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Advanced Chip & Wire Bonding Guide

Chip and wire bonding processes are used to electrically connect microchips to substrates or packages. There are several bonding technologies available, including flip-chip bonding, chip-to-chip bonding, and chip-to-wafer bonding. Chip bonding can be done through eutectic or adhesive bonding using materials like epoxies or solders. Wire bonding techniques like ultrasonic bonding, thermo compression bonding, and thermo sonic bonding are then used to electrically connect the bonded chips to other wiring levels using thin gold, copper, or aluminum bond wires. These processes allow for the prototype and low-volume production of sensors, actuators, and microelectromechanical systems.

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Imtiaz Ahmed
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146 views1 page

Advanced Chip & Wire Bonding Guide

Chip and wire bonding processes are used to electrically connect microchips to substrates or packages. There are several bonding technologies available, including flip-chip bonding, chip-to-chip bonding, and chip-to-wafer bonding. Chip bonding can be done through eutectic or adhesive bonding using materials like epoxies or solders. Wire bonding techniques like ultrasonic bonding, thermo compression bonding, and thermo sonic bonding are then used to electrically connect the bonded chips to other wiring levels using thin gold, copper, or aluminum bond wires. These processes allow for the prototype and low-volume production of sensors, actuators, and microelectromechanical systems.

Uploaded by

Imtiaz Ahmed
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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Chip and Wire Bonding

1. General Description 3. Wire Bonding


Chip and wire bonding processes belong to Wire bonding techniques are used for
packaging level one and are mainly serial contacting of micromechanical and electrical
performed. To assemble prefabricated and structures after the assembly to a subordinate
diced chips on substrates or packages and to wiring level. Within the department wire
contact them electrically, these techniques are bonding equipment for ultrasonic bonding,
needed necessarily. Several technologies and thermo compression bonding and thermo sonic
certain equipment for chip and wire bonding bonding is available. Several bond wires made
are available within our labs and are of gold, copper, and aluminum with wire
introduced in the following. diameters between 32 m (thin wire bond) and
250 m (thick wire bond) could be processed.
2. Chip Bonding
Both ball/wedge and wedge/wedge contacts
For chip bonding processes techniques like depending on the material are processible with
eutectic bonding or adhesive bonding can be different equipment. Therewith substrates like
used. As bonding layers epoxies, ceramic lead frames, electronic packages and ceramic
adhesives or pastes as well as solders (Si/Au, substrates as well as special formed
Sn, Pb free) could be used. Almost every substrates can be handled for prototype
modern packaging technique could be applied production.
for sensors and actuators as well as for
micromechanical systems focused on
prototype fabrication but also for low volume
production. For chip bonding a T-3002-M die
bonder manufactured by Dr. Tresky AG is
available. Its precise X-Y adjustment allows an
accurate placement of the chips using
substrates with sizes up to 8.
Bonding Technologies:
Flip-Chip (FC)
Chip-to-Chip (C2C)
Fig. 2: Mounted chip contacted by 125 m thick Al wires
Chip-to-Wafer (C2W)
Multi-Chip-Module (MCM)
Bonding Technologies:
Chip-on-Board (COB)
Ultra Sonic Bonding
Surface Mounted Devices (SMD)
Thermo Compression Bonding
Substrates:
Thermo Sonic Bonding
Lead frames
Chip Metallization:
Silicon wafers
Aluminum
Electronic housings
Gold
Ceramics up to 50x50 mm
Copper
Bond Wires:
Aluminum (: 32, 125, 250 m)
Gold (: 32, 125, 250 m)
Copper (: 32 m)

4. Contact
Dr.-Ing. Maik Wiemer
Phone: +49 (0) 371/5397-1474
Fax: +49 (0) 371/5397-1310
E-Mail: maik.wiemer@enas.fraunhofer.de
Fig. 1: C2C bonded ASIC and sensor on FR4 board

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