Service Manual: JBL FLIP3 (S/N Starting With ND)
Service Manual: JBL FLIP3 (S/N Starting With ND)
Service Manual: JBL FLIP3 (S/N Starting With ND)
Orange Pink
CONTENTS
Technical Specifications 2
Safety Instruction, Warning & Notes 3
Reset Instruction 4
Set Block Diagram 5
Set Wiring Diagram 6
Disassembly Instruction 7
Schematic Diagrams 8
PCB Layout Diagrams 9
Mechanical Exploded view 10
Spare Parts List 11
Revision List 12
Released Global Quality 2015 Harman Consumer Group, Inc. Rev 1.3 Nov./2015
8500 Balboa Boulevard
Northridge, California 91329
Technical Specifications
1 Audio Section
1.1.2 Microphone
Short Circuit Protection at Output Stage The amplifier should be protected so that no functional failure
occurs when it is operated with a short across its output stage
for 2 minutes. The amplifier should recover after removing the
short condition.
DC Offset Protection The amplifier with output power of higher than 50W per channel
must ensure that no DC is available at its output in normal mode
as well as abnormal/faulty condition mode.
Thermal Protection There should not be any breakdown or activation of any
protection circuit during the entire thermal profile test. Refers to
the Thermal Profile test stated in Reliability Test Plan for
Multimedia Powered Speaker System.
Output Power Duration FTC requirement:
Warm-up or preconditioning period at 1/8 power for 1 hour,
followed by 5 minutes of continuous Rated Output Power (ROP).
Channels in the same frequency range are tested at ROP.
Subwoofer is tested separately.
IEC requirement :
Output power distortion limited of 60 sec
Short-term maximum output power of 1 sec
Long-term maximum output power of 1 minutes
Temperature-limited output power infinitely
Description Specification
Bluetooth Standard Version 4.1
Frequency Band 2.402 – 2.480 GHz
Host Interface UART
Profile Supported HFP (Audio Gateway and Handsfree)
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio/Video Remote Control Profile)
Refer SRD
Audio Codec SBC (Subband Codec)
Data Rate 2.1Mbps (over the air)
300Kbps (over UART)
Antenna External
Certification CE, FCC, BQE
Description Specification
Maximum Transmit Power @ antenna 0 ~ 4dBm(class II)
connector
Power Control Maximum Power Step <=8dB
Minimum Power Step >=2dB
Initial Carrier Frequency Shift +/- 75KHz
Carrier Drift
- Drift Rate +/- 20KHz/50us
- Drift (Single Slot Packet) +/- 25KHz
- Drift (Three Slot Packet) +/- 40KHz
- Drift (Five Slot Packet) +/- 40KHz
Modulation Characteristic
- F1avg 140KHz – 175KHz
- F2 Max Pass rate >=115KHz
- F1/F2 Ratio >= 0.8
Description Specification
Single Slot Sensitivity @ <=0.1%BER <= -85dBm
Multiple Slot Sensitivity @ <=0.1%BER <= -85dBm
Maximum Input Level @ <= 0.1% BER >= -20dBm
Description Specification
Antenna VSWR Typical : 1.5 Limit : 1.7
Antenna Return Loss Typical: -14dB Limit :-12dB
Antenna Radiation Efficiency >= 40%
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field effect transistors and
The following techniques should be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on
your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges
5. Do not use freon-propelled chemicals. These can generate electrical change sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement
ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material.)
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the
CAUTION : Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together
or your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES devices.
Components identified with the IEC symbol in the parts list are special significance to safety. When replacing a component identified with
, use only the replacement parts designated, or parts with the same ratings or resistance, wattage, or voltage that are designated in the
parts list in this manual. Leakage-current or resistance measurements must be made to determine that exposed parts are acceptably
insulated from the supply circuit before retuming the product to the customer.
SAFETY PRECAUTIONS
Reading should
not be above
Leakage
0.5mA
Device current
under tester
test
Test all
exposed metal
surfaces
Also test with
plug reversed
(Using AC adapter Earth
plug as required) ground
AC Leakage Test
HW reset:
Hold down the buttons “Bluetooth & VOL+ & VOL-” for 2 seconds key in Power On mode.
Factory reset:
Hold down the buttons “Phone & VOL+” for 5 seconds in Power On mode.
• BC8670
Release Power
LM13700/JRC1
32Mbi /A ack detect
3700 me LM393
t SPI
Audio
Aux_in flash 4ohm x2
detect TI
OP OP
BT BA4510 BA4560 Class D
8W x2
Antenna TPA3130
ToolsList
序号 名称 备注
(Number) (Name) (Remark)
小号电批头
1 2
Screw
1 2.0
driver
(small)
中号电批头
Screw
2 30
3.0
driver
(middle)
一字螺丝刀(包美纹胶纸)’-
一字螺丝刀(包美纹胶纸)
3 翘刀Knife 3 4
’typeknife(wrappedbytape)
电批
electrical
4
screw
driver
Z型电批
批 Z type screw driver
1 2 Wrapping body 1 3 4
3 4
5.用电批将双色件正面如上图6颗螺丝Take
4.用Z型电批将产品双色件两头的4颗螺丝取下
4 用Z型电批将产品双色件两头的4颗螺丝取下 off the 6 screws
offthe6screws
(批头用2.0)Takeoffthescrewsas
showedattwoends. 6.取下并将双色件拆除(批头用2.0)Take
offthewrappingbody
ff th i b d
3 3
1 1 6 5 2
4 4
6 6
5 2 5 2
1 3 4
3 2 7 6
1 4 5 8
9.将LED灯板及按键板的13PIN及6PIN排线
9 将LED灯板及按键板的13PIN及6PIN排线
(FPC),拔拆方法为将贴片FPC插座扣位90°
翻起后再将排线取出,再将PCB板取下(底部
备3M胶)Take off the 13pin cable and 6pin
备3M胶)Takeoffthe13pincableand6pin 10.用电批将左右喇叭共计
10 用电批将左右喇叭共计 计8颗螺丝取下(批头 11 先将腔体左侧电池5P排插线从主板上取下
11.先将腔体左侧电池5P排插线从主板上取下,
cable,andtakeofftheLED/KEYboard 用3.0),并将喇叭排插线 线从主板上取下Take 再用翘刀将PCB板两边固定黄胶翘开清理干净
off8pcsscrewsandta
akeoffthespeaker Takeoffthe5pincablefirstlyandclean
cable
bl th l
theglueasshowedinyellow
h di ll
R706
OUT_1
NC/0 ohm
lim_ref
2.43k/NC
C707
R730
51/NC
47pF
C721 R728
2.43k/NC
AGND
R705
22k
82pF/NC R726
6.8K/NC
AGND C711 54.9k/NC 10V R732
R713 56k/NC
1uF OP_lim_10V
C770 390PF/NC 4.7UF/NC 909K/nc
56k/NC
R722 C724 OUT_1
1k/NC AGND R755
1
8
R720 R724 C764
4
2
U10A 10UF/nc 1%
IN1+
IN1-
V-
OUT1
AMP_BIAS_IN1
D_BIAS_1
BUFFER_IN1
BUFFER_OUT1
4
OUT1
PIN1
NIN1
3
BT_SPK_LN C701 4.7UF R701 15K AGND 1% 1% U13A R751
A
SATT_BIAS
AMP_BIAS_IN2
+
7 2
BUFFER_OUT2
C713 B
BUFFER_IN2
6 AGND
NC 91K/NC 100K/NC
VCC+
OUT2
D_BIAS_2
NIN2
PIN2
B OP_lim_10V B
R734
OUT2
IN2-
56k/NC
5
15
14
13
12
11
10
3
10V
1
100NF/NC
R731 AGND
SPKRN
SPKLN
OP_lim_10V
VCC_AMP_10V
L701
VCC_AMP L705
100 @ 100MHz
C737 C738 1 2
220UF + 100NF C739
+ C736 R749
C735 R747 C753
220UF 16V 16V 1NF C751 330PF
100NF 16V 0.68UF 1% TP23
16V 22 25V
AMP_SDZ
C AGND C755 330PF C
J3
AGND SPKRP
R748 1
AGND R738 1K 330PF
AGND 2
U6 C752 330PF AGND
22 C754 3
C740 1UF 1 32 C756 SPKRN
MODSEL PVCC 0.68UF
OUT_1 2 31 B 3B-EH-A
SDZ PVCC 25V
R754 0 OHM 3 30 220NF C759
FAULTZ BSPR
4 29 L706 R750 TP24
RINP OUTPR
C741 1UF 5 28 3.3 OHM
AGND RINN GND AGND
6 27 25V 1 2
PLIMIT OUTNR
C742 1uF GVDD 7 26
AGND GVDD BSNR
R739 8 25 C758 220NF
GAIN/SLV GND AGND
C743 R756 9 24
AGND GND BSPL
OUT_2 L_in_3130 10 23 25V C757
LINP OUTPL
1UF 11 22
LINN GND AGND
Mute 12 21
MUTE OUTNL
Thermal Pad
13 20 C760 220NF
AGND AM2 BSNL
C744 1UF 14 19 25V
AM1 PVCC
15 18 L704 TP25
AM0 PVCC
VCC_AMP 16 17 220NF
SYNC AVCC
25V 1 2
AGND TPA3130D2 C746 J6
R744
33
R757 1 2 0.68UF
100K 25V
AGND
D D
AGND
Title
1 2 3 4 5 6 7 8
VBAT_DCIN_DETECT
2 3 USB+5V 2 3 Q16
THOSE SPECIFICALLY AUTHORIZED IN WRITING BY HARMAN INTERNATIONAL REV ECO CHECKED DATE
R141 Q18
47k R142 R144 R145 0.1 first release MC Lee 2014 Sep 4
220k 47k 470k
1
1
AGND AGND
VBAT_DET 10NF DC_detect
3
3
10V 10K
D J1
GND
4
AGND C116 C117
VBAT_DCIN_DETECT
1
Q17
MMBT3904
R143
100K C122
10NF
C123 R150
1
Q15
MMBT3904 R146
100K
C127
10NF
10V
C128
10NF
10V
VCC_BT
D
3
GND NC NC 10V
2 AGND 10K
GND R100 R180
1 R149
RF
2
2
100k Mark
0 OHM
ATOM Mini RF CONN 1: 3od 0:TCL
5% R181
DC_detect AGND HW_DET
AGND
AGND VBAT_DET 5% BT_SPK_RP AGND AGND
NC
VCC_switch_3V3 R108 3.3K BT_SPK_RN
BT_SPK_LP
R107 BT_SPK_LN
R135 C113 3.3K 5%
10 ohm 10NF
5% 10V AGND
Microphone_in BT_1V8 VCC_switch_3V3
Mic_BIAS_A
74
73
72
71
70
69
68
67
66
65
64
63
62
61
2
U1
BM880F3 R185 R184
V+
NO1
ANT
GND
GND
GND
GND
GND
AIO1
AIO0
SPKR_RP
SPKR_LP
PCM_CLK
SPKR_RN
SPKR_LN
MIC_BIAS_A
Aux_in_mic_com1
3 10 0 ohm NC
COM1 NO2
VCC_BT
TP47
AUX_in_mic_Ctr
4 SW1 9 Aux_in_mic_com2 C118
I
IN1 COM2
SD20 10V 10UFAux_in_mic_com1
NC1 I
IN2 AGND PCM_SYNC MIC_BIAS_B
NC2
3
AUX_IN_R BT_SPI_MISO 6 55 R188
SPI_MISO GND AGND Q12 1K
BT_SPI_CSB 7 54 10K Boost_EN
SPI_CS# PIO24 2SC2712
BT_SPI_MOSI 8 53 1
R147 SPI_MOSI PIO22
AGND 9 52 VREG_EN D750
100k AGND GND VREG_ENABLE R111 C121
10 51 BT_VDD5 2
RST# VDD5 R153 12K R120 3.3NF
Charge_in_EN 11 50 VCC_BT VCC_switch_3V3 3
UART_RTS# CHG_EXT
2
12 49 R781 NC 2.2M 1 25V
UART_CTS# VBAT_SENSE L105 150K
13 48 1.5UH
UART_RX VBAT
3
3
Q14 C105 14 47 C100 C101 C102 33 BAT54C
1uF UART_TX VOUT1V8 BT_1V8 Q11 R121
MMBT3904 R151 PWR_LED_white 15 46 BT_VDD_MEM R148 C103
6.3V LED0 VDD_MEM C107 2SC2712 1M
1 10K BT_blue_LED 16 45 100NF 1NF 10NF 10UF AUX_R_CH 1
LED1 VDD_PADS
JBL_link_white_LED 17 44 10V 6.3V
LED2 GND R782 C133
HW_DET 18 43 16V 1uF
PIO0 USB_D- ESD0603V12C03 1uF
AGND AMP_MUTE 19 42 6.3V
PIO1 USB_D+
2
2
AUX_in_mic_Ctr R161 1k 20 41 6.3V
PIO2 GND
21 40 AGND AGND AGND VCC_audio_3V3
PIO3 I2C_SDA AGND
SW_POWER 22 39 AGND AGND
PIO4 I2C_SCL R114
AGND AMP_SDZ 23 38 AGND
TP27 PIO5 PIO28
R102 22 USB_D-
TP28 12K
1% 1% AGND AGND
3.32K OHM 0 OHM R110
R101
3
2.2M
PIO10
PIO11
PIO12
PIO13
PIO14
PIO15
PIO27
PIO25
PIO26
PIO23
PIO21
J7 R128 22 USB_D+ 33
GND
PIO8
PIO9
R129 Q10
L101 82nHAUX_R_CH 10V C120 10UF AUX_IN_R R106 C104
1
B
L102 82nH AUX_L_CH 1 2SC2712
2 R32
3
AUX_L_CH 10V C80 10UF AUX_IN_L I2C_DAT0 R126 33 OHM I2C_DAT
B
24
25
26
27
28
29
30
31
32
33
34
35
36
37
USB+5V C183
R133 100NF Cannot open file M:\02
VREG_EN 47k
R131 16V Department\19 Harman Consumer Group
J5
0 OHM
VREG_EN HARMAN INTERNATIONAL HCG_Engineering\Service\PC
5% B\Design_Template\Sch Shenzhen, Guangdong, China
3
1 0805 template
USB_D- AGND C108
2
3
USB_D+ C109 Q8 1 NAME DATE TITLE
A 4
B 4B-PH-K-S
470k
R132
1uF FDV301N
220nF
6.3V CREATED Alan Sun 2014 Sep 05
A
2
R134 470k
R130 CHECKED MC lee 2014 Sep 05
0 OHM TP32
AGND AGND SIZE DRAWING NO. REV.
5%
0805 TP33
B
AGND AGND
Mark SCALE: CAD FILE: SHEET OF
4 3 2 1
A A
VCC_switch_3V3
R136
VCC_IO_expander_3V3 10
AGND
AGND
R155 R156
C151 4.7K 4.7K C152
100NF 100NF C135
AGND
U2
100NF
I2C_INT 1 24 C134 1NF
/INT VCC
2 23 I2C_DAT
AGND A1 SDA
I2C_RESET 3 22 I2C_CLK
/RESET SCL
4 21
P00 A0 AGND
5 20 33 R609 Phone Key
P01 P17
red_led_battery (5-15)% 200 R600 6 19 33 R154 BT Key
P02 P16
white led battery(15-30%) 200 ohmR601 7 18 33 R608 Link key
P03 P15
white led battery(30-45%) 200 R602 8 17
P04 P14
white led battery(45-60%) 200 R603 9 16
P05 P13
white led battery(60-75%) 200 R604 10 15
P06 P12
white led battery(>75%) 200 R605 11 14 33 R607 Vol+
P07 P11
12 13 33 R606 Vol-
GND P10
VCC_IO_expander_3V3 TCA1116(PW)
AGND
B B
R610 R611 R612 R613
10k 10k 10k 10k
J10
BT_reset_in 6 TP5
BT Key 5
Vol- 4 TP6
Vol+ 3
Phone Key 2 TP7
1
TP8
0.5S-CX-6PWB
C136 C137 C138 C139
1NF 1NF 1NF 1NF TP9
TP4
AGND
C191
VCC_switch_3V3 100NF AGND
0.5S-CX-13PWB
J9
13 TP10
Link key 12
PW_KEY 11 TP11
PWR_LED_white 10
BT_blue_LED 9 TP12
JBL_link_white_LED 8
white led battery(>75%) 7 TP13
C white led battery(60-75%) 6 C
white led battery(45-60%) 5 TP14
white led battery(30-45%) 4
white led battery(15-30%) 3 TP15
red_led_battery (5-15)% 2
1 TP17
VCC_BT
TP18
J2
C140 C141 C142 C143 C144 C145 C146 C147 C148 C149 C150 TP19
1NF 1NF 1NF 1NF 1NF 1NF 1NF 1NF 1NF 1NF 1NF 1
BT_SPI_MOSI
2
TP20 BT_SPI_CLK
3
BT_SPI_MISO
4
TP21 BT_SPI_CSB
5
AGND
AGND 6
TP22
B 6B-PH-K-S
D D
Title
1 2 3 4 5 6 7 8
Mark
A A
NC
R193
VCC_3V3
JBL_Link_key
C192 10nF
AGND
power
R201
TP46
J11
10K
1 TP45
B AGND R194 B
2
3 TP44
NC
4
5 TP43
R190 R189 6
200 ohm 200 ohm 7 TP42
R198 8
white power 200 R197 R199 R200 Battery >75% white 9 TP41
D21 200 200 ohm 200 ohm 10
A
A
K
TP36
K
JBL_Link_white LED
AGND
AGND AGND AGND AGND AGND AGND
Battery 30-45% white
Battery <15% Red
Battery 45-60% white
C C
Mark
D D
Title
1 2 3 4 5 6 7 8
A A
Mark
TP51 TP54
R169
AGND
100k TP50 TP52
TP55
R168 TP53
C154
100k
1UF
R191
10V
R167
NC
100k
J100
BT_Key BT_rsset_in_1 6
5
4
3
2
B V- 1 B
0.5S-CX-6PWB
R192
NC
AGND
V+
R195
NC
phone
R196
NC
AGND
C C
Mark
D D
Title
1 2 3 4 5 6 7 8
charge2_sys_5V
1% charge_in_VCC
R423 R504
C404 0.01ohm
5.6k
AGND
NTC R404 100nF C511
R503 R516
1% 1K 0.01ohm
R424 VCC_AMP_10V
Charge_in_EN
R414 2.2ohm
18.2k 1nF
15K
R502
0.01ohm Q1 MTB04N03
AGND C410 charge_in_5V
1 8 Q2
A AGND S D A
2 7
R501 L501 S D
PWIN
17
16
15
14
13
21
20
19
18
17
MP2637 1% 1% 22uF 25V 22uF 25V 22uF 25V 22UF 100K MTP2603
VB
VCC
TMR
ILIM
EN
PWIN
PGND
PGND
SW
SW
SW
5.1k 5.1k C507 R513
100nF 24K 22UF 22UF 25V
USB+5V 100 @ 100MHz 19 12 25V 25V R515
MODE REG R510 1K
charge_in_5V AGND 1 16
L402 BST AGND AGND
20 11 /ACOK TP400 different pair U7 C505
VIN ACOK 0 OHM R512
SDR 2 MP9428 15
SDR SS AGND
3
C400 C401 C430 charge2_sys_5V 21 10 charge_sys_FB AGND AGND same length 220k
C426 C424 SYS FB
C414 Boost_10V 3 14 33NF AGND
100nF 1uF C405 L401 OUT FB R505
100NF 22UF 22UF 22UF 22UF 1 2 22 9 NTC Q3 1 SYS_PWR_SHUTDOWN
1uF SW NTC R506
6.3V 6.3V C415 Boost_EN 4 13 C506 2.2nF MMBT3904
EN COMP 47K
CKCD5D28-2.2μH/N 23 8
PGND ISET 100K R509
5 12
R407 MODE VDD
2
R441 24 7 R507 34k R514 C512
NC PGND OLIM R517 15k 10NF
AGND AGND AGND 6 11 100K
0.02 ohm 5% SENSE IN C159
TP1 1% AGND
BOOST
5% 200 OHM
AGND
0805
BATT
0805
CSP
N/C
PGND
PGND
PGND
VBAT_1 R420 68K NC 2.2uF
5 C416 51k
SW
SW
AGND AGND AGND
4 NC
C409 C407 C406 AGND
3
3
1
C408
2
10
22
100NF 22UF 22UF 1uF AGND
1 R431
/BOOST
TP3 10V Q4 1
NC USB+5V 3428_SW
NC
AGND AGND U8
1 5
VOUT V+
2
R429 R427
Q21 R437
USB_D- nc
R432 R172 MMBT3904
charge2_sys_5V 1
NC
100K 10K
2
AGND AGND
AGND
MTP3401N3 MTP3401N3
Q5 Q6
VBAT_1 2 3 3 2
C425 TP48
1% 1uF VCC_switch_3V3
R433 C427 USB+5V
1
2
R436 10 ohm GND C403 5.1
MMBT3904 C428 1N4148WS C420 3 4
R434 100K R442 5% C419 EN BP/FB 100NF
Deep_Sleep 1 R419 10UF
Q7 4.7K 0603 100NF 1NF 10K C412 C417
47k C429 100NF
1% 4.7uF SW_POWER C418 10UF SD35 10V
1%
1
100k NC D401
BAT54C
AGND AGND AGND
3
VCC_switch_3V3
R439
33k Hand_Reset
3
Q407
R440 MMBT3904
1
3
Q408 1k
R438 MMBT3904 5%
D BT_reset_in 1 D
2
Title
AGND AGND AGND
AGND
Size Number Revision
A2
Date: 2015/3/17 Sheet of
File: D:\e\..\power(20150105).SchDoc Drawn By:
1 2 3 4 5 6 7 8
Mark
A A
4
ID 4
5
GND
B 4B-PH-K-S
C800 C801 C802
0
NC ESD0402V18C15
ESD0402V18C15
MICRO_USB_5P_UR1-069A
AGND
C803 C804
ESD0402V18C15 ESD0402V18C15
J310
J301 2
1
Mark
2
4
3
3
PJ-321B B 3B-PH-K-S
C C
D D
Title
1 2 3 4 5 6 7 8
Version 1.0
Initial Release for JBL FLIP3.
Version 1.1
Update on Page 11 for Grille Ass’y Part Numbers.
Version 1.2
Add Position Number for part list on Page 11
Version 1.3
Grille Ass'y P/N on Page 29 updated.