 STP40NF03L

N - CHANNEL 30V - 0.020 Ω - 40A TO-220

STripFET POWER MOSFET
TYPE V DSS R DS(o n) ID
STP40NF03L 30 V < 0.022 Ω 40 A
www.DataSheet4U.com = 0.020 Ω
■ TYPICAL RDS(on)

■ LOW THRESHOLD DRIVE

DESCRIPTION
This Power MOSFET is the latest development of
STMicroelectronics unique ”Single Feature
Size” strip-based process. The resulting 3
2
transistor shows extremely high packing density 1
for low on-resistance, rugged avalanche
characteristics and less critical alignment steps TO-220
therefore a remarkable manufacturing
reproducibility.

APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING

■ SOLENOID AND RELAY DRIVERS INTERNAL SCHEMATIC DIAGRAM

■ MOTOR CONTROL, AUDIO AMPLIFIERS

■ DC-DC & DC-AC CONVERTERS

ABSOLUTE MAXIMUM RATINGS

Symb ol Parameter Value Unit
V DS Drain-source Voltage (VGS = 0) 30 V
V DGR Drain- gate Voltage (R GS = 20 kΩ) 30 V
VGS G ate-source Voltage ± 20 V
ID Drain Current (continuous) at Tc = 25 oC 40 A
ID Drain Current (continuous) at Tc = 100 o C 28 A
I DM (•) Drain Current (pulsed) 160 A
o
P tot T otal Dissipation at Tc = 25 C 70 W
Derating Factor 0.46 W /o C
E AS ( 1 ) Single Pulse Avalanche Energy 250 m/J
o
T st g Storage Temperature -65 to 175 C
o
Tj Max. Operating Junction Temperature 175 C
(•) Pulse width limited by safe operating area ( 1) starting Tj = 25 oC, ID =20A , VDD = 15V

October 1999 1/8

 STP40NF03L

THERMAL DATA
o
R thj -case Thermal Resistance Junction-case Max 2.1 C/W
o
R thj -amb Thermal Resistance Junction-ambient Max 62.5 C/W
o
Tl Maximum Lead Temperature F or Soldering Purpose 300 C

ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)

OFF
Symbo l Parameter Test Con ditions Min. Typ. Max. Unit
V (BR)DSS Drain-source I D = 250 µA V GS = 0 30 V
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Breakdown Voltage
I DSS Zero Gate Voltage V DS = Max Rating 1 µA
Drain Current (V GS = 0) V DS = Max Rating T c =125 oC 10 µA
IGSS Gate-body Leakage V GS = ± 20 V ± 100 nA
Current (VDS = 0)

ON (∗)
Symbo l Parameter Test Con ditions Min. Typ. Max. Unit
V GS(th) Gate Threshold Voltage V DS = V GS ID = 250 µA 1 1.7 2.5 V
R DS(on) Static Drain-source On V GS = 10 V ID = 20 A 0.018 0.022 Ω
Resistance V GS = 4.5 V I D = 20 A 0.028 0.035 Ω
I D(o n) On State Drain Current V DS > ID(o n) x R DS(on )ma x 40 A
V GS = 10 V

DYNAMIC
Symbo l Parameter Test Con ditions Min. Typ. Max. Unit
g f s (∗) Forward V DS > ID(o n) x R DS(on )ma x I D =20 A 20 S
Transconductance
C iss Input Capacitance V DS = 25 V f = 1 MHz V GS = 0 830 pF
C os s Output Capacitance 230 pF
C rss Reverse Transfer 92 pF
Capacitance

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 STP40NF03L

ELECTRICAL CHARACTERISTICS (continued)

SWITCHING ON
Symbo l Parameter Test Con ditions Min. Typ. Max. Unit
t d(on) Turn-on Delay T ime V DD = 15 V I D = 20 A 35 ns
tr Rise Time R G = 4.7 Ω V GS = 4.5 V 205 ns
(Resistive Load, see fig. 3)
Qg Total G ate Charge V DD = 24 V ID = 40 A V GS = 5 V 18 23 nC
Q gs Gate-Source Charge 7 nC
Q gd Gate-Drain Charge 8 nC

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SWITCHING OFF
Symbo l Parameter Test Con ditions Min. Typ. Max. Unit
t d(of f) Turn-off Delay T ime V DD = 15 V I D = 20 A 90 ns
tf Fall T ime R G = 4.7 Ω V GS = 4.5 V 240 ns
(Resistive Load, see fig. 3)
t d(of f) Off-voltage Rise T ime Vclamp = 24 V I D = 20 A 150 ns
tf Fall T ime R G = 4.7 Ω V GS = 4.5 V 155 ns
tc Cross-over Time (Induct ive Load, see fig. 5) 340 ns

SOURCE DRAIN DIODE

Symbo l Parameter Test Con ditions Min. Typ. Max. Unit
ISD Source-drain Current 40 A
I SDM (•) Source-drain Current 160 A
(pulsed)
V SD (∗) Forward On Voltage I SD = 40 A V GS = 0 1.5 V
t rr Reverse Recovery I SD = 40 A di/dt = 100 A/µs 65 ns
Time V DD = 15 V T j = 150 o C
Q rr Reverse Recovery (see test circuit, fig. 5) 72 nC
Charge
I RRM Reverse Recovery 2 A
Current

(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %

(•) Pulse width limited by safe operating area

Safe Operating Area Thermal Impedance

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 STP40NF03L

Output Characteristics Transfer Characteristics

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Transconductance Static Drain-source On Resistance

Gate Charge vs Gate-source Voltage Capacitance Variations

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 STP40NF03L

Normalized Gate Threshold Voltage vs Normalized On Resistance vs Temperature

Temperature

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Source-drain Diode Forward Characteristics

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 STP40NF03L

Fig. 1: Unclamped Inductive Load Test Circuit Fig. 2: Unclamped Inductive Waveform

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Fig. 3: Switching Times Test Circuits For Fig. 4: Gate Charge test Circuit
Resistive Load

Fig. 5: Test Circuit For Inductive Load Switching

And Diode Recovery Times

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 STP40NF03L

TO-220 MECHANICAL DATA

mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
D1 1.27 0.050
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E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.067
F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106
H2 10.0 10.40 0.393 0.409
L2 16.4 0.645
L4 13.0 14.0 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.2 6.6 0.244 0.260
L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
E
A

D
C

D1

L2
F1

G1

H2
G

Dia.
F
F2

L5
L9
L7

L6 L4
P011C

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 STP40NF03L

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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specific ation mentioned in this publication are
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are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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 1999 STMicroelectronics – Printed in Italy – All Rights Reserved

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