 MHz
channel
Bluetooth v4.2 BR/EDR and Bluetooth LE specifica-
Protocols
tion
NZIF receiver with –97 dBm sensitivity
Bluetooth
Radio Class-1, class-2 and class-3 transmitter
AFH
Audio CVSD and SBC
SD card, UART, SPI, SDIO, I2C, LED PWM, Motor
PWM, I2S, IR, pulse counter, GPIO, capacitive touch
Module interfaces sensor, ADC, DAC, Two-Wire Automotive Interface
(TWAI® ), compatible with ISO11898-1 (CAN Specifi-
cation 2.0)
On-chip sensor Hall sensor
Integrated crystal 40 MHz crystal
Hardware 1
Integrated SPI flash 4 MB
Operating voltage/Power supply 3.0 V ~ 3.6 V
Operating current Average: 80 mA
Minimum current delivered by power
500 mA
supply
Recommended operating ambient tem-
–40 °C ~ +85 °C
perature range 2
Moisture sensitivity level (MSL) Level 3
Notice:
1. ESP32-WROOM-32D and ESP32-WROOM-32U with 8 MB flash or 16 MB flash are available for custom order.
2. ESP32-WROOM-32D and ESP32-WROOM-32U with high temperature range (–40 °C ~ +105 °C) option are avail-
able for custom order. 4 MB SPI flash is supported on the high temperature range version.
3. For detailed ordering information, please see ESP Product Selector.

2 Pin Definitions
2 Pin Definitions
2.1 Pin Layout
Keepout Zone
1 GND GND 38
2 3V3 IO23 37
3 EN IO22 36
4 SENSOR_VP TXD0 35
5 SENSOR_VN RXD0 34
6 IO34 IO21 33
39 GND
7 IO35 NC 32
8 IO32 IO19 31
9 IO33 IO18 30
10 IO25 IO5 29
11 IO26 IO17 28
12 IO27 IO16 27
13 IO14 IO4 26
CMD
GND
IO13
IO15
CLK
SD2
SD3
SD0
SD1
14 IO12 IO0 25
IO2
15
16
17
18
19
20
21
22
23
24
Figure 1: ESP32WROOM32D Pin Layout (Top View)

Note:
The pin layout of ESP32-WROOM-32U is the same as that of ESP32-WROOM-32D, except that ESP32-WROOM-32U
has no keepout zone.
2.2 Pin Description

The ESP32-WROOM-32D and ESP32-WROOM-32U have 38 pins. See pin definitions in Table 3.
Table 3: Pin Definitions
Name No. Type Function

GND 1 P Ground
3V3 2 P Power supply
EN 3 I Module-enable signal. Active high.
SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3
IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4
IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5

2 Pin Definitions
Name No. Type Function

GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
IO32 8 I/O
TOUCH9, RTC_GPIO9
GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,
IO33 9 I/O
TOUCH8, RTC_GPIO8
IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK,
IO14 13 I/O
SD_CLK, EMAC_TXD2
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2,
IO12 14 I/O
SD_DATA2, EMAC_TXD3
GND 15 P Ground
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3,
IO13 16 I/O
SD_DATA3, EMAC_RX_ER
SHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD* 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
SCK/CLK* 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD,
IO15 23 I/O
SD_CMD, EMAC_RXD3
GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
IO2 24 I/O
SD_DATA0
IO0 25 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
IO4 26 I/O
SD_DATA1, EMAC_TX_ER
IO16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7
IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 32 - -
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND 38 P Ground
Notice:
* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected
to the integrated SPI flash integrated on the module and are not recommended for other uses.

2 Pin Definitions
2.3 Strapping Pins

ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics:
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of
the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is
powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 4 for a detailed boot-mode configuration by strapping pins.
Table 4: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)

Pin Default 3.3 V 1.8 V
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
FE Sampling FE Sampling RE Sampling RE Sampling
Pin Default FE Output RE Output FE Output RE Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1

2 Pin Definitions
Note:
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.
• Both ESP32-WROOM-32D and ESP32-WROOM-32U integrate a 3.3 V SPI flash, so the pin MTDI cannot be set
to 1 when the modules are powered up.

3 Functional Description
This chapter describes the modules and functions integrated in ESP32-WROOM-32D and
ESP32-WROOM-32U.
3.1 CPU and Internal Memory

ESP32-D0WD contains a dual-core Xtensa® 32-bit LX6 MCU. The internal memory includes:
• 448 KB of ROM for booting and core functions.
• 520 KB of on-chip SRAM for data and instructions.
• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.
• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor
during the Deep-sleep mode.
• 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.
3.2 External Flash and SRAM

ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the
ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to
protect developers’ programs and data in flash.
ESP32 can access the external QSPI flash and SRAM through high-speed caches.
• The external flash can be mapped into CPU instruction memory space and read-only memory space
simultaneously.
– When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be
mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be
reduced due to speculative reads by the CPU.
– When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a
time. 8-bit, 16-bit and 32-bit reads are supported.
• External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time.
8-bit, 16-bit and 32-bit reads and writes are supported.
Both ESP32-WROOM-32D and ESP32-WROOM-32U integrate a 4 MB of external SPI flash. The integrated SPI
flash is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as
regular GPIOs.
3.3 Crystal Oscillators

The module uses a 40-MHz crystal oscillator.

3.4 RTC and LowPower Management

With the use of advanced power-management technologies, ESP32 can switch between different power
modes.
For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and
Low-Power Management” in ESP32 Datasheet.

4 Peripherals and Sensors
4 Peripherals and Sensors

Please refer to Section Peripherals and Sensors in ESP32 Datasheet.
Note:
External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to
the module’s integrated SPI flash. For details, please see Section 6 Schematics.

5 Electrical Characteristics
5.1 Absolute Maximum Ratings

Stresses beyond the absolute maximum ratings listed in Table 5 below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.
Table 5: Absolute Maximum Ratings
Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
1
Ioutput Cumulative IO output current - 1,100 mA
Tstore Storage temperature –40 105 °C
1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash
and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.
5.2 Recommended Operating Conditions
Table 6: Recommended Operating Conditions
Symbol Parameter Min Typical Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 - - A
T Operating ambient temperature –40 - 85 °C
5.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit

CIN Pin capacitance - 2 - pF
1 1
VIH High-level input voltage 0.75×VDD - VDD +0.3 V
1
VIL Low-level input voltage –0.3 - 0.25×VDD V
IIH High-level input current - - 50 nA
IIL Low-level input current - - 50 nA
VOH High-level output voltage 0.8×VDD1 - - V
VOL Low-level output voltage - - 0.1×VDD1 V
High-level source current VDD3P3_CPU power domain 1, 2 - 40 - mA
1 1, 2
(VDD = 3.3 V, VOH >= 2.64 V, VDD3P3_RTC power domain - 40 - mA
IOH
output drive strength set to the
VDD_SDIO power domain 1, 3
- 20 - mA
maximum)

Symbol Parameter Min Typ Max Unit

Low-level sink current
IOL (VDD1 = 3.3 V, VOL = 0.495 V, - 28 - mA
output drive strength set to the maximum)
RP U Resistance of internal pull-up resistor - 45 - kΩ
RP D Resistance of internal pull-down resistor - 45 - kΩ
VIL_nRST Low-level input voltage of CHIP_PU to power off the chip - - 0.6 V
Notes:
1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power
domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced
from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
5.4 WiFi Radio
Table 8: WiFi Radio Characteristics
Parameter Condition Min Typical Max Unit

Center frequency range of oper- - 2412 - 2484 MHz
note1
ating channel
Output impedance note2 - - note 2 - Ω
note3
TX power 11n, MCS7 12 13 14 dBm
11b mode 17.5 18.5 20 dBm
Sensitivity 11b, 1 Mbps - –98 - dBm
11b, 11 Mbps - –89 - dBm
11g, 6 Mbps - –92 - dBm
11g, 54 Mbps - –74 - dBm
11n, HT20, MCS0 - –91 - dBm
11n, HT20, MCS7 - –71 - dBm
11n, HT40, MCS0 - –89 - dBm
11n, HT40, MCS7 - –69 - dBm
Adjacent channel rejection 11g, 6 Mbps - 31 - dB
11g, 54 Mbps - 14 - dB
11n, HT20, MCS0 - 31 - dB
11n, HT20, MCS7 - 13 - dB
1. Device should operate in the center frequency range of operating channel allocated by regional regulatory authorities.
Target center frequency range of operating channel is configurable by software.
2. For the modules that use external antennas, the output impedance is 50 Ω. For other modules without external
antennas, users do not need to concern about the output impedance.
3. Target TX power is configurable based on device or certification requirements.

5.5 Bluetooth LE Radio

5.5.1 Receiver
Table 9: Receiver Characteristics – Bluetooth LE
Parameter Conditions Min Typ Max Unit

Sensitivity @30.8% PER - - –97 - dBm
Maximum received signal @30.8% PER - 0 - - dBm
Co-channel C/I - - +10 - dB
F = F0 + 1 MHz - –5 - dB
F = F0 – 1 MHz - –5 - dB
F = F0 + 2 MHz - –25 - dB
Adjacent channel selectivity C/I
F = F0 – 2 MHz - –35 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –45 - dB
30 MHz ~ 2000 MHz –10 - - dBm
2000 MHz ~ 2400 MHz –27 - - dBm
Out-of-band blocking performance
2500 MHz ~ 3000 MHz –27 - - dBm
3000 MHz ~ 12.5 GHz –10 - - dBm
Intermodulation - –36 - - dBm
5.5.2 Transmitter
Table 10: Transmitter Characteristics – Bluetooth LE
Parameter Conditions Min Typ Max Unit

RF transmit power - - 0 - dBm
Gain control step - - 3 - dBm
RF power control range - –12 - +9 dBm
F = F0 ± 2 MHz - –52 - dBm
Adjacent channel transmit power F = F0 ± 3 MHz - –58 - dBm
F = F0 ± > 3 MHz - –60 - dBm
∆ f 1avg - - - 265 kHz
∆ f 2max - 247 - - kHz
∆ f 2avg /∆ f 1avg - - –0.92 - -
ICFT - - –10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz

5.6 Reflow Profile

Temperature (℃)
Peak Temp.
235 ~ 250 ℃
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s
Ramp-up zone
1 ~ 3 ℃/s
100
50
25
Time (sec.)
0
0 50 100 150 200 250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 2: Reflow Profile
Note:
Solder the module in a single reflow.

D
Espressif Systems
6 Schematics
6 Schematics
Pin.1 Pin.15 Pin.38

GND GND GND
The values of C1 and C2 vary with GND GND GND
the selection of the crystal.
Pin.2 D1 Pin.16 Pin.37
LESD8D3.3CAT5G
3V3 IO13 IO23
GND VDD33 GPIO13 GPIO23
Pin.3 Pin.17 Pin.36
3
GND U1 GND
CHIP_PU/EN SD2 IO22
GND
GND XOUT
CHIP_PU SHD/SD2 GPIO22
XIN
C1 C2 Pin.4 Pin.18 Pin.35
22pF/6.3V(10%) 22pF/6.3V(10%)
VDD33 SENSOR_VP SD3 U0TXD
2
SENSOR_VP SWP/SD3 U0TXD
C3 C20 GND
100pF 1uF GND Pin.5 Pin.19 Pin.34
C 40MHz+/-10ppm
SENSOR_VN CMD U0RXD
0R
R1 20K(5%)
VDD33 GND GND C5 GPIO21 SENSOR_VN SCS/CMD U0RXD
10nF/6.3V(10%) C6 R3 499R U0TXD

U0RXD
C9 3.3nF/6.3V(10%) GPIO22 Pin.6 Pin.20 Pin.33
0.1uF
IO34 CLK IO21
R2
GND
GPIO34 SCK/CLK GPIO21
VDD33 GND
49
48
47
46
45
44
43
42
41
40
39
L5 2.0nH GND
Pin.7 Pin.21 Pin.32
GND
CAP1
CAP2
VDDA
XTAL_P
XTAL_N
VDDA
GPIO21
U0TXD
U0RXD
GPIO22
C11 C12 C13 C10 C21
1uF NC 10uF 0.1uF NC C4 VDD33 VDD_SDIO IO35 SD0 NC
0.1uF GPIO35 SDO/SD0
ANT1 GND GND GND GND GND

19
1 38 GPIO19 Pin.8 Pin.22 Pin.31

1 L4 TBD 2 VDDA GPIO19 37
LNA_IN VDD3P3_CPU IO32 SD1 IO19
8
2 3 36 GPIO23 U3
C15 C14 4 VDD3P3 GPIO23 35 GPIO18 SCS/CMD 1 5 SDI/SD1 GPIO32 SDI/SD1 GPIO19
VCC
TBD TBD C16 SENSOR_VP 5 VDD3P3 GPIO18 34 GPIO5 /CS DI
PCB ANT NC 6 SENSOR_VP GPIO5 33 SDI/SD1 SCK/CLK 6 2 SDO/SD0
7 SENSOR_CAPP SD_DATA_1 32 SDO/SD0 CLK DO
Pin.9 Pin.23 Pin.30
GND
SENSOR_VN8 SENSOR_CAPN SD_DATA_0 31 SCK/CLK SHD/SD2 7 3 SWP/SD3
SENSOR_VN SD_CLK /HOLD /WP IO33 IO15 IO18
ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.3
C17 CHIP_PU 9 30 SCS/CMD

NC GPIO34 10 CHIP_PU SD_CMD 29 SWP/SD3 FLASH GPIO33 GPIO15 GPIO18
GND GND GND
4
GPIO35 11 VDET_1 SD_DATA_3 28 SHD/SD2
GPIO32 12 VDET_2 SD_DATA_2 27 GPIO17
32K_XP GPIO17
The values of C14 、 L4 and C15 GPIO33 13 26 Pin.10 Pin.24 Pin.29
VDD3P3_RTC
GPIO25 14 32K_XN VDD_SDIO 25 GPIO16 GND
vary with the actual PCB board. GPIO25 GPIO16 IO25 IO2 IO5
GPIO25 GPIO2 GPIO5
GPIO26
GPIO27
GPIO2
GPIO0
GPIO4
MTMS
MTDO
MTCK
VDD_SDIO
MTDI
C18
1uF Pin.11 Pin.28
U2 ESP32-D0WD
IO26 IO17
15
16
17
18
19
20
21
22
23
24
B
Pin.12 Pin.27
GPIO26
GPIO27
GPIO14
GPIO12
GPIO13
GPIO15
GPIO2
GPIO0
GPIO4
C19
0.1uF IO27 IO16
GPIO27 GPIO16
GND
Pin.13 Pin.26
IO14 IO4
GPIO14 GPIO4
Pin.14 Pin.39 Pin.25

IO12 GND IO0
GPIO12 GND GPIO0
Figure 3: ESP32WROOM32D Schematics
A
D
Espressif Systems
6 Schematics
Pin.1 Pin.15 Pin.38
GND GND GND
The values of C1 and C2 vary with GND GND GND
the selection of the crystal.
Pin.2 D1 Pin.16 Pin.37
LESD8D3.3CAT5G
3V3 IO13 IO23
Pin.3 Pin.17 Pin.36
3
GND U1 GND
CHIP_PU/EN SD2 IO22
GND
GND XOUT
CHIP_PU SHD/SD2 GPIO22
XIN
C1 C2 Pin.4 Pin.18 Pin.35
22pF/6.3V(10%) 22pF/6.3V(10%)
VDD33 SENSOR_VP SD3 U0TXD
2
SENSOR_VP SWP/SD3 U0TXD
C3 C20 GND
100pF 1uF GND Pin.5 Pin.19 Pin.34
C 40MHz+/-10ppm
R1 20K(5%) SENSOR_VN CMD U0RXD
VDD33
0R
GND GND C5 GPIO21 SENSOR_VN SCS/CMD U0RXD
10nF/6.3V(10%) C6 R3 499R U0TXD
U0RXD
C9 3.3nF/6.3V(10%) GPIO22 Pin.6 Pin.20 Pin.33
0.1uF
IO34 CLK IO21
R2
GND
GPIO34 SCK/CLK GPIO21
VDD33 GND
49
48
47
46
45
44
43
42
41
40
39
L5 2.0nH GND
Pin.7 Pin.21 Pin.32
GND
CAP1
CAP2
VDDA
XTAL_P
XTAL_N
VDDA
GPIO21
U0TXD
U0RXD
GPIO22
C11 C12 C13 C10 C21
1uF NC 10uF 0.1uF NC C4 VDD33 VDD_SDIO IO35 SD0 NC
0.1uF GPIO35 SDO/SD0
GND GND GND GND GND

IPEX 1 38 GPIO19 Pin.8 Pin.22 Pin.31
J39 1 L4 TBD 2 VDDA GPIO19 37
LNA_IN VDD3P3_CPU IO32 SD1 IO19
8
3 36 GPIO23 U3
C15 C14 4 VDD3P3 GPIO23 35 GPIO18 SCS/CMD 1 5 SDI/SD1 GPIO32 SDI/SD1 GPIO19
VCC
2
TBD TBD C16 SENSOR_VP 5 VDD3P3 GPIO18 34 GPIO5 /CS DI

NC 6 SENSOR_VP GPIO5 33 SDI/SD1 SCK/CLK 6 2 SDO/SD0
7 SENSOR_CAPP SD_DATA_1 32 SDO/SD0 CLK DO
Pin.9 Pin.23 Pin.30
GND
SENSOR_VN8 SENSOR_CAPN SD_DATA_0 31 SCK/CLK SHD/SD2 7 3 SWP/SD3
C17 CHIP_PU 9 SENSOR_VN SD_CLK 30 SCS/CMD /HOLD /WP IO33 IO15 IO18
NC GPIO34 10 CHIP_PU SD_CMD 29 SWP/SD3 FLASH GPIO33 GPIO15 GPIO18
GND GND GND
4
GPIO35 11 VDET_1 SD_DATA_3 28 SHD/SD2
GPIO32 12 VDET_2 SD_DATA_2 27 GPIO17
20
32K_XP GPIO17
The values of C14 、 L4 and C15 GPIO33 13 26 Pin.10 Pin.24 Pin.29
VDD3P3_RTC
GPIO25 14 32K_XN VDD_SDIO 25 GPIO16 GND
vary with the actual PCB board. GPIO25 GPIO16 IO25 IO2 IO5
GPIO25 GPIO2 GPIO5
GPIO26
GPIO27
GPIO2
GPIO0
GPIO4
MTMS
MTDO
MTCK
VDD_SDIO
MTDI
C18
1uF Pin.11 Pin.28
U2 ESP32-D0WD
IO26 IO17
15
16
17
18
19
20
21
22
23
24
B
Pin.12 Pin.27
GPIO26
GPIO27
GPIO14
GPIO12
GPIO13
GPIO15
GPIO2
GPIO0
GPIO4
C19
0.1uF IO27 IO16
GPIO27 GPIO16
GND
Pin.13 Pin.26
IO14 IO4
GPIO14 GPIO4
Pin.14 Pin.39 Pin.25

IO12 GND IO0
GPIO12 GND GPIO0
Figure 4: ESP32WROOM32U Schematics
A
Espressif Systems
7 Peripheral Schematics
D
VDD33 VDD33
C1 10uF
GND
C2 0.1uF
GND UART DOWNLOAD
R1 GND U1
TBD 39 J1
1 P_GND 38
3
2
1
2 GND1 GND3 37 IO23
C
3V3 IO23
GND C3 TBD EN 3 36 IO22

SENSOR_VP 4 EN IO22 35 TXD
SENSOR_VP TXD0 GND
SENSOR_VN 5 34 RXD
IO34 6 SENSOR_VN RXD0 33 IO21
IO35 7 IO34 IO21 32
IO32 8 IO35 NC 31 IO19
IO33 9 IO32 IO19 30 IO18
IO33 IO18
21
IO25 10 29 IO5
IO26 11 IO25 IO5 28 IO17
IO27 12 IO26 IO17 27 IO16
13 IO27 IO16 26 IO4
IO14 IO4
14 25 IO0 GND
IO12 IO0
GND2
CMD
IO13
IO15
SD2
SD3
CLK
SD0
SD1
1
2
IO2
J2
15
16
17
18
19
20
21
22
23
24
BOOT OPTION
B
U2 GND
1 R2 100R MTMS
CMD
MTMS
SD2
SD3
CLK
SD0
SD1
2 R3 100R MTDI
IO2
MTDI 3 R4 100R MTCK
MTCK 4 R5 100R MTDO
MTDO
JTAG
MTDI should be kept at a low electric level when powering up the module.
Figure 5: ESP32WROOM32D & ESP32WROOM32U Peripheral Schematics
Espressif Systems
Title
Espressif Systems
Note:
• Soldering Pad 39 to the Ground is not necessary for a satisfactory thermal performance. If users do want to solder it, they need to ensure that the correct quantity of soldering
paste is applied.
• To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is
usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing
of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32 Datasheet.
22
8 Physical Dimensions
Unit: mm
3.10±0.15
6.19
6.19
0.80 0.85
0.45
25.50±0.15
3.60
0.90
0.90
17.60
0.1
3.60
16.51
15.80
1.27
0.90
10.29
1.50
0
Ø0.5
10.50
0.85
1.05
8.89
11.43
18.00±0.15
Top View Side View Bottom View
Figure 6: Physical Dimensions of ESP32WROOM32D

Unit: mm
3.20±0.15
3.07
3.27 0.85
0.45 0.80
10.75
3.60
0.90
0.90
17.50
19.20±0.15
0.1
3.60
16.51
15.65
1.27
0.90
10.29
13.05
1.50
1.15
10.50
1.18 0.85
8.89
11.43
18.00±0.15
Top View Side View Bottom View
Figure 7: Physical Dimensions of ESP32WROOM32U
Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.

9 Recommended PCB Land Pattern
Unit: mm
Via for thermal pad
Copper
18.00
6.19
Antenna Area
38x1.50
1 3.70 38
0.90
0.50
38x0.90
25.50
16.51
1.27
7.50
10.29
1.50
1.50
0.50
0.90
3.70
14 15 24 25
1.27 0.50
0.50
11.43 3.28
Figure 8: Recommended PCB Land Pattern of ESP32WROOM32D

Unit: mm
Via for thermal pad
Copper
18.00
38x1.50
1 3.70 38
0.90
0.50
38x0.90
16.51
19.20
1.27
7.50
10.29
1.50
1.50
0.50
0.90
3.70
14 15 24 25
1.27 0.50
0.50
11.43 3.28
Figure 9: Recommended PCB Land Pattern of ESP32WROOM32U

10 Dimensions of External Antenna Connector
10 Dimensions of External Antenna Connector
Unit: mm
Figure 10: Dimensions of External Antenna Connector of ESP32WROOM32U

11 Related Documentation and Resources
11 Related Documentation and Resources

Related Documentation
• ESP32 Technical Reference Manual – Detailed information on how to use the ESP32 memory and peripherals.
• ESP32 Hardware Design Guidelines – Guidelines on how to integrate the ESP32 into your hardware product.
• ESP32 ECO and Workarounds for Bugs – Correction of ESP32 design errors.
• Certificates
https://espressif.com/en/support/documents/certificates
• ESP32 Product/Process Change Notifications (PCN)
https://espressif.com/en/support/documents/pcns
• ESP32 Advisories – Information on security, bugs, compatibility, component reliability.
https://espressif.com/en/support/documents/advisories
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF Programming Guide for ESP32 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos
Products
• ESP32 Series SoCs – Browse through all ESP32 SoCs.
https://espressif.com/en/products/socs?id=ESP32
• ESP32 Series Modules – Browse through all ESP32-based modules.
https://espressif.com/en/products/modules?id=ESP32
• ESP32 Series DevKits – Browse through all ESP32-based devkits.
https://espressif.com/en/products/devkits?id=ESP32
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions

Revision History
Revision History
Date Version Release notes

Updated Table 1
Added a link to RF certificates in Table 2
Updated Table 5
2022.03 v2.3
Added a note below Figure 7
Updated the description to the connector
Added Section 11: Related Documentation and Resources
Replaced Espressif Product Ordering Information with ESP Product Selector
2021.08 v2.2 Updated the description of TWAI in Table 1
Labeled this document as (Not Recommended For New Designs)
Updated Figure 6: Physical Dimensions of ESP32-WROOM-32D, Figure 7: Physical
Dimensions of ESP32-WROOM-32U, Figure 8: Recommended PCB Land Pattern of
ESP32-WROOM-32D, and Figure 9: Recommended PCB Land Pattern of ESP32-
WROOM-32U.
2021.02 V2.1
Modified the note below Figure 2: Reflow Profile.
Modified the note below Figure 5: ESP32-WROOM-32D & ESP32-WROOM-32U
Peripheral Schematics.
Updated the trade mark from TWAI™ to TWAI® .
Added TWAITM in Table 1;
Added a note under Figure 2: Reflow Profile;
2020.11 V2.0
Updated the C value in RC delay circuit from 0.1 µF to 1 µF;
Provided feedback link.
• Changed the supply voltage range from 2.7 V ~ 3.6 V to 3.0 V ~ 3.6 V;
• Added Moisture sensitivity level (MSL) 3 in Table 2 ESP32-WROOM-32D and
ESP32-WROOM-32U Specifications;
• Added notes about ”Operating frequency range” and ”TX power” under Table
2019.09 V1.9
8 Wi-Fi Radio Characteristics;
• Updated Section 7 Peripheral Schematics and added a note about RC delay
circuit under it;
• Updated Figure 8 and Figure 9 Recommended PCB Land Pattern.
2019.01 V1.8 Changed the RF power control range in Table 10 from –12 ~ +12 to –12 ~ +9 dBm.
Added notice on module custom options under Table 2;
2018.10 V1.7 Added ”Cumulative IO output current” entry to Table 5: Absolute Maximum Ratings;
Added more parameters to Table 7: DC Characteristics.
2018.09 V1.6 Updated the hole diameter in the shield from 1.00 mm to 0.50 mm, in Figure 6.
• Added certifications and reliability test items the module has passed in Table 2:
ESP32-WROOM-32D and ESP32-WROOM-32U Specifications, and removed
software-specific information;
2018.08 V1.5 • Updated section 3.4: RTC and Low-Power Management;
• Changed the modules’ dimensions;
• Updated Figure 8 and 7: Physical Dimensions;
• Updated Table 8: Wi-Fi Radio.

Revision History
Date Version Release notes

• Deleted Temperature Sensor in Table 2: ESP32-WROOM-32D & ESP32-
WROOM-32U Specifications;
• Updated Chapter 3: Functional Description;
• Added notes to Chapter 7: Peripheral Schematics;
• Added Chapter 8: Recommended PCB Land Pattern;
2018.06 V1.4 Changes to electrical characteristics:
• Updated Table 5: Absolute Maximum Ratings;
• Added Table 6: Recommended Operating Conditions;
• Added Table 7: DC Characteristics;
• Updated the values of ”Gain control step”, ”Adjacent channel transmit power”
in Table 10: Transmitter Characteristics - BLE.
Updated Figure 4 ESP32-WROOM-32U Schematics and Figure 3 ESP32-WROOM-
2018.04 V1.3
32D Schematics.
2018.02 V1.2 Update Figure 4 ESP32-WROOM-32U Schematics.
Updated Chapter 6 Schematics.
Deleted description of low-noise amplifier.
2018.02 V1.1 Replaced the module name ESP-WROOM-32D with ESP32-WROOM-32D.
Added information about module certification in Table 2.
Updated the description of eFuse bits in Section 3.1.
2017.11 V1.0 First release.

Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-
INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property
www.espressif.com of their respective owners, and are hereby acknowledged.
Copyright © 2022 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.

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ESP32­WROOM­32D &

Documentation Change Notification

Not Recommended For New Designs (NRND)

4 Peripherals and Sensors 14

9 Recommended PCB Land Pattern 25

10 Dimensions of External Antenna Connector 27

11 Related Documentation and Resources 28

Not Recommended For New Designs (NRND)

Not Recommended For New Designs (NRND)

Not Recommended For New Designs (NRND)

ESP32-WROOM-32U is different from ESP32-WROOM-32D in that ESP32-WROOM-32U integrates a connector

Table 1: ESP32­WROOM­32D vs. ESP32­WROOM­32U

Module ESP32-WROOM-32D ESP32-WROOM-32U

Table 2 provides the specifications of ESP32-WROOM-32D and ESP32-WROOM-32U.

Not Recommended For New Designs (NRND)

Table 2: ESP32­WROOM­32D and ESP32­WROOM­32U Specifications

Categories Items Specifications

3. For detailed ordering information, please see ESP Product Selector.

Not Recommended For New Designs (NRND)

Figure 1: ESP32­WROOM­32D Pin Layout (Top View)

2.2 Pin Description

Table 3: Pin Definitions

Name No. Type Function

Not Recommended For New Designs (NRND)

Name No. Type Function

Not Recommended For New Designs (NRND)

2.3 Strapping Pins

After reset release, the strapping pins work as normal-function pins.

Refer to Table 4 for a detailed boot-mode configuration by strapping pins.

Table 4: Strapping Pins

Voltage of Internal LDO (VDD_SDIO)

Not Recommended For New Designs (NRND)

Not Recommended For New Designs (NRND)

3.1 CPU and Internal Memory

• 448 KB of ROM for booting and core functions.

• 520 KB of on-chip SRAM for data and instructions.

3.2 External Flash and SRAM

3.3 Crystal Oscillators

Not Recommended For New Designs (NRND)

3.4 RTC and Low­Power Management

Not Recommended For New Designs (NRND)

4 Peripherals and Sensors

Not Recommended For New Designs (NRND)

5.1 Absolute Maximum Ratings

Table 5: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

5.2 Recommended Operating Conditions

Table 6: Recommended Operating Conditions

Symbol Parameter Min Typical Max Unit

5.3 DC Characteristics (3.3 V, 25 °C)

Table 7: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

Not Recommended For New Designs (NRND)

Symbol Parameter Min Typ Max Unit

5.4 Wi­Fi Radio

Table 8: Wi­Fi Radio Characteristics

Parameter Condition Min Typical Max Unit

ESP32WROOM32D &

Table 1: ESP32WROOM32D vs. ESP32WROOM32U

Table 2: ESP32WROOM32D and ESP32WROOM32U Specifications

Figure 1: ESP32WROOM32D Pin Layout (Top View)

3.4 RTC and LowPower Management

5.4 WiFi Radio

Table 8: WiFi Radio Characteristics

Figure 3: ESP32WROOM32D Schematics

Figure 4: ESP32WROOM32U Schematics

Figure 5: ESP32WROOM32D & ESP32WROOM32U Peripheral Schematics

Figure 6: Physical Dimensions of ESP32WROOM32D

Figure 7: Physical Dimensions of ESP32WROOM32U

Figure 8: Recommended PCB Land Pattern of ESP32WROOM32D

Figure 9: Recommended PCB Land Pattern of ESP32WROOM32U

Figure 10: Dimensions of External Antenna Connector of ESP32WROOM32U