BM1117

GENERAL DESCRIPTION
The BM1117 series of adjustable and fixed voltage regulators are designed to provide 1A
output current and to operate down to 1V input-to-output differential. The dropout voltage of the
device is guaranteed maximum 1.3V at maximum output current, decreasing at lower load
currents.
On-chip trimming adjusts the reference voltage to within 1% accuray. Current limit is also
trimmed, minimizing the stress under overload conditions on both the regulator and power
source circuitry.
The BM1117 devices are pin compatible with other three-terminal SCSI regulators and are
offered in the low profile surface mount SOT-223 package and in the TO-252 (DPAK) plastic
package.

FEATURES APPLICATIONS
Three Terminal Adjustable or Fixed Voltages* High Efficiency Linear Regulators
1.5V, 1.8V, 2.5V, 2.85V, 3.3V and 5.0V Post Regulators for Switching Supplies
Output Current of 1A  5V to 3.3V Linear Regulator
Operates Down to 1V Dropout  Power Management for Notebook
Line Regulation: 0.2% Max.  Battery Chargers
Load Regulation: 0.4% Max.  Battery Powered Instrumentation
SOT-223 and TO-252 package available  Active SCSI Terminators

ORDERING INFORMATION
PACKAGE TYPE OPERATING JUNCTION
TO-252 SOT-223 TEMPERATURE RANGE
BM1117-ADJ BM1117-ADJ 0 to 125° C
BM1117-1.5 BM1117-1.5 0 to 125° C
BM1117-1.8 BM1117-1.8 0 to 125° C
BM1117-2.5 BM1117-2.5 0 to 125° C
BM1117-2.85 BM1117-2.85 0 to 125° C
BM1117-3.3 BM1117-3.3 0 to 125° C
BM1117--5.0 BM1117-5.0 0 to 125° C
*For additional available fixed voltages contact factory.

PIN DESCRIPTIONS
FIXED ADJUSTABLE SOT-223 Top View TO-252 FRONT VIEW
VERSION VERSION
1- Ground 1- Adjust 3
TAB IS
2- VOUT 2- VOUT OUTPUT
2
1
3- VIN 3- VIN 1 2 3

BOOKLY MICRO ELECTRONIC LIMITED CORP.

SPECIFICATION BM1117
ABSOLUT MAXIMUM RATINGS(Note 1)
Power Dissipation Internally limited Soldering information
Input Voltage 22V Lead Temperature (10 sec) 300°C
Operating Junction Temperature Thermal Resistance
Control Section 0°C to 125°CS TO-252 package φ JA= 80°C/W
Power Transistor 0°C to 150°C SOT-223 package φ JA= 90°C/W*
Storage temperature - 65°C to +150°C * With package soldering to copper area over
backside ground plane or internal power plane φJA
can vary from 46°C/W to >90°C/W depending on
mounting technique and the size of the copper area.

ELECTRICAL CHARACTERISTICS
Electrical Characteristics at IOUT = 0 mA, and TJ = +25°C unless otherwise specified.
Parameter Device Conditions Min Typ Max Units
IOUT = 10 mA
Reference Voltage 1.238 1.250 1.262 V
BM1117 10mA ≤IOUT ≤1A,
(Note 2) 1.225 1.250 1.270 V
1.5V≤ (VIN - VOUT) ≤12V
Output Voltage 1.485 1.500 1.515 V
BM1117-1.5
(Note 2) 0≤IOUT ≤1A ,3.0V≤VIN ≤12V 1.476 1.500 1.524 V
1.782 1.800 1.818 V
BM1117-1.8
0 ≤IOUT ≤1A , 3.3V≤VIN ≤12V 1.773 1.800 1.827 V
2.475 2.500 2.525 V
BM1117-2.5
0 ≤IOUT≤1A ,4.0V≤VIN ≤12V 2.460 2.500 2.560 V
2.82 2.850 2.88 V
BM1117-2.85
0 ≤IOUT ≤1A ,4.35V≤VIN ≤12V 2.79 2.850 2.91 V
3.267 3.300 3.333 V
BM1117-3.3
0 ≤IOUT ≤1A ,4.75V ≤VIN ≤12V 3.235 3.300 3.365 V
4.950 5.000 5.050 V
BM1117-5.0
0 ≤IOUT ≤1A , 6.5V ≤VIN ≤12V 4.900 5.000 5.100 V
IOUT = 10 mA , 0.015 0.2 %
Line Regulation BM1117
1.5V≤ (VIN - VOUT) ≤12V 0.035 0.2 %
0.3 5 mV
BM1117-1.5 3.0V≤VIN ≤12V
0.6 6 mV
0.3 5 mV
BM1117-1.8 3.3V≤VIN ≤12V
0.6 6 mV
0.3 6 mV
BM1117-2.5 4.0V≤VIN ≤12V
0.6 6 mV
0.3 6 mV
BM1117-2.85 4.35V≤VIN ≤12V
0.6 6 mV
0.5 10 mV
BM1117-3.3 4.75V≤VIN ≤12V
1.0 10 mV
0.5 10 mV
BM1117-5.0 6.5V≤VIN ≤12V
1.0 10 mV

BOOKLY MICRO ELECTRONICS LIMITED CORP.

SPECIFICATION BM1117
Parameter Device Conditions Min Typ Max Units

Load Regulation (VIN - VOUT) =3V, 0.1 0.3

BM1117 %
(Notes 2, 3) 10mA≤IOUT ≤1A 0.2 0.4
3 10 mV
BM1117-1.5 VIN=5V, 0≤IOUT ≤1A
6 20 mV
3 10 mV
BM1117-1.8 VIN=5V, 0≤IOUT≤1A
6 20 mV
3 12 mV
BM1117-2.5 VIN=5V, 0≤IOUT ≤1A
6 20 mV
3 12 mV
BM1117-2.85 VIN=5V, 0 ≤IOUT≤1A
6 20 mV
3 15 mV
BM1117-3.3 VIN=5V, 0 ≤IOUT≤1A
7 25 mV
5 20 mV
BM1117-5.0 VIN=8V, 0≤IOUT ≤1A
10 35 mV
BM1117 ∆VOUT , ∆VREF = 1%,
Dropout Voltage
/-1.5/-1.8/-2.5/-2. IOUT = 1A (Note 4) 1.1 1.3 V
(VIN - VOUT)
85/-3.3/-5.0

BM1117
Current Limit /-1.5/-1.8/-2.5/-2. (VIN - VOUT) = 5V 900 1,100 1,500 mA
85/-3.3/-5.0

Minimum Load (VIN - VOUT)

BM1117 5 10 mA
Current = 12V (Note 5)
BM1117
Quiescent Current /-1.5/-1.8/-2.5/-2. VIN ≤12V 5 10 mA
85/-3.3/-5.0
f =120Hz , COUT = 22µF
Ripple Rejection BM1117 Tantalum, IOUT = 1A, (VIN-VOUT ) 60 75 dB
= 3V, CADJ =10µF
BM1117-1.5/-1.8/ f =120Hz , COUT = 22µF
60 72 dB
-2.5/- 2.85 Tantalum, IOUT = 1A, VIN = 6V
f =120Hz , COUT = 22µF
BM1117-3.3 60 72 dB
Tantalum, IOUT= 1A, VIN = 6.3V
f =120Hz , COUT = 22µF
BM1117-5.0 60 68 dB
Tantalum, IOUT = 1A, VIN = 8V
TA = 25°C, 30ms pulse
Thermal Regulation BM1117 0.008 0.04 %W

10mA ≤IOUT ≤1A, 55 µA

Adjust Pin Current BM1117
1.5V≤ (VIN - VOUT) ≤12V 120 µA
Adjust Pin Current 10mA ≤IOUT ≤1A,
BM1117 0.2 5 µA
Change 1.5V≤ (VIN- VOUT) ≤12V
Temperature
0.5 %
Stability

BOOKLY MICRO ELECTRONICS LIMITED CORP.

SPECIFICATION BM1117
Parameter Device Conditions Min Typ Max Units
Long Term
TA =125°C, 1000Hrs 0.3 1 %
Stability
RMS Output Noise
TA=25°C, 10Hz ≤f ≤10kHz 0.003 %
(% of VOUT )
Thermal
Resistance 15 °C/W
Junction-to-Case
Parameters identified with boldface type apply over the full operating temperature range.
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. For
guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications
apply only for the test conditions listed.
Note 2: Line and Load regulation are guaranteed up to the maximum power dissipation of 1.2 W. Power
dissipation is determined by the input/output differential and the output current. Guaranteed maximum power
dissipation will not be available over the full input/output range.
Note 3: See thermal regulation specifications for changes in output voltage due to heating effects. Line and
load regulation are measured at a constant junction temperature by low duty cycle pulse testing. Load
regulation is measured at the output lead ~1/8” from the package.
Note 4: Dropout voltage is specified over the full output current range of the device.
Note 5: Minimum load current is defined as the minimum output current required to maintain regulation.
When 1.5V≤ (VIN - VOUT) ≤12V the device is guaranteed to regulate if the output current is greater than
10mA.

APPLICATION HINTS
The BM1117 series of adjustable and fixed regulators are easy to use and are protected against
short circuit and thermal overloads. Thermal protection circuitry will shut-down the regulator
should the junction temperature exceed 165°C at the sense point.
Pin compatible with older three terminal adjustable regulators, these devices offer the
advantage of a lower dropout voltage, more precise reference tolerance and improved
reference stability with temperature.
Stability
The circuit design used in the BM1117 To ensure good transient response with
series requires the use of an output heavy load current changes capacitor
capacitor as part of the device frequency values on the order of 100mF are used in
compensation. The addition of 22µF solid the output of many regulators. To further
tantalum on the output will ensure stability improve stability and transient response
for all operating conditions. of these devices larger values of output
When the adjustment terminal is bypassed capacitor can be used.
with a capacitor to improve the ripple Protection Diodes
rejection, the requirement for an output Unlike older regulators, the BM1117
capacitor increases. The value of 22µF family does not need any protection
tantalum covers all cases of bypassing the diodes between the adjustment pin and
adjustment terminal. Without bypassing the the output and from the output to the
adjustment terminal smaller capacitors can input to prevent over-stressing the die.
be used with equally good results. Internal resistors are limiting the internal
BOOKLY MICRO ELECTRONICS LIMITED CORP.
SPECIFICATION BM1117
.current paths on the BM1117 adjustment damage can occur. A diode from output to
pin, therefore even with capacitors on the input is recommended, when a crowbar
adjustment pin no protection diode is circuit at the input of the BM1117 is used
needed to ensure device safety under (Figure 1).
short-circuit conditions. Output Voltage
Diodes between the input and output are The BM1117 series develops a 1.25V
not usually needed. Microsecond surge reference voltage between the output and
currents of 50A to 100A can be handled by the adjust terminal. Placing a resistor
the internal diode between the input and between these two terminals causes a
output pins of the device. In normal constant current to flow through R1 and
operations it is difficult to get those values down through R2 to set the overall output
of surge currents even with the use of voltage. This current is normally the
large output capacitances. If high value specified minimum load current of 10mA.
output capacitors are used, such as Because IADJ is very small and constant it
1000mF to 5000mF and the input pin is represents a small error and it can usually
instantaneously shorted to ground, be ignored

BM1117
VIN IN OUT
VOUT
BM1117
VIN IN OUT
VOUT ADJ R1
VREF
ADJ R1 COUT
22uF
IADJ
50uA
R2
CADJ R2
10uF

VOUT = VRE F (1+ R2/R1)+IADJR2

Figure 1. Figure 2. Basic Adjustable Regulator

effective resistance between the regulator

Load Regulation and the load would be:
True remote load sensing it is not possible RP x ((R2+R1)/ R1),
to provide, because the BM1117 is a three RP = Parasitic Line Resistance
terminal device. The resistance of the wire
connecting the regulator to the load will V IN
BM1117
IN OUT
limit the load regulation. The data sheet ADJ Rp
specification for load regulation is R1*
measured at the bottom of the package. RL
Negative side sensing is a true Kelvin R2*
connection, with the bottom of the output
divider returned to the negative side of the
load.
The best load regulation is obtained when *CONNECT R1 TO CASE
the top of the resistor divider R1 is *CONNECT R2 TO LOAD
connected directly to the case not to the Figure 3. Connections for Best
load. If R1 were connected to the load, the Load Regulation
BOOKLY MICRO ELECTRONICS LIMITED CORP.
SPECIFICATION BM1117

Connected as shown above , RP is not Experiments have shown that the heat
multiplied by the divider ratio spreading copper layer does not need to be
In the case of fixed voltage devices the top electrically connected to the tab of the device.
of R1 is connected Kelvin internally, and The PC material can be very effective at
the ground pin can be used for negative transmitting heat between the pad area,
side sensing. attached to the pad of the device, and a
ground plane layer either inside or on the
Thermal Considerations opposite side of the board. Although the
actual thermal resistance of the PC material
The BM1117 series have internal power is high, the Length/Area ratio of the thermal
and thermal limiting circuitry designed to resistance between layers is small. The data
protect the device under overload in Table 1, was taken using1/16” FR-4 board
conditions. However maximum junction with 1 oz. copper foil, and it can be used as a
temperature ratings of 125°C should not be rough guideline for estimating thermal
exceeded under continuous normal load resistance.
conditions.
Careful consideration must be given to all For each application the thermal resistance
sources of thermal resistance from junction will be affected by thermal interactions with
to ambient. For the surface mount package other components on the board. To
SOT-223 additional heat sources mounted determine the actual value some
near the device must be considered. The experimentation will be necessary.
heat dissipation capability of the PC board
and its copper traces is used as a heat sink The power dissipation of the BM1117 is equal
for the device. The thermal resistance from to:
the junction to the tab for the BM1117 is PD = ( VIN - VOUT )( IOUT )
15°C/W. Thermal resistance from tab to
ambient can be as low as 30°C/W. Maximum junction temperature will be equal
The total thermal resistance from junction to:
to ambient can be as low as 45°C/W. This TJ = TA(MAX) + PD
requires a reasonable sized PC board with PD :Thermal esistance (junction-to-ambient)
at least on layer of copper to spread the
heat across the board and couple it into the Maximum junction temperature must not
surrounding air. exceed 125°C.

Table 1.
COPPER AREA THERMAL RESISTANCE
BOARD AREA
TOP SIDE* BACK SIDE (JUNCTION-TO-AMBIENT)
2500 Sq. mm 2500 Sq. mm 2500 Sq. mm 45°C/W
1000 Sq. mm 2500 Sq. mm 2500 Sq. mm 45°C/W
225 Sq. mm 2500 Sq. mm 2500 Sq. mm 53°C/W
100 Sq. mm 2500 Sq. mm 2500 Sq. mm 59°C/W
1000 Sq. mm 1000 Sq. mm 1000 Sq. mm 52°C/W
1000 Sq. mm 0 1000 Sq. mm 55°C/W

BOOKLY MICRO ELECTRONICS LIMITED CORP.

SPECIFICATION BM1117

Ripple Rejection
The ripple rejection values are measured with the adjustment pin bypassed. The impedance of
the adjust pin capacitor at the ripple frequency should be less than the value of R1 (normally
100Ωto 200Ω) for a proper bypassing and ripple rejection approaching the values shown. The
size of the required adjust pin capacitor is a function of the input ripple frequency. If R1=100Ω at
120Hz the adjust pin capacitor should be >13mF. At 10kHz only 0.16mF is needed.
The ripple rejection will be a function of output voltage, in circuits without an adjust pin bypass
capacitor. The output ripple will increase directly as a ratio of the output voltage to the reference
voltage (VOUT / VREF ).

BOOKLY MICRO ELECTRONICS LIMITED CORP.

SPECIFICATION BM1117

TYPICAL CHARACTERISTICS
Minimum Operating Current
(Adjustable Device) Short-Circuit Current

Load Regulation Ripple Rejection vs. Current

Temperature Stability Adjust Pin Current

BOOKLY MICRO ELECTRONICS LIMITED CORP.

SPECIFICATION BM1117

PACKAGE DIMENSIONS
Inches (millimeters) unless otherwise noted.

TO-252 PLASTIC PACKAGE (D)

3 LEAD SOT-223 PLASTIC PACKAGE

Note: Bookly Micro assumes no responsibility for any errors which may appear in this
document. reserves the right to change devices or specifications detailed herein at any
time without notice.
BOOKLY MICRO ELECTRONICS LIMITED CORP.