PCI ExpressTM Form Factors:
Card, Mini Card and ExpressCard*
Chuck Stancil
Hewlett-Packard Company
Chair, PCI Express Electromechanical WG
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Agenda
Add-in Card
Review of add-in card basics
Whats new since the CEM 1.0a spec was released?
PCI Express Mini Card
Review of basics
Whats new
ExpressCard*
Summary
Call to Action
* Other names and brands may be claimed as the property of others.
others.
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Add-in Card
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Simple Add-in Card Design
Follows PCI Card form factors
Standard Height Cards, 4.20 (106.7mm)
Low Profile Cards, 2.536 (64.4mm)
Half Length Cards, 6.6 (167.65mm)
Full Length Cards, 12.283 (312mm)
Uses PCI I/O Bracket
PCI Express Is Optimized for Cost
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Add-in Card Size Exceptions
Standard height x1 cards are limited to halflength (6.6) for desktop applications
Push towards small form factor systems
10W power limit
For server I/O needs there is allowance for
a 25W, standard height x1 card that MUST
be greater or equal to 7.0 but less than or equal
to full length
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Low Cost Edge Card
Connector
x1 connector 36 pins vs.
PCI 120 pins
Simple Single Level Contacts
1mm Contact Spacing
Low Cost Connector Assembly
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Scalable Connector Design
Scalable Design
allows connectors
from x1 to x16 to be
easily designed
x1
x4
x8
Use same contacts
Modular body design
Use same connector
manufacturing process
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x16
Smaller link-width
cards can plug
into larger linkwidth connectors
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Slot Placement Strategy
X1 PCI Express
I/O Connectors
x16 PCI Express Graphics
PCI
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Routing in 4-Layer
Motherboards
PCI
Connectors
PCI Express x1 connector
(4 times PCI performance)
PCI Express x16 connector
(64 times PCI performance)
PCI Express layout and
connectors can be routed
in 4 Layers
Flexibility in routing PCI
Express and PCI
connectors on the
same board
Smaller connectors
provide more room for
routing and components
ATX 4 Layer, P4 Motherboard
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Power Delivery
Power Rail
10W slot
25W slot
75W slot
+3.3V 9%
3A max
3A max
3A max
+12V 8%
0.5A max
2.1A max
5.5A max
+3.3Vaux 9%
375mA max
375mA max
375mA max
Notes:
3.3Vaux max current is 375mA when the add-in card
is Wake enabled and 20mA when Wake disabled.
An ECR to the CEM 1.0 spec changed the maximum slot
power from 60W to 75W
Compared to PCI and AGP:
Additional power from 12v rail
+5V, -12V requirements are eliminated
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Power Rules
System MUST provide +12V and +3.3V rails to ALL PCI
Express slots in a chassis
Systems may optionally provide +3.3Vaux but if supplied
it MUST be provided to all PCI Express slots in a chassis
If the platform supports the WAKE# signal then it MUST
provide it and +3.3Vaux to all PCI Express slots in
chassis
Capacitive load rules:
+12V rail: 300F @ 10W; 1000F @ 25W; 2000F @ 75W
+3.3V rail: 1000F
+3.3Vaux rail: 150F
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Power Rules (Continued)
Current slew rate: 0.1A/s
All x1 add-in cards must power up at a maximum
of 10W; once configured as a High Power
device, if applicable, a card can consume up to
25W
All x16 add-in cards must power up at a
maximum of 25W; once configured as a High
Power device, if applicable, a graphics card can
consume up to 75W
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Power & Card Summary
10W: x1 cards (= 6.6 length)
25W: x1 cards (> 7.0 length), x4 cards, x8
cards, x16 low-profile graphics cards, x16 server
I/O cards
75W: x16 full-height graphics cards
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Add-in Card Interoperability
Slot
Card
x1
x4
x8
x16
x1
Required
Required
Required
Required
x4
No
Required
Allowed
Allowed
x8
No
No
Required
Allowed
x16
No
No
No
Required
Up-plugging: Plugging a smaller link card into a larger link connector
is fully allowed.
Down-plugging: Plugging a larger link card into a smaller link
connector is not allowed and is physically prevented.
Down-shifting: Plugging a card into a connector that is not fully
routed for all of the lanes. In general, this is not allowed. The
exception is the x8 connector which the system designer may
choose to route only the first four lanes. A x8 card functions as a x4
card in this scenario.
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Reference Clock
(REFCLK+, REFCLK-)
Differential pair
Nominal frequency of 100MHz (300ppm)
Point-to-point connection between each PCI
Express connector and the clock source
Within each differential pair the PCB trace
lengths must be within 0.005
Spread Spectrum support is optional but likely
needed to pass emissions testing!
Termination resistors located at the clock source
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Lane Reversal, Polarity Inversion
The plus and minus connections from the system boards
transmit differential pair (PETp/PETn) may be reversed
Simplification for board routing
Receiver is required to support Lane Polarity Inversion
If a component does NOT support lane reversal then the
board (system or add-in card) must adhere to strict
connection ordering (i.e. Lane 0 to Lane 0, Lane 1 to Lane
1, etc) to the add-in card connector
If a component DOES support lane reversal then the same
lane ordering must be used for both the transmit and
receive pair
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CEM spec updates since Revision 1.0a
Card Presence Detect
REFCLK clarification
Slot Power Limit Implementation Note
Connector color
Card retention
PERST# clarification
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Card Presence Detect
Supports the hot plug solution; ALL add-in cards must implement
both gold fingers, PRSNT1# and the furthest PRSNT2#
System use is optional for non-hot plug solutions
There are multiple PRSNT2# pins on the connector this is needed
to support up-plugging
System buses them together
Add-in card connects PRSNT1# to the FURTHEST PRSNT2#
pin on its connector
PCI Express CARD
Trace on the add-in card
(actual trace routing is left up to the board designer)
45
Gold fingers
MATE LAST/BREAK FIRST
PULL-UP
Baseboard
Connector
PRSNT1#
PRSNT2#
BASEBOARD
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Hot plug
To logic on controlle
r
board
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REFCLK clarification
The timing budget allows for approximately 4 of
add-in card trace length
Termination resistors on the add-in card ARE
allowed but
Not covered by the CEM spec!
The nominal voltage swing, and rise & fall times will
be reduced in half!
Consider shutting off the clock to empty slots!
Additional details on REFCLK measurement
configurations and data are being provided in
the CEM 1.0a Errata document
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Slot Power Implementation Note
Software Update of the Slot Power Limit System firmware must update the slot power limit to the system's
allocated value for the PCI Express add-in card (e.g. Graphics) and
ensure the completion of this update prior to invoking the option
ROM for that add-in card's PCI Express function. If the initial slot
power limit value is set by hardware initialization then any attempt by
software to change that value must be verified by that software prior
to initializing the add-in card. Subsequent updates by the system
firmware or operating system software, if any, may only increase the
slot power limit value. However, after a card is reset the initial slot
power limit value may be lower than the previous value. The
maximum power level for an add-in card must be assigned by the
system firmware during PCI Express bus configuration. For graphics
the power level assigned will be dependent on the platforms support
of the PCI Express Graphics High-End Specification (including the
supplemental power cable).
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Connector Color
CEM 1.0 did not suggest or specify a color for
the add-in card connector
Approved ECN addresses this
By default the recommended color should be
black
This color hasnt been used for an add-in card
connector since ISA was around)
Avoids any confusion with PCI connectors even
though PCI and PCI Express cards are mechanically
incompatible
Other colors ARE allowed if a system OEM
requires a particular color coding scheme
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Card Retention
ECN defines additional component keepout areas on
add-in cards to support system-level card retention
Focus is on full-height, x16 cards for Graphics
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PERST# Clarification
ECN defines threshold windows for PERST# activation
Voltage monitoring circuitry will be able to reliably detect
a power rail condition requiring the assertion of PERST#
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Add-in Card Summary
PCI Express is Optimized for Cost
Cost-effective for migration into commodity
infrastructure
Replaces PCI over time with 15+ years of life
PCI Express is Easy to Implement
Leverages existing form factors and standards
Transition with existing PCI form factors
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PCI Express Mini Card
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What is PCI Express Mini Card
Replacement for Mini PCI
Targeted for BTO/CTO solutions
PCI Express and USB 2.0 enabled
Optimized for communication add-ins
Card envelope: 30mm x 56mm x 5mm
Equal to width of Mini PCI Type IIIa card
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Communications Centric
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Targeted Applications
Wireless-Personal Area Network (W-PAN)
Bluetooth / Ultra wideband
Local Area Network (LAN)
10/100/1G/10G Ethernet
Wireless-LAN (W-LAN)
802.11b/g/a, etc.
Wide Area Network (WAN)
V.90/V.92 modem / xDSL / cable modem
Wireless-WAN (W-WAN)
GSM/GPRS / UMTS / CDMA
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Half the Size of Mini PCI
51
30
PCI Express Mini PCI
Mini Card (Type IIIa)
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Upgradeability / Serviceability
Angled insertion and removal
OEM optimized retention
Internal clips / screws / door
attached clip
BTO / CTO
Single connector
Multiple technologies
Field replacement by service
technicians
Reduce TCO / services costs
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Mechanical Summary (1)
Cross-section
Card outline dimensioning
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Mechanical Summary (2)
I/O connector zone
Keep out zones
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Mechanical Summary (3)
System
board
footprint
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Two socket
arrangement
defined
33
Signal Summary
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Pin Arrangement
52 pin solution
Arranged to
assure isolation
USB
PCI
Express
AUX
REF
Clock
CLKREQ#
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Power and Thermals
+3.3V (AUX)
3W MAX power
consumption
Power Density Uniform Loading
@80% coverage
2.3W MAX
thermal
dissipation
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Bottom Side (W/Sq. cm)
0.1
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
0.095
0.115
0.135
0.155
0.175
0.195
0.215
Top Side (W/Sq. cm)
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Designed for Power Efficiency
Robust power management features
ACPI and PCI PM supported
In-band wake mechanisms supported
Wake# enables lowest system power solution
SMBus available for advanced features
Dual power planes
3.3V nominal voltage required for I/O drive requirements
1.5V reduces need for on-card regulation
Two power states
PRIMARY 3.3V and 1.5V fully ON
AUXILIARY 3.3VAUX available in D3HOT
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Status Indicators
Three LEDs
W-PAN
W-LAN
W-WAN
Single-ended,
9 mA sink
capable
LED support via
I/O connector
Still an option
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Ease of Design
Digital / Analog physical separation
RF is not as near to digital
High speed digital on host connector
Analog on I/O connectors
Spread Spectrum Reference
clock supports
ANALOG
Reduced EMI emissions
Software compatibility
DIGITAL
Per native bus definitions
PCI Express
USB 2.0
SMBus 2.0
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Mini Card Summary
Higher performance and smaller F/F
replacement for Mini PCI
Optimized for communications applications
IHVs can select the serial interface appropriate for
their device
Support for LED status indicators
Outstanding power management features
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ExpressCard*
* Other names and brands may be claimed as the property of others.
others.
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Agenda
The motivation behind ExpressCard
technology
Key characteristic details of ExpressCard
technology
Key design considerations
ExpressCard applications opportunities
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The ExpressCard
ExpressCard** Standard
PCMCIAs next
generation PC Card
technology specification
Major step to align with
platform trends
Retains the best
characteristics of
CardBus
Leverages advanced
serial bus technologies
* Other names and brands may be claimed as the property of others.
others.
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Platform shifts
present opportunities, drive requirements
I/O interconnect
smaller yet higher performance
lower cost by design
fast serial links
native hot-plug
Notebook PCs
smaller yet flexible
thinner and lighter
Desktop PCs
smaller, modular
form factors
technology reuse
lower cost by volume
address growing SFF market
Establishing
e
Establishingmodule
moduleproduct
productcompatibility
compatibilityacross
acrossdesktop
desktop&&mobil
mobile
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Desktop View on ExpressCard
Significant ease-of-use benefit over traditional add-in cards
Closed box I/O expansion without clutter and complexity
Lower support costs compared to traditional add-in cards
Uses native interfaces
I/O plumbing is standard feature of the base platform
No external I/O controller or bridge is required
Advanced serial interfaces vs. existing parallel interfaces
Fewer pins and more bandwidth
Lower cost interconnects (connector, cables, silicon)
Leverage a larger combined desktop / mobile market
Draw on mobile platform proven usage model
SFF
SFFdesktop
desktopmarket
marketgrowing
growingestimates
estimatesrange
range
from
from20%
20%--40%
40%market
marketshare
shareby
by2005
2005
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Architectural Overview
System design based on a modular, extensible slot
model
Assumes multiple slot solutions, single slots allowed
Relies on native bus operation
PCI Express Base Specification 1.0a
USB 2.0 (low / full / high speeds)
Compliant systems must support both in slots
Compatible with existing operating system
Future OS may offer non-essential enhancements
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ExpressCard/34 Module Form-Factor
security
notch
34 mm
top
finger grip
75 mm
5 mm thick
connector
alignment
feature
bottom
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ExpressCard/54 Module Form-Factor
34 mm
54 mm
top
75 mm
5 mm thick
53 mm
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Building a Slot
Universal slot for
both modules
Slot for 34mm
modules only
Top Cover
Top Cover
Host Connector
Left Guide Rail
Host Connector
Left Guide Rail
Right Guide Rail
Host/Daughter Card
Right Guide Rail
PCB Insulator
Host/Daughter Card
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ExpressCard Connectors
Beam-on-blade, single in-line
configuration, 1mm pitch
Low-cost yet reliable and durable
5K / 10K cycle rating for module
connectors
5K cycle rating for host connectors
Two-levels of contacts in module
module connector
host connector
blade
beam
system board
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System Diagram
GROUND
PETp0
26
25
PETn0
GROUND
PERp0
24
23
22
PERn0
GROUND
REFCLK+
21
20
19
REFCLKCPPE#
CLKREQ#
18
17
16
+3.3V
+3.3V
PERST#
15
14
13
+3.3VAUX
WAKE#
+1.5V
12
11
10
+1.5V
SMB_DATA
SMB_CLK
9
8
7
RESERVED
RESERVED
CPUSB#
6
5
4
USBD+
USBD-
3
2
GROUND
Clock
Request
Ref
CLK
Wake
Request
System
Reset
PETp0
PETn0
PERp0
PERn0
3.3V
Power
Switch
3.3VAUX
Host
Chip
Set
1.5V
USBD+
USBDSMBus
Controller
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System Diagram
Clock
Request
GROUND
PETp0
26
25
PETn0
GROUND
PERp0
24
23
22
PERn0
GROUND
REFCLK+
21
20
19
REFCLKCPPE#
CLKREQ#
18
17
16
ExpressCard
module
+3.3V
+3.3V
PERST#
15
14
13
using PCI Express
+3.3VAUX
WAKE#
+1.5V
12
11
10
+1.5V
SMB_DATA
SMB_CLK
9
8
7
RESERVED
RESERVED
CPUSB#
6
5
4
USBD+
USBD-
3
2
GROUND
Ref
CLK
Wake
Request
System
Reset
PETp0
PETn0
PERp0
PERn0
3.3V
Power
Switch
3.3VAUX
Host
Chip
Set
1.5V
USBD+
USBDSMBus
Controller
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System Diagram
ExpressCard
ExpressCard
module
module
using PCI
Express*
using
USB
Clock
Request
GROUND
PETp0
26
25
PETn0
GROUND
PERp0
24
23
22
PERn0
GROUND
REFCLK+
REFCLK-
21
20
19
REFCLKCPPE#
CLKREQ#
18
17
16
+3.3V
+3.3V
PERST#
15
14
+3.3VAUX
WAKE#
+1.5V
+1.5V
SMB_DATA
SMB_CLK
SMB_CLK
RESERVED
RESERVED
RESERVED
RESERVED
CPUSB#
CPUSB#
Ref
CLK
Wake
Request
13
12
11
System
Reset
PETp0
PETn0
PERp0
PERn0
3.3V
Power
Switch
3.3VAUX
Host
Chip
Set
1.5V
10
9
8
7
6
5
USBD+
USBD+
USBDUSBD-
4
3
2
GROUND
GROUND
USBD+
USBDSMBus
Controller
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Power & Thermal Requirements
Solution balances the needs of applications with
thermal constraints of size
Thermal limits defined for inside the slot dissipation
1.3W
thermal
Slot power ratings
Supply
+3.3V
+3.3VAUX
+1.5V
2.1W
thermal
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Limits
Notes
1000 mA Average 1
1300 mA Max2
OFF in D3
250 mA Average 1
325 mA Max2
ON in D0 D3 (with
wake enabled)
5 mA Average
D3 limit when wake
disabled
500 mA Average
650 mA Max
OFF in D3
1. Sum of +3.3V & +3.3VAUX averages may not exceed 1A
2. Sum of +3.3V & +3.3VAUX maximums may not exceed 1.75A
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System Configurations
Location of slots vary for desktop & mobile
Based on application and accessibility needs
Platform-independent recommendations
Support multiple slots in a platform
Single slot solutions seriously
limit usage flexibility
Provide at least one slot for
ExpressCard/54 modules
Supports CF adapters,
Smart Card adapters,
larger rotating-media
drives
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PC Card on
top universal
ExpressCard
slot on bottom
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Two single
slots
Universal
Slot
Two universal
Slots
55
System Desktop Concepts
OEM-specific
riser card
PCI Express
USB Cable Cable
Power
from
system
PSU
Cabled
daughter cards
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Power to the Slot
GROUND
PETp0
26
25
PETn0
GROUND
PERp0
24
23
22
PERn0
GROUND
REFCLK+
21
20
19
REFCLKCPPE#
CLKREQ#
18
17
16
+3.3V
+3.3V
PERST#
15
14
13
+3.3VAUX
WAKE#
+1.5V
12
11
10
+1.5V
SMB_DATA
SMB_CLK
9
8
7
RESERVED
RESERVED
CPUSB#
6
5
4
USBD+
USBD-
3
2
GROUND
Slot is cold when un-occupied
Module presence pins dictate when
power is needed
System
Reset
No software needed
System in sleep state (S3/S4)
3.3V
3.3VAUX
1.5V
Special case after insertion, power to
module held off until after system
returns to S0
No 5V USB bus power
Replaced with regulated 3.3V (&
1.5V)
3.3V auxiliary current on
a separate pin
Replace regulator with
rail switching in designs
Simpler
Simplersolution
solutionno
nocontroller
controller/ /software
softwareconnection
connection
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Thermals
a matter of physics
Allowable
Temp Rise [C]
Power
Dissipation
Limit
[W]
Smaller cards means
less thermal capacity
Adjacent ExpressCard|34 Power Limit
ExpressCard/34 Power Limit*
1.8
1.6
1.4
1.2
1
0.8
Use PM aggressively to
reduce thermal
contribution
0.6
0.4
0.2
0
0
10
15
20
Power
Limit
[W]
Allowable Temperature
25
30
35
Rise [C]
* 65C still air environment assumed
High source power
provided for short-term
application needs
Duty-cycle/usage profile
determines long-term
contribution to the thermal
average
Thermal
modeling
module
FLAT HEAD SCREW
#0-80, 2X
TOP, COPPER 110
CONN
HEATER, 25.4mmX50.8mm
BOTTOM,COPPER 110
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Power Management
Support for PM in modules is mandatory
Active State PM (PCI Express L0s & L1)
D3 support (PCI Express & USB 2.0)
Wakeup mechanisms
PCI Express
WAKE# sideband to wake system power
PME in-band messaging
USB
USB in-band wake signaling
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Modules using both PCI Express
and USB in a single instance
Current bus driver stacks: no knowledge of physical
dependency
When a request is made to remove or stop a function: one
function will be knowingly removed, the other function will
suffer surprise removal
Use ACPI legacy solution
_EJD (Eject Dependencies) cross declarations in port
descriptions
Updated driver stacks future solution
Require serial numbers be implemented in the PCI Express
Extended Configuration Space
Reflect the PCI Express serial number in USB device
configuration space under a new string descriptor
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Ease-of-Use Considerations
Surprise insertion and removal
HW/SW tolerant of user actions
Module extraction from the slot
Spec targeted at manual removal over need for
ejector systems
Module installation is independent of which
interface used by the application
Proper marking and labeling techniques aids in
module insertion
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ExpressCard Compliance
Will be tied to ExpressCard
logo usage for registered
products
Proposed compliance program
Combination of checklist & interop testing
Requires use of silicon that meets PCI-SIG and USB-IF
silicon compliance programs
Co-sponsored SIG events to ease participation costs
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Application Opportunities
Transition existing applications from CardBus to
ExpressCard technology
Leverage the broad range of existing USB silicon
Introduce new applications
Enabled by PCI Express and USB
New desktop platform and consumer opportunities
Designed for adapters,
rotating media, higher
power applications
1.8 HD app
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Designed as long term
form factor, fit for smaller
next generation systems
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Target Applications
Performance1
Target Applications
2.0 Gbps
(full-duplex)
Wired & Wireless LAN
Broadband modems
Audio/Video Steaming
TV Tuners/Decoders
I/O Adapters (e.g. 1394a/b)
Magnetic Disk Drives
USB 2.0
1 Mbps
to
480 Mbps
(half-duplex)
Wired & Wireless WAN
Wireless PAN
Flash Memory
SFF Flash Card Adapters
Security
Legacy I/O (PS2, serial, parallel)
Optical Disk Drives
GPS Receiver
SMBus2
100 Kbps
(half-duplex)
Sideband system management
Interface
PCI Express
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nominal data throughput
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optional host feature
64
ExpressCard Timeline
CardBus
PC Card 16
1990
1995
2000
ExpressCard
200X
Planned for 2003-2004
Formal specification release complete!
Publish design collaterals in progress!
Compliance program begins in progress!
PCMCIA
PCMCIAparticipation
participation==developer
developersupport
supportand
andcompliance
complianceprogram
programaccess
access
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ExpressCard Summary
The ExpressCard Standard enables modular
card solutions for PCI Express and USB
ExpressCard technology is targeted for a wide
range of platforms including mobile and desktop
PCs
ExpressCard solutions will provide the best enduser experience for PC upgrades
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ExpressCard Next Steps
Module and system developers: join and
participate in the PCMCIA
www.expresscard.org
Silicon developers: design ingredients for
ExpressCard applications emphasizing low
power and power management features
Get ExpressCard technology included on your
2004 product roadmaps
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Summary
PCI Express functions will be available in a wide
variety of form factors serving multiple market
segments
Each form factor addresses the specific
physical, power, thermal and performance needs
of the markets they are intended to serve
Each form factor has a solid transition strategy
for end-users/customers
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Call to Action
Prepare your product roadmaps to
intercept the first launch of systems, cards, and
modules
Utilize the PCI-SIG (and other industry groups,
as appropriate) for specifications and support
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Thank you for attending the
2004 PCI-SIG Asia-Pacific
Developers Conference.
For more information please go to
www.pcisig.com
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