Manual Da Placa HP Dg41rq

December 2008
Order Number: E58745-001US

The Intel
Desktop Board DG41RQ may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG41RQ Specification Update.

Intel Desktop Board
DG41RQ
Technical Product Specification

Revision History
Revision Revision History Date
-001 First DRAFT of the Intel
Desktop Board DG41RQ Technical Product

Specification
December 2008
This product specification applies to only the standard Intel
Desktop Board DG41RQ with BIOS

identifier RQG4110H.86A.
Changes to this specification will be published in the Intel Desktop Board DG41RQ Specification
Update before being incorporated into a revision of this document.

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conflicts or incompatibilities arising from future changes to them.
Intel
desktop boards may contain design defects or errors known as errata, which may cause the product
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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Copies of documents which have an ordering number and are referenced in this document, or other Intel
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Copyright 2008, Intel Corporation. All rights reserved.

iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel

Desktop Board DG41RQ. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DG41RQ and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings

NOTE
Notes call attention to important information.

INTEGRATORS NOTES
Integrators notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
Intel Desktop Board DG41RQ Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1, 073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

v
Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 System Memory .............................................................................. 15
1.5.1 Memory Configurations ......................................................... 16
1.6 Intel
G41 Express Chipset ............................................................... 18

1.6.1 Intel G41 Graphics Subsystem ............................................... 18
1.6.2 USB ................................................................................... 20
1.6.3 Serial ATA Interfaces ............................................................ 21
1.7 Parallel IDE Controller ...................................................................... 22
1.8 Real-Time Clock Subsystem.............................................................. 23
1.9 Legacy I/O Controller ....................................................................... 23
1.9.1 Serial Port Interface.............................................................. 23
1.9.2 PS/2 Keyboard and Mouse Interface........................................ 24
1.10 Audio Subsystem............................................................................. 25
1.10.1 Audio Subsystem Software .................................................... 26
1.10.2 Audio Connectors and Headers ............................................... 26
1.11 LAN Subsystem............................................................................... 27
1.11.1 LAN Subsystem Software....................................................... 27
1.11.2 RJ-45 LAN Connector with Integrated LEDs .............................. 28
1.12 Hardware Management Subsystem .................................................... 29
1.12.1 Hardware Monitoring and Fan Control...................................... 29
1.12.2 Fan Monitoring..................................................................... 29
1.12.3 Thermal Monitoring .............................................................. 30
1.13 Power Management ......................................................................... 31
1.13.1 ACPI................................................................................... 31
1.13.2 Hardware Support ................................................................ 34
1.13.3 ENERGY STAR*.................................................................... 37
2 Technical Reference
2.1 Memory Map................................................................................... 39
2.1.1 Addressable Memory............................................................. 39
2.2 Connectors and Headers................................................................... 42
2.2.1 Back Panel Connectors .......................................................... 43
2.2.2 Component-side Connectors and Headers ................................ 44
vi
2.3 Jumper Block.................................................................................. 54
2.4 Mechanical Considerations ................................................................ 55
2.4.1 Form Factor......................................................................... 55
2.5 Electrical Considerations................................................................... 56
2.5.1 Power Supply Considerations ................................................. 56
2.5.2 Fan Header Current Capability................................................ 57
2.5.3 Add-in Board Considerations .................................................. 57
2.6 Thermal Considerations.................................................................... 57
2.7 Reliability ....................................................................................... 59
2.8 Environmental ................................................................................ 60
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 61
3.2 BIOS Flash Memory Organization....................................................... 62
3.3 Resource Configuration .................................................................... 62
3.3.1 PCI Autoconfiguration ........................................................... 62
3.3.2 PCI IDE Support................................................................... 63
3.4 System Management BIOS (SMBIOS)................................................. 63
3.5 Legacy USB Support ........................................................................ 64
3.6 BIOS Updates ................................................................................. 65
3.6.1 Language Support ................................................................ 65
3.6.2 Custom Splash Screen .......................................................... 66
3.7 BIOS Recovery................................................................................ 66
3.8 Boot Options................................................................................... 67
3.8.1 CD-ROM Boot ...................................................................... 67
3.8.2 Network Boot....................................................................... 67
3.8.3 Booting Without Attached Devices........................................... 67
3.8.4 Changing the Default Boot Device During POST ........................ 67
3.9 Adjusting Boot Speed....................................................................... 68
3.9.1 Peripheral Selection and Configuration..................................... 68
3.9.2 BIOS Boot Optimizations ....................................................... 68
3.10 BIOS Security Features .................................................................... 69
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 71
4.2 BIOS Beep Codes ............................................................................ 71
4.3 BIOS Error Messages ....................................................................... 71
4.4 Port 80h POST Codes ....................................................................... 72
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 77
5.1.1 Safety Standards.................................................................. 77
5.1.2 European Union Declaration of Conformity Statement ................ 78
5.1.3 Product Ecology Statements................................................... 79
5.1.4 EMC Regulations .................................................................. 83
5.1.5 Product Certification Markings (Board Level)............................. 84
5.2 Battery Disposal Information............................................................. 85
Contents
vii

Figures
1. Major Board Components.................................................................. 11
2. Block Diagram ................................................................................ 13
3. Memory Channel Configuration and DIMM Configuration........................ 17
4. Back Panel Audio Connector Options .................................................. 26
5. LAN Connector LED Locations............................................................ 28
6. Thermal Sensors and Fan Headers ..................................................... 30
7. Location of the Standby Power Indicator LED....................................... 37
8. Detailed System Memory Address Map ............................................... 40
9. Back Panel Connectors ..................................................................... 43
10. Component-side Connectors and Headers ........................................... 44
11. Connection Diagram for Front Panel Header ........................................ 51
12. Connection Diagram for Front Panel USB Headers ................................ 53
13. Location of the Jumper Block............................................................. 54
14. Board Dimensions ........................................................................... 55
15. Localized High Temperature Zones..................................................... 58

Tables
1. Feature Summary.............................................................................. 9
2. Board Components Shown in Figure 1 ................................................ 12
3. Supported Memory Configurations ..................................................... 15
4. Audio Jack Support .......................................................................... 25
5. LAN Connector LED States ................................................................ 28
6. Effects of Pressing the Power Switch .................................................. 31
7. Power States and Targeted System Power........................................... 32
8. Wake-up Devices and Events ............................................................ 33
9. System Memory Map ....................................................................... 41
10. Component-side Connectors and Headers Shown in Figure 10................ 45
11. Serial ATA Connectors...................................................................... 46
12. Serial Port Header ........................................................................... 46
13. Rear Chassis Fan Header .................................................................. 47
14. Processor Fan Header ...................................................................... 47
15. Front Panel Audio Header for Intel HD Audio........................................ 47
16. Front Panel Audio Header for AC 97 Audio .......................................... 47
17. S/PDIF Connector............................................................................ 47
18. Parallel Port Header ......................................................................... 48
19. Auxiliary Front Panel Power/Sleep LED Header..................................... 49
20. Processor Core Power Connector........................................................ 50
21. Main Power Connector...................................................................... 50
22. Front Panel Header .......................................................................... 51
23. States for a One-Color Power LED...................................................... 52
24. States for a Two-Color Power LED...................................................... 52
25. Auxiliary Front Panel Power LED Header.............................................. 52
26. BIOS Setup Configuration Jumper Settings.......................................... 54
viii
27. Recommended Power Supply Current Values ....................................... 56
28. Fan Header Current Capability........................................................... 57
29. Thermal Considerations for Components ............................................. 59
30. Intel Desktop Board DG41RQ Environmental Specifications.................... 60
31. BIOS Setup Program Menu Bar.......................................................... 62
32. BIOS Setup Program Function Keys.................................................... 62
33. AcceptableDrives/Media Types for BIOS Recovery ................................ 66
34. Boot Device Menu Options ................................................................ 67
35. Supervisor and User Password Functions............................................. 69
36. Beep Codes .................................................................................... 71
37. BIOS Error Messages ....................................................................... 71
38. Port 80h POST Code Ranges.............................................................. 72
39. Port 80h POST Codes ....................................................................... 73
40. Typical Port 80h POST Sequence........................................................ 76
41. Safety Standards............................................................................. 77
42. Lead-Free Board Markings ................................................................ 82
43. EMC Regulations ............................................................................. 83
44. Product Certification Markings ........................................................... 84

9
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Intel Desktop Board DG41RQ.
Table 1. Feature Summary
Form Factor Micro-ATX (9.60 inches by 8.60 inches [243.84 millimeters by 218.44 millimeters])
Processor Support for the following:
Intel
Core2 Quad processor in an LGA775 socket

Intel
Core2 Duo processor in an LGA775 socket

Intel
Pentium
Dual-Core processor in an LGA775 socket

Intel
Celeron
processor Sequence 400 in an LGA775 socket

Memory
Two 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
Support for DDR2 667 MHz or DDR2 800 MHz DIMMs
Support for up to 8 GB of system memory
Chipset
Intel
G41 Express Chipset, consisting of:

Intel

82G41 Graphics and Memory Controller Hub (GMCH)
Intel

82801GB I/O Controller Hub (ICH7)
Video Intel
Graphics Media Accelerator X4500 (Intel

GMA X4500) onboard graphics
subsystem
Audio 5.1 channel audio subsystem in single stream mode or 4+ 2 channel audio
subsystem in multi-streaming mode using the Realtek* ALC662 audio codec
Legacy I/O
Control
Legacy I/O controller for serial, parallel, and PS/2* ports
Peripheral
Interfaces
Eight USB 2.0 ports: four back panel connectors and four front panel headers
Four Serial ATA (SATA) interfaces
One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
PS/2 keyboard and mouse ports
One parallel port header
One serial port header
LAN Support 10/100/1000 Mbits/sec LAN subsystem using Realtek RTL8111D Gigabit Ethernet
Controller
BIOS
Intel
BIOS (resident in the SPI Flash device)

Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
continued
10
Table 1. Feature Summary (continued)
Instantly Available
PC Technology
Support for PCI* Local Bus Specification Revision 2.3
Support for PCI Express* Revision 1.1
Suspend to RAM support
Wake on PCI, serial port, front panel, PS/2 devices, PCI Express, LAN, and USB
ports
Expansion
Capabilities
Two PCI Conventional bus connectors
One PCI Express x16 bus add-in card connector
Hardware Monitor
Subsystem
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
Two fan headers
Two fan sense inputs used to monitor fan activity

Product Description
11
1.1.2 Board Layout
Figure 1 shows the location of the major components.

Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
12
Table 2. Board Components Shown in Figure 1
Item/callout
from Figure 1

Description
A PCI Conventional bus add-in card connector
B PCI Conventional bus add-in card connector
C PCI Express x16 connector
D Rear chassis fan header
E Back panel connectors
F Parallel port header
G Processor core power connector (2 X 2)
H LGA775 processor socket
I Intel 82G41 GMCH
J Processor fan header
K DIMM Channel A socket
L DIMM Channel B socket
M Main Power connector (2 X 12)
N Parallel ATA IDE connector
O Battery
P Intel

82801GB I/O Controller Hub (ICH7)
Q Auxiliary front panel power LED header
R Front panel header
S Serial ATA connectors [4]
T BIOS Setup configuration jumper block
U Front panel USB header
V Front panel USB header
W Piezo speaker
X Serial port header
Y S/PDIF connector
Z Front panel audio header
Product Description
13
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.

Figure 2. Block Diagram
14
1.2 Legacy Considerations
This board differs from other Intel
Desktop Board products, with specific changes

including (but not limited to) the following:
No diskette drive connector
No parallel port on the back panel
No serial port on the back panel
1.3 Online Support
To find information about Visit this World Wide Web site:
Intel Desktop Board DG41RQ http://www.intel.com/products/motherboard/DG41RQ/index.htm
Desktop Board Support http://support.intel.com/support/motherboards/desktop
Available configurations for the Intel
Desktop Board DG41RQ
http://www.intel.com/products/motherboard/DG41RQ/index.htm
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
1.4 Processor
The board is designed to support the following processors:
Intel Core 2 Quad processor in an LGA775 socket
Intel Core 2 Duo processor in an LGA775 socket
Intel Pentium

Dual-Core processor in an LGA775 socket
Intel Celeron processor Sequence 400 in an LGA775 socket
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 95 W. The processors listed above are only
supported when falling within the wattage requirements of the board. See the Intel
web site listed below for the most up-to-date list of supported processors.

For information about Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.

INTEGRATORS NOTE
Use only ATX12V-compliant power supplies.
Product Description
15
For information about Refer to
Power supply connectors Section 2.2.2.4, page 50
1.5 System Memory
The board has two DIMM sockets and supports the following memory features:
1.8 V DDR2 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR2 SDRAM DIMMs
Dual channel interleaved mode support
Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
8 GB maximum total system memory. Refer to Section 2.1.1 on page 39 for
information on the total amount of addressable memory.
Minimum total system memory: 512 MB
Non-ECC DIMMs
Serial Presence Detect
DDR2 667 MHz or DDR2 800 MHz SDRAM DIMMs
DDR2 667 MHz DIMMs with SPD timings of only 5-5-5 (tCL-tRCD-tRP)
DDR2 800 MHz DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This enables the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations

DIMM
Type

SDRAM
Technology
Smallest usable
DIMM (one x16
Single-sided
DIMM)
Largest usable
DIMM (one x8
Double-sided
DIMM)
Maximum capacity
with two identical
x8 Double-sided
DIMMs
DDR2 667 512 Mbit 256 MB 4 GB 8 GB
DDR2 800 512 Mbit 256 MB 4 GB 8 GB

Tested Memory http://support.intel.com/support/motherboards/desktop/sb/
CS-025414.htm
16
1.5.1 Memory Configurations
The Intel 82G41 GMCH supports the following types of memory organization:
Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm

Product Description
17
Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel Configuration and DIMM Configuration

INTEGRATORS NOTE
Regardless of the memory configuration used (dual channel, single channel, or flex
mode), DIMM 0 of Channel A must always be populated.

18
1.6 Intel
G41 Express Chipset

The Intel G41 Express chipset consists of the following devices:
Intel 82G41 Graphics and Memory Controller Hub (GMCH) with Direct Media
Interface (DMI) interconnect
Intel 82801GB I/O Controller Hub (ICH7) with DMI interconnect
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The component also provides integrated graphics capabilities
supporting 3D, 2D, and display capabilities. The ICH7 is a centralized controller for
the boards I/O paths.
The chipset supports the following features:
Onboard graphics
Dynamic Video Memory Technology
USB
Serial ATA
Parallel IDE

The Intel G41 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1 Intel G41 Graphics Subsystem
The Intel G41 Express chipset contains two separate, mutually exclusive graphics
options. Either the Intel Graphics Media Accelerator X4500 (Intel GMA X4500)
graphics controller (contained within the 82G41 GMCH) is used, or a PCI Express x16
add-in card can be used. When a PCI Express x16 add-in card is installed, the Intel
GMA X4500 graphics controller is disabled.
1.6.1.1 Intel
Graphics Media Accelerator X4500 Graphics

Controller
The Intel GMA X4500 graphics controller features the following:
High quality texture engine
DirectX10* and OpenGL* 2.0 compliant
Shader Model 4.0
3D Graphics Rendering enhancements
1.6 dual texture GigaPixel/sec max fill rate
16-bit and 32-bit color
Vertex cache
Video
Hi-Definition content at up to 1080p resolution
Dynamic Video Memory Technology (DVMT) 5.0 uses system memory
depending on the operating system and the amount of memory installed
Product Description
19
Display
Supports digital and analog displays up to 2048 x 1536 at 75 Hz refresh
(QXGA); also supports 1920 x 1080 resolution for full High Definition video
playback quality
Dual independent display support
1.6.1.2 Dynamic Video Memory Technology (DVMT 5.0)
DVMT enables enhanced graphics and memory performance through highly efficient
memory utilization. DVMT ensures the most efficient use of available system memory
for maximum 2-D/3-D graphics performance. The amount of system memory
allocated to DVMT varies depending on the amount of total system memory installed
as well as the operating system being used. For Windows Vista, a minimum of 128 MB
can be allocated to DVMT and a maximum of over 2 GB can be allocated to DVMT with
the correct amount of memory installed. DVMT returns system memory back to the
operating system when the additional system memory is no longer required by the
graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the
BIOS Setup program) for compatibility with legacy applications. An example of this
would be when using VGA graphics under DOS. Once loaded, the operating system
and graphics drivers allocate additional system memory to the graphics buffer as
needed for performing graphics functions.

NOTE
The use of DVMT requires operating system driver support.
1.6.1.3 Configuration Modes
The video modes supported by this board are based on the Extended Display
Identification Data (EDID) modes of the monitor to which the system is connected.
Standard monitors are assumed.
1.6.1.4 Advanced Digital Display (ADD2/MEC/ADD2+) Card
Support
The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a
270 MHz pixel clock to the PCI Express x16 connector. When an ADD2/MEC/ADD2+
card is detected, the Intel GMA X4500 graphics controller is enabled and the PCI
Express x16 connector is configured for SDVO mode. SDVO mode enables the SDVO
ports to be accessed by the ADD2/MEC/ADD2+ card. An ADD2/MEC/ADD2+ card can
either be configured to support simultaneous display or can be configured to support
dual independent display as an extended desktop configuration with different color
depths and resolutions with DVI analog output only. ADD2/MEC/ADD2+ cards can be
designed to support the following configurations:
Low Voltage Differential Signaling (LVDS)
Single device operating in dual channel mode
HDTV output
HDMI support (when used with the HD Audio Link header)
20
1.6.1.5 PCI Express x16 Graphics
The GMCH supports add-in graphics cards via the PCI Express connector.
The PCI Express, revision 1.1, x16 interface supports the PCI Express GEN1 frequency
of 1.25 GHz resulting in a data transfer rate of 2.5 Gb/s each direction (500 MB/s
total). This provides a maximum theoretical bandwidth on the interface of 4 GB/s in
each direction simultaneously, for an aggregate bandwidth of 8 GB/s when the
interface is operating in x16 mode.

PCI Express technology http://www.pcisig.com

1.6.2 USB
The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers.
The ICH7 provides the USB controller for all ports. The port arrangement is as
follows:
Four ports are implemented with stacked back panel connectors
Four ports are routed to two separate front panel USB headers

The location of the USB connectors on the back panel Figure 9, page 43
The location of the front panel USB headers Figure 10, page 44
Product Description
21
1.6.3 Serial ATA Interfaces
The boards Serial ATA controller offers four independent Serial ATA ports with a
theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed
on each port for a maximum of four Serial ATA devices. A point-to-point interface is
used for host to device connections, unlike Parallel ATA IDE which supports a
master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP
operating system.

NOTE
Many Serial ATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/

The location of the Serial ATA connectors Figure 10, page 44

22
1.7 Parallel IDE Controller
The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The
Parallel ATA IDE interface supports the following modes:
Programmed I/O (PIO): processor controls data transfer.
8237-style DMA: DMA offloads the processor, supporting transfer rates of up to
16 MB/sec.
Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 33 MB/sec.
ATA-66: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is
device driver compatible.
ATA-100: DMA protocol on IDE bus allows host and target throttling. The ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up
to 88 MB/sec.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce
reflections, noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives)
and ATA devices. The BIOS supports Logical Block Addressing (LBA) and Extended
Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate
and translation mode to the BIOS.

The location of the Parallel ATA IDE connector Figure 10, page 44

Product Description
23
1.8 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to 13 minutes/year at
25 C with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.

1.9 Legacy I/O Controller
The I/O controller provides the following features:
One serial port header
Serial IRQ interface compatible with serialized IRQ support for PCI systems
PS/2-style mouse and keyboard interfaces
One parallel port header
Intelligent power management, including a programmable wake-up event interface
PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.9.1 Serial Port Interface
The serial port header is located on the component side of the board. The serial port
supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.

The location of the serial port header Figure 10, page 44
The serial port header signal mapping Table 12, page 46

24
1.9.2 PS/2 Keyboard and Mouse Interface
The PS/2 keyboard and mouse connectors are located on the back panel.

NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported
in the top PS/2 connector. Power to the computer should be turned off before a
keyboard or mouse is connected or disconnected.

The location of the keyboard and mouse connectors Figure 9, page 43

Product Description
25
1.10 Audio Subsystem
The onboard audio subsystem consists of the following:
Intel 82801GB (ICH7)
Realtek ALC662 audio codec
Back panel audio connectors
Component-side audio headers/connectors:
Intel

High Definition Audio front panel header
S/PDIF connector
The audio subsystem supports the following features:
A signal-to-noise (S/N) ratio of 95 dB
Independent 5.1 audio playback from back panel connectors and stereo playback
from the Intel High Definition Audio front panel header.
4+2 channel in multi-streaming mode

NOTE
Systems built with an AC 97 front panel will not be able to obtain the Microsoft
Windows Vista* logo.

Table 4 lists the supported functions of the front panel and back panel audio jacks.
Table 4. Audio Jack Support

Audio Jack

Supports
Line in?

Supports
Rear
Surround?

Supports
Center/
LFE?

Supports
Micro-
phone?
Supports
Line/Head
-phones
out?
Front panel Green No No No No Yes
Front panel Pink No No No Yes No
Back panel Blue Yes Yes No No No
Back panel Green No No No No Yes
Back panel Pink No No Yes Yes No

26
1.10.1 Audio Subsystem Software
Audio software and drivers are available from Intels World Wide Web site.

Obtaining audio software and drivers Section 1.2, page 14

1.10.2 Audio Connectors and Headers
The board contains audio connectors on the back panel and audio headers on the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front panel audio header and back panel audio connectors are configurable
through the audio device drivers. The available configurable back panel audio
connectors are shown in Figure 4.

Item Description
A Line in
B Line out
C Mic in
Figure 4. Back Panel Audio Connector Options

NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.

The location of the front panel audio header Figure 10, page 44
The signal names of the front panel audio header Table 15, page 47
The back panel audio connectors Section 2.2.1, page 43

Product Description
27
1.11 LAN Subsystem
The LAN subsystem consists of the following:
Intel 82801GB ICH7
Realtek RTL8111D Gigabit Ethernet Controller for 10/100/1000 Mbits/sec Ethernet
LAN connectivity
RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
CSMA/CD protocol engine
LAN connect interface between ICH7 and the LAN controller
PCI Conventional bus power management
ACPI technology support
LAN wake capabilities
LAN subsystem software

LAN software and drivers http://downloadcenter.intel.com

1.11.1 LAN Subsystem Software
LAN software and drivers are available from Intels World Wide Web site.

Obtaining LAN software and drivers Section 1.2, page 14

28
1.11.2 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below).

Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 5 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 5. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
On LAN link is established. Link Green
Blinking LAN activity is occurring.
Off 10 Mbits/sec data rate is selected.
Green 100 Mbits/sec data rate is selected. Data Rate Green/Yellow
Yellow 1000 Mbits/sec data rate is selected.
Product Description
29
1.12 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
Fan monitoring and control
Thermal and voltage monitoring
1.12.1 Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
SIO smart fan control, delivering acoustically-optimized thermal management
Fan speed control controllers and sensors integrated into the SIO
Four thermal sensors (processor, 82G41 GMCH, 82801GB ICH7, and a remote
thermal sensor)
Power supply monitoring of five voltages (+5 Vsb, +5V, +12 V, +3.3 V, and
+VCCP) to detect levels above or below acceptable values
Thermally monitored closed-loop fan control, for both fans, that can adjust the fan
speed according to thermal conditions
1.12.2 Fan Monitoring
Fan monitoring can be implemented using Intel
Desktop Utilities or third-party

software.

The functions of the fan headers Section 1.13.2.2, page 35
Location of the fan headers Figure 6, page 30
30
1.12.3 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.

Item Description
A Rear chassis fan
B Remote thermal sensor
C Thermal diode, located on processor die
D Processor fan
Figure 6. Thermal Sensors and Fan Headers

NOTE
The minimum thermal reporting threshold for the GMCH is 66 C. The GMCH thermal
sensor will display 66 C until the temperature rises above this point.
Product Description
31
1.13 Power Management
Power management is implemented at several levels, including:
Software support through Advanced Configuration and Power Interface (ACPI)
Hardware support:
Power connector
Fan headers
Instantly Available PC technology
Wake from USB
Wake from PS/2 devices
Power Management Event signal (PME#) wake-up support
1.13.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with the board requires an
operating system that provides full ACPI support. ACPI features include:
Plug and Play (including bus and device enumeration)
Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
A Soft-off feature that enables the operating system to power-off the computer
Support for multiple wake-up events (see Table 8 on page 33)
Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 6. Effects of Pressing the Power Switch
If the system is in this
state
and the power switch
is pressed for

the system enters this state
Off
(ACPI G2/G5 Soft off)
Less than four seconds Power-on
(ACPI G0 working state)
On
Less than four seconds Soft-off/Standby
(ACPI G1 sleeping state)
On
More than four seconds Fail safe power-off
Sleep
Less than four seconds Wake-up
Sleep
More than four seconds Power-off

32
1.13.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 7 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
Table 7. Power States and Targeted System Power
Global
States

Sleeping States
Processor
States

Device States
Targeted System
Power
(Note 1)

G0 working
state
S0 working C0 working D0 working
state.
Full power > 30 W
G1 sleeping
state
S1 Processor
stopped
C1 stop
grant
D1, D2, D3
device
specification
specific.
5 W < power < 52.5 W
G1 sleeping
state
S3 Suspend to
RAM. Context
saved to RAM.
No power D3 no power
except for
wake-up logic.
Power < 5 W
(Note 2)

G1 sleeping
state
S4 Suspend to
disk. Context
saved to disk.
except for
wake-up logic.
Power < 5 W
(Note 2)

G2/S5 S5 Soft off.
Context not saved.
Cold boot is
required.
except for
wake-up logic.
Power < 5 W
(Note 2)

G3
mechanical off.
AC power is
disconnected
from the
computer.
No power to the
system.
No power D3 no power for
wake-up logic,
except when
provided by
battery or
external source.
No power to the system.
Service can be performed
safely.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
Product Description
33
1.13.1.2 Wake-up Devices and Events
Table 8 lists the devices or specific events that can wake the computer from specific
states.
Table 8. Wake-up Devices and Events
These devices/events can wake up the computer from this state
LAN S1, S3, S4, S5
(Note 1)

PME# signal S1, S3, S4, S5
(Note 1)

Power switch S1, S3, S4, S5
PS/2 devices S1, S3, S4, S5
(Note 2)

RTC alarm S1, S3, S4, S5
Serial port S1, S3
USB S1, S3
WAKE# signal S1, S3, S4, S5
Notes:
1. For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to
Power On will enable a wake-up event from LAN in the S5 state.
2. S4 or S5 wake from PS/2 is disabled by default.

NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
34
1.13.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
Power connector
Fan headers
Instantly Available PC technology
Wake from USB
Wake from PS/2 devices
PME# signal wake-up support
WAKE# signal wake-up support
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.

NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.
1.13.2.1 Power Connector
ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computers response can be set
using the Last Power State feature in the BIOS Setup programs Boot menu.

The location of the main power connector Figure 10, page 44
The signal names of the main power connector Table 21, page 50

Product Description
35
1.13.2.2 Fan Headers
The function/operation of the fan headers is as follows:
The fans are on when the board is in the S0 state.
The fans are off when the board is off or in the S3, S4, or S5 state.
The processor fan header is wired to a fan tachometer input. The rear fan header
has independent tachometer input to the hardware monitoring and fan control
device. All fan headers support closed-loop fan control that can adjust the fan
speed according to thermal conditions.
All fan headers have a +12 V DC connection.

The locations of the fan headers and thermal sensors Figure 6, page 30
The signal names of the processor fan header Table 14, page 47
The signal names of the chassis fan header
Table 13, page 47
1.13.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line from the power supply must be
capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing LAN wake capabilities can damage the power
supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
The PCI Express WAKE# signal
The PCI bus PME# signal for PCI 2.3 compliant LAN designs
The onboard LAN subsystem
36
1.13.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line from the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 8 on page 33 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.3 compliant add-in cards and drivers.
1.13.2.5 Wake from USB
USB bus activity wakes the computer from ACPI S3 state.

NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.13.2.6 Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S1, S3, S4, and S5 state.

NOTE
PS/2 wake from S4 and S5 states via the special keyboard key (the keyboard power-
on key) must have the keyboard power-on enable/disable option in the BIOS enabled.
1.13.2.7 PME# Signal Wake-up Support
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS).
1.13.2.8 WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S1, S3, S4, or S5 state.
Product Description
37
1.13.2.9 +5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 7 shows the location of the standby power
indicator LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the.
Failure to do so could damage the board and any attached devices.

Figure 7. Location of the Standby Power Indicator LED
1.13.3 ENERGY STAR*
In 2007, the US Department of Energy and the US Environmental Protection Agency
revised the ENERGY STAR* requirements. Intel has worked directly with these two
governmental agencies to define the new requirements. This Intel Desktop Board
meets the Category B requirements.

ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar

38

39
2 Technical Reference
2.1 Memory Map
2.1.1 Addressable Memory
The board utilizes 8 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total
system memory). On a system that has 8 GB of system memory installed, it is not
possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
BIOS/SPI Flash (8 Mbits)
Local APIC (19 MB)
Direct Media Interface (40 MB)
Front side bus interrupts (17 MB)
PCI Express configuration space (256 MB)
GMCH base address registers, internal graphics ranges, PCI Express ports (up to
512 MB)
Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI
Express add-in cards
Base graphics memory support (1 MB or 8 MB)

NOTE
System resources and hardware (such as PCI and PCI Express*) require physical
memory address locations that can reduce available addressable system memory. This
could result in a reduction of as much as 1 GB or more of physical addressable
memory being available to the operating system and applications, depending on the
system configuration and operating system.
40
The amount of installed memory that can be used will vary based on add-in cards and
BIOS settings. Figure 8 shows a schematic of the system memory map. All installed
system memory can be used when there is no overlap of system addresses.

Figure 8. Detailed System Memory Address Map

Technical Reference
41
Table 9 lists the system memory map.
Table 9. System Memory Map
Address Range
(decimal)
Address Range
(hex)

Size

Description
1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
memory (open to the PCI bus).
Dependent on video adapter used.
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
42
2.2 Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: Back panel
and front panel USB and PS/2.
The other internal connectors/headers are not overcurrent protected and should
connect only to devices inside the computers chassis, such as fans and internal
peripherals. Do not use these connectors/headers to power devices external to the
computers chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.

NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.

This section describes the boards connectors and headers. The connectors and
headers can be divided into these groups:
Back panel I/O connectors (see page 43)
Component-side connectors and headers (see page 44)
Technical Reference
43
2.2.1 Back Panel Connectors
Figure 9 shows the locations of the back panel connectors.

Item Description
A PS/2 mouse port
B PS/2 keyboard port
C VGA port
D USB ports [2]
E LAN
F USB ports [2]
G Line in
H Mic in
I Line out
Figure 9. Back Panel Connectors

44
2.2.2 Component-side Connectors and Headers
Figure 10 shows the locations of the component-side connectors and headers.

Figure 10. Component-side Connectors and Headers
Technical Reference
45
Table 10 lists the component-side connectors and headers identified in Figure 10.
Table 10. Component-side Connectors and Headers Shown in Figure 10
Item/callout
from Figure 1

Description
A PCI Conventional bus add-in card connector
B PCI Conventional bus add-in card connector
C PCI Express x16 connector
D Rear chassis fan header
E Parallel port header
F Processor core power connector (2 X 2)
G Processor fan header
H Main Power connector (2 X 12)
I Parallel ATA IDE connector
J Auxiliary front panel power LED header
K Front panel header
L Serial ATA connectors [4]
M Front panel USB header
N Front panel USB header
O Serial port header
P S/PDIF connector
Q Front panel audio header
46
2.2.2.1 Signal Tables for the Connectors and Headers
Table 11. Serial ATA Connectors
Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground

Table 12. Serial Port Header
Pin Signal Name Pin Signal Name
1 DCD 2 RXD#
3 TXD# 4 DTR
5 Ground 6 DSR
7 RTS 8 CTS
9 RI 10 Key (no pin)

Technical Reference
47
Table 13. Rear Chassis Fan Header
Pin Signal Name
1 Control
2 +12 V
3 Tach

Table 14. Processor Fan Header
Pin Signal Name
1 Ground
2 +12 V
3 FAN_TACH
4 FAN_CONTROL

Table 15. Front Panel Audio Header for Intel HD Audio
1 [Port 1] Left channel 2 Ground
3 [Port 1] Right channel 4 PRESENCE# (Dongle present)
5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 16. Front Panel Audio Header for AC 97 Audio
1 MIC 2 AUD_GND
3 MIC_BIAS 4 AUD_GND
5 FP_OUT_R 6 FP_RETURN_R
7 AUD_5V 8 KEY (no pin)
9 FP_OUT_L 10 FP_RETURN_L

Table 17. S/PDIF Connector
Pin Signal Name
1 VCC
2 S/PDIF out
3 Ground

48
Table 18. Parallel Port Header
1 STB- 2 AFD-
3 PD0 4 ERR-
5 PD1 6 INIT-
7 PD2 8 SLIN-
9 PD3 10 Ground
11 PD4 12 Ground
13 PD5 14 Ground
15 PD6 16 Ground
17 PD7 18 Ground
19 ACK- 20 Ground
21 BUSY 22 Ground
23 PE 24 Key (no pin)
25 SLCT 26 Ground

Technical Reference
49
2.2.2.2 Add-in Card Connectors
The board has the following add-in card connectors:
One PCI Express x16 connector:
Supports PCI Express 1.1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (500 MB/s total). The maximum theoretical bandwidth on the
interface is 4 GB/s in each direction simultaneously, for an aggregate of 8 GB/s
when operating in x16 mode.
Two PCI Conventional (rev 2.3 compliant) bus add-in card connectors. The SMBus
is routed to all PCI Conventional bus connectors. PCI Conventional bus add-in
cards with SMBus support can access sensor data and other information residing
on the board.
Note the following considerations for the PCI Conventional bus connectors:
All of the PCI Conventional bus connectors are bus master capable.
SMBus signals are routed to all PCI Conventional bus connectors. This enables PCI
Conventional bus add-in boards with SMBus support to access sensor data on the
board. The specific SMBus signals are as follows:
The SMBus clock line is connected to pin A40.
The SMBus data line is connected to pin A41.
2.2.2.3 Auxiliary Front Panel Power/Sleep LED Header
Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 19. Auxiliary Front Panel Power/Sleep LED Header
Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED

50
2.2.2.4 Power Supply Connectors
The board has the following power supply connectors:
Main power a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable on the
rightmost pins of the main power connector, leaving pins 11, 12, 23, and
24 unconnected.
Processor core power a 2 x 2 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
Table 20. Processor Core Power Connector
1 Ground 2 Ground
3 +12 V 4 +12 V
Table 21. Main Power Connector
1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V
(Note)
23 +5 V
(Note)

12 2 x 12 connector detect
(Note)
24 Ground
(Note)

Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

Power supply considerations Section 2.5.1, page 56

Technical Reference
51
2.2.2.5 Front Panel Header
This section describes the functions of the front panel header. Table 22 lists the signal
names of the front panel header. Figure 11 is a connection diagram for the front panel
header.
Table 22. Front Panel Header

Pin

Signal
In/
Out

Description

Pin

Signal
In/
Out

Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED pull-up
to +5 V
2 HDR_BLNK_
GRN
Out Front panel green
LED
3 HDA# Out Hard disk active LED 4 HDR_BLNK_
YEL
Out Front panel yellow
LED
Reset Switch On/Off Switch
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected

Figure 11. Connection Diagram for Front Panel Header

2.2.2.5.1 Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires one of the
following:
A Serial ATA hard drive connected to an onboard Serial ATA connector
A Parallel ATA IDE hard drive connected to an onboard Parallel ATA IDE connector
52
2.2.2.5.2 Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.5.3 Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 23 shows the
possible states for a one-color LED. Table 24 shows the possible states for a two-color
LED.
Table 23. States for a One-Color Power LED
LED State Description
Off Power off/sleeping
Steady Green Running

Table 24. States for a Two-Color Power LED
LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping
NOTE
The colors listed in Table 23 and Table 24 are suggested colors only. Actual LED
colors are chassis-specific.
2.2.2.5.4 Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
2.2.2.6 Auxiliary Front Panel Power LED Header
Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 25. Auxiliary Front Panel Power LED Header
Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED
Technical Reference
53
2.2.2.7 Front Panel USB Headers
Figure 12 is a connection diagram for the front panel USB headers.

INTEGRATORS NOTES
The +5 V DC power on the front panel USB headers is fused.
Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.

Figure 12. Connection Diagram for Front Panel USB Headers
54
2.3 Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 13 shows the location of the jumper block. The jumper determines the BIOS
Setup programs mode. Table 26 lists the jumper settings for the three modes:
normal, configure, and recovery. When the jumper is set to configure mode and the
computer is powered-up, the BIOS compares the processor version and the microcode
version in the BIOS and reports if the two match.

Figure 13. Location of the Jumper Block
Table 26. BIOS Setup Configuration Jumper Settings
Function/Mode Jumper Setting Configuration
Normal 1-2

The BIOS uses current configuration information and
passwords for booting.
Configure 2-3

After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
Recovery None

The BIOS attempts to recover the BIOS configuration. See
Section 3.7 for more information on BIOS recovery.
Technical Reference
55
2.4 Mechanical Considerations
2.4.1 Form Factor
The board is designed to fit into an ATX-form-factor chassis. Figure 14 illustrates the
mechanical form factor of the board. Dimensions are given in inches [millimeters].
The outer dimensions are 9.60 inches by 8.60 inches [243.84 millimeters by
218.44 millimeters]. Location of the I/O connectors and mounting holes are in
compliance with the ATX specification.

Figure 14. Board Dimensions

56
2.5 Electrical Considerations
2.5.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
The potential relation between 3.3 VDC and +5 VDC power rails
The current capability of the +5 VSB line
All timing parameters
All voltage tolerances
For example, for a system consisting of a supported 65 W processor (see Section 1.4
on page 14 for a list of supported processors), 1 GB DDR2 RAM, one hard disk drive,
one optical drive, and all board peripherals enabled, the minimum recommended
power supply is 300 W. Table 27 lists the recommended power supply current values.
Table 27. Recommended Power Supply Current Values
Output Voltage
3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB
Current
15 A 15 A 10 A 10 A 0.3 A 3.0 A

Technical Reference
57
2.5.2 Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 28 lists the current capability of the fan headers.
Table 28. Fan Header Current Capability
Fan Header Maximum Available Current
Processor fan 2.0 A
Rear chassis fan 1.5 A
2.5.3 Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards for a fully loaded board (both expansion
slots filled and the PCI Express x16 connector filled) must not exceed 8 A.
2.6 Thermal Considerations
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm

All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the boards maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
58
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 15) can reach a temperature of up to 95
o
C in
an open chassis.
Figure 15 shows the locations of the localized high temperature zones.

Item Description
A Processor voltage regulator area
B Processor
C Intel

82G41 GMCH
D Intel

82801GB (ICH7)
Figure 15. Localized High Temperature Zones
Technical Reference
59
Table 29 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 29. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel 82G41 GMCH 102
o
C (under bias)
Intel 82801GB (ICH7) 108
o
C (under bias)

Processor datasheets and specification updates Section 1.2, page 14
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 C. The Intel Desktop Board
DG41RQ MTBF is 106,946.1 hours.
60
2.8 Environmental
Table 30 lists the environmental specifications for the board.
Table 30. Intel Desktop Board DG41RQ Environmental Specifications
Parameter Specification
Temperature
Non-Operating -20 C to +70 C
Operating 0 C to +55 C
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second
Packaged Half sine 2 millisecond
Product weight (pounds) Free fall (inches) Velocity change
(inches/sec)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g Hz sloping up to 0.02 g Hz
20 Hz to 500 Hz: 0.02 g Hz (flat)
Packaged 10 Hz to 40 Hz: 0.015 g Hz (flat)
40 Hz to 500 Hz: 0.015 g Hz sloping down to 0.00015 g Hz

61
3 Overview of BIOS Features
3.1 Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug
and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as RQG4110H.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.

Maintenance Main Advanced Security Power Boot Exit

NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 54 shows how to put the board in configure mode.
62
Table 31 lists the BIOS Setup program menu features.
Table 31. BIOS Setup Program Menu Bar
Maintenance Main Advanced Security Power Boot Exit
Clears
passwords and
displays
processor
information
Displays
processor
and memory
configuration
Configures
advanced
features
available
through the
chipset
Sets
passwords
and security
features
Configures
power
management
features and
power supply
controls
Selects boot
options
Saves or
discards
changes to
Setup
program
options

Table 32 lists the function keys available for menu screens.
Table 32. BIOS Setup Program Function Keys
BIOS Setup Program
Function Key

Description
<> or <> Selects a different menu screen (Moves the cursor left or right)
<> or <> Selects an item (Moves the cursor up or down)
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
3.2 BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes an 8 Mbit
(1024 KB) flash memory device.
3.3 Resource Configuration
3.3.1 PCI Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or
add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having
to configure the system. When a user turns on the system after adding a PCI card,
the BIOS automatically configures interrupts, the I/O space, and other system
resources. Any interrupts set to Available in Setup are considered to be available for
use by the add-in card.
Overview of BIOS Features
63
3.3.2 PCI IDE Support
The IDE interface supports hard drives up to ATA-66/100 and recognizes any ATAPI
compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives.
To use ATA-66/100 features the following items are required:
An ATA-66/100 peripheral device
An ATA-66/100 compatible cable
ATA-66/100 operating system device drivers

NOTE
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master
device. For example, do not connect an ATA hard drive as a slave to an ATAPI
CD-ROM drive.
3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
BIOS data, such as the BIOS revision level
Fixed-system data, such as peripherals, serial numbers, and asset tags
Resource data, such as memory size, cache size, and processor speed
Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
64
3.5 Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating
systems USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel
Integrator
Toolkit.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating systems
installation instructions.
65
3.6 BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
Intel
Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
Intel
Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.

NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.

BIOS update utilities http://support.intel.com/support/motherboards/desktop/s
b/CS-022312.htm.

3.6.1 Language Support
The BIOS Setup program and help messages are supported in US English. Support for
three additional languages is currently in validation. Check the Intel website for
details.
66
3.6.2 Custom Splash Screen
During POST, an Intel
splash screen is displayed by default. This splash screen can

be augmented with a custom splash screen. The Intel Integrator Toolkit or Intel

Integrator Assistant that are available from Intel can be used to create a custom
splash screen.

NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.

For information about
Refer to
Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/
Additional Intel
software tools http://developer.intel.com/products/motherboard/DG41RQ/tools.htm

and
http://developer.intel.com/design/motherbd/software.htm
3.7 BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 33 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable.
Table 33. Acceptable Drives/Media Types for BIOS Recovery
Media Type Can be used for BIOS recovery?
CD-ROM drive connected to the Parallel ATA interface Yes
CD-ROM drive connected to the Serial ATA interface Yes
USB removable drive (a USB flash drive, for example) Yes
USB diskette drive (with a 1.44 MB diskette) No
USB hard disk drive No
Legacy diskette drive (with a 1.44 MB diskette) connected to the
legacy diskette drive interface
No

BIOS recovery http://support.intel.com/support/motherboards/desktop/
sb/CS-023360.htm
67
3.8 Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard
drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for
the diskette drive to be the first boot device, the hard drive second, and the ATAPI
CD-ROM third. The fourth device is disabled.
3.8.1 CD-ROM Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM
format specification. Under the Boot menu in the BIOS Setup program, ATAPI
CD-ROM is listed as a boot device. Boot devices are defined in priority order.
Accordingly, if there is not a bootable CD in the CD-ROM drive, the system will attempt
to boot from the next defined drive.
3.8.2 Network Boot
The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.8.3 Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
Video adapter
Keyboard
Mouse
3.8.4 Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices (as set in the BIOS setup programs
Boot Device Priority Submenu). Table 34 lists the boot device menu options.
Table 34. Boot Device Menu Options
Boot Device Menu Function Keys Description
<> or <> Selects a default boot device
<Enter> Exits the menu, saves changes, and boots from the selected
device
<Esc> Exits the menu without saving changes
68
3.9 Adjusting Boot Speed
These factors affect system boot speed:
Selecting and configuring peripherals properly
Optimized BIOS boot parameters
3.9.1 Peripheral Selection and Configuration
The following techniques help improve system boot speed:
Choose a hard drive with parameters such as power-up to data ready less than
eight seconds, that minimize hard drive startup delays.
Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot
process.
Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.
3.9.2 BIOS Boot Optimizations
Use of the following BIOS Setup program settings reduces the POST execution time.
In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the
POST execution time.
In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce up to four seconds of option ROM boot time.

NOTE
It is possible to optimize the boot process to the point where the system boots so
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.
Monitors and hard disk drives with minimum initialization times can also contribute to
a boot time that might be so fast that necessary logo screens and POST messages
cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If
this condition should occur, it is possible to introduce a programmable delay ranging
from three to 30 seconds (using the Hard Disk Pre-Delay feature of the Advanced
Menu in the Drive Configuration Submenu of the BIOS Setup program).
69
3.10 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
For enhanced security, use different passwords for the supervisor and user
passwords.
Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
Table 35 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 35. Supervisor and User Password Functions

Password
Set

Supervisor
Mode

User Mode

Setup Options
Password
to Enter
Setup
Password
During
Boot
Neither Can change all
options
(Note)

Can change all
options
(Note)

None None None
Supervisor
only
Can change all
options
Can change a
limited number
of options
Supervisor Password Supervisor None
User only N/A Can change all
options
Enter Password
Clear User Password
User User
Supervisor
and user set
Can change all
options
Can change a
limited number
of options
Supervisor Password
Enter Password
Supervisor or
user
Supervisor or
user
Note: If no password is set, any user can change all Setup options.
70

71
4 Error Messages and Beep Codes
4.1 Speaker
The board-mounted speaker provides audible error code (beep code) information
during POST.

The location of the onboard speaker Figure 1, page 11
4.2 BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS causes the boards
speaker to beep an error message describing the problem (see Table 36).
Table 36. Beep Codes
Type Pattern Frequency
Memory error Three long beeps 1280 Hz
Thermal warning Four alternating beeps:
High tone, low tone, high tone, low tone
High tone: 2000 Hz
Low tone: 1600 Hz
4.3 BIOS Error Messages
Whenever a recoverable error occurs during POST, the BIOS displays an error
message describing the problem. Table 37 lists the error messages and provides a
brief description of each.
Table 37. BIOS Error Messages
Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.

72
4.4 Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display.

NOTE
The POST card must be installed in PCI bus connector 1.
The following tables provide information about the POST codes generated by the BIOS.
Table 38 lists the Port 80h POST code ranges
Table 39 lists the Port 80h POST codes themselves
Table 40 lists the Port 80h POST sequence

NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 38. Port 80h POST Code Ranges
Range Category/Subsystem
00 0F Debug codes: Can be used by any PEIM/driver for debug.
10 1F Host Processors: 1F is an unrecoverable CPU error.
20 2F Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 3F Recovery: 3F indicated recovery failure.
40 4F Reserved for future use.
50 5F I/O Buses: PCI, USB, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 6F Reserved for future use (for new busses).
70 7F Output Devices: All output consoles. 7F is an unrecoverable error.
80 8F Reserved for future use (new output console codes).
90 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 AF Reserved for future use (new input console codes).
B0 BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 CF Reserved for future use.
D0 DF Boot device selection.
E0 FF E0 EE: Miscellaneous codes. See Table 39.
EF: boot/S3 resume failure.
F0 FF: FF processor exception.

Error Messages and Beep Codes
73
Table 39. Port 80h POST Codes
POST Code Description of POST Operation
Host Processor
10 Power-on initialization of the host processor (Boot Strap Processor)
11 Host processor Cache initialization (including APs)
12 Starting Application processor initialization
13 SMM initialization
Chipset
21 Initializing a chipset component
Memory
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
24 Programming timing parameters in the memory controller and the DIMMs
25 Configuring memory
26 Optimizing memory settings
27 Initializing memory, such as ECC init
28 Testing memory
PCI Bus
50 Enumerating PCI busses
51 Allocating resources to PCI bus
52 Hot Plug PCI controller initialization
53 57 Reserved for PCI Bus
USB
58 Resetting USB bus
59 Reserved for USB
ATA/ATAPI/SATA
5A Resetting PATA/SATA bus and all devices
5B Reserved for ATA
SMBus
5C Resetting SMBus
5D Reserved for SMBus
Local Console
70 Resetting the VGA controller
71 Disabling the VGA controller
72 Enabling the VGA controller
Remote Console
78 Resetting the console controller
79 Disabling the console controller
7A Enabling the console controller
continued
74
Table 39. Port 80h POST Codes (continued)
Keyboard (PS/2 or USB)
90 Resetting keyboard
91 Disabling keyboard
92 Detecting presence of keyboard
93 Enabling the keyboard
94 Clearing keyboard input buffer
95 Instructing keyboard controller to run Self Test (PS/2 only)
Mouse (PS/2 or USB)
98 Resetting mouse
99 Disabling mouse
9A Detecting presence of mouse
9B Enabling mouse
Fixed Media
B0 Resetting fixed media
B1 Disabling fixed media
B2 Detecting presence of a fixed media (IDE hard drive detection etc.)
B3 Enabling/configuring a fixed media
Removable Media
B8 Resetting removable media
B9 Disabling removable media
BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.)
BC Enabling/configuring a removable media
PEI Core
E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2 Permanent memory found
E1, E3 Reserved for PEI/PEIMs
DXE Core
E4 Entered DXE phase
E5 Started dispatching drivers
continued
Error Messages and Beep Codes
75
Table 39. Port 80h POST Codes (continued)
DXE Drivers
E7 Waiting for user input
E8 Checking password
E9 Entering BIOS setup
EB Calling Legacy Option ROMs
Runtime Phase/EFI OS Boot
F8 EFI boot service ExitBootServices ( ) has been called
F9 EFI runtime service SetVirtualAddressMap ( ) has been called
FA EFI runtime service ResetSystem ( ) has been called
PEIMs/Recovery
30 Crisis Recovery has initiated per User request
31 Crisis Recovery has initiated by software (corrupt flash)
34 Loading recovery capsule
35 Handing off control to the recovery capsule
3F Unable to recover
76
Table 40. Typical Port 80h POST Sequence
POST Code Description
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
25 Configuring memory
28 Testing memory
34 Loading recovery capsule
E4 Entered DXE phase
12 Starting application processor initialization
13 SMM initialization
50 Enumerating PCI busses
51 Allocating resourced to PCI bus
92 Detecting the presence of the keyboard
95 Keyboard Self Test
EB Calling Video BIOS
58 Resetting USB bus
92 Detecting the presence of the keyboard
28 Testing memory
E7 Waiting for user input
01 INT 19
00 Ready to boot

77
5 Regulatory Compliance and Battery
Disposal Information
5.1 Regulatory Compliance
This section contains the following regulatory compliance information for Intel Desktop
Board DG41RQ:
Safety standards
European Union Declaration of Conformity statement
Product Ecology statements
Electromagnetic Compatibility (EMC) standards
Product certification markings
5.1.1 Safety Standards
The Intel Desktop Board DG41RQ complies with the safety standards stated in Table
41 when correctly installed in a compatible host system.
Table 41. Safety Standards
Standard Title
CSA/UL 60950-1, First Edition Information Technology Equipment Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1:2006, Second
Edition
Information Technology Equipment Safety - Part 1: General
Requirements (European Union)
IEC 60950-1:2005, Second
Edition
Information Technology Equipment Safety - Part 1: General
Requirements (International)

78
5.1.2 European Union Declaration of Conformity
Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel

Desktop Board DG41RQ is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC and
2006/95/EC.
etina Tento vrobek odpovd poadavkm evropskch smrnic 2004/108/EC a
2006/95/EC.
Dansk Dette produkt er i overensstemmelse med det europiske direktiv
2004/108/EC & 2006/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC & 2006/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC
kehtestatud nuetele.
Suomi Tm tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC mryksi.
Franais Ce produit est conforme aux exigences de la Directive Europenne
2004/108/EC & 2006/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europischen Richtlinie
2004/108/EC & 2006/95/EC.

2004/108/EC 2006/95/EC.
Magyar E termk megfelel a 2004/108/EC s 2006/95/EC Eurpai Irnyelv
elrsainak.
Icelandic essi vara stenst regluger Evrpska Efnahags Bandalagsins nmer
2004/108/EC & 2006/95/EC.
Italiano Questo prodotto conforme alla Direttiva Europea 2004/108/EC &
2006/95/EC.
Latvieu is produkts atbilst Eiropas Direktvu 2004/108/EC un 2006/95/EC
noteikumiem.
Lietuvi is produktas atitinka Europos direktyv 2004/108/EC ir 2006/95/EC
nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC u 2006/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC & 2006/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC i 73/23/EWG.
Portuguese Este produto cumpre com as normas da Diretiva Europia 2004/108/EC
& 2006/95/EC.
Regulatory Compliance and Battery Disposal Information
79
Espaol Este producto cumple con las normas del Directivo Europeo 2004/108/EC &
2006/95/EC.
Slovensky Tento produkt je v slade s ustanoveniami eurpskych direktv
2004/108/EC a 2006/95/EC.
Slovenina Izdelek je skladen z dolobami evropskih direktiv 2004/108/EC in
2006/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC &
2006/95/EC.
Trke Bu rn, Avrupa Birliinin 2004/108/EC ve 2006/95/EC ynergelerine uyar.
5.1.3 Product Ecology Statements
The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1 Disposal Considerations
This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2 Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intels branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.

Intel Product Recycling Program

http://www.intel.com/intel/other/ehs/product_ecology

Deutsch
Als Teil von Intels Engagement fr den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermglicht, gebrauchte Produkte an ausgewhlte Standorte fr
ordnungsgemes Recycling zurckzugeben.
Details zu diesem Programm, einschlielich der darin eingeschlossenen Produkte,
verfgbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
80
Espaol
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envo, trminos y condiciones, etc.
Franais
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en uvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits uss en les retournant des adresses spcifies.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en
savoir plus sur ce programme, savoir les produits concerns, les adresses
disponibles, les instructions d'expdition, les conditions gnrales, etc.

http://www.intel.com/in
tel/other/ehs/product_ecology
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos so reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Ingls)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponveis, as instrues de envio, os termos e condies, etc.
81
Russian
, Intel
Intel (Product Recycling Program)
Intel

.
, -
, , , ,
..
Trke
Intel, evre sorumluluuna bamllnn bir paras olarak, perakende tketicilerin
Intel markal kullanlm rnlerini belirlenmi merkezlere iade edip uygun ekilde geri
dntrmesini amalayan Intel rnleri Geri Dnm Programn uygulamaya
koymutur.
Bu programn rn kapsam, rn iade merkezleri, nakliye talimatlar, kaytlar ve
artlar v.s dahil btn ayrntlarn grenmek iin ltfen
Web sayfasna gidin.
5.1.3.3 Lead Free Intel Desktop Board
This Intel Desktop Board is a European Union Restriction of Hazardous Substances (EU
RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six
materials. One of the six restricted materials is lead.
This board is lead free although certain discrete components used on the board
contain a small amount of lead which is necessary for component performance and/or
reliability. This Intel Desktop Board is referred to as Lead-free second level
interconnect. The board substrate and the solder connections from the board to the
components (second-level connections) are all lead free.
China bans the same substances and has the same limits as EU RoHS; however it
requires different product marking and controlled substance information. The required
mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as
the number of years for which controlled listed substances will not leak or chemically
deteriorate while in the product.
Table 42 shows the various forms of the Lead-Free 2
nd
Level Interconnect mark as it
appears on the board and accompanying collateral.
82
Table 42. Lead-Free Board Markings
Description Mark
Lead-Free 2
nd
Level Interconnect:
This symbol is used to identify
electrical and electronic
assemblies and components in
which the lead (Pb) concentration
level in the desktop board
substrate and the solder
connections from the board to the
components (second-level
interconnect) is not greater than
0.1% by weight (1000 ppm).

or

or

83
5.1.4 EMC Regulations
The Intel Desktop Board DG41RQ complies with the EMC regulations stated in Table 43
when correctly installed in a compatible host system.
Table 43. EMC Regulations
Regulation Title
FCC 47 CFR Part 15,
Subpart B
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
Frequency Devices. (USA)
ICES-003 Issue 4
(Class B)
Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022:2006
(Class B)
Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)
EN55024:1998
(Class B)
Information Technology Equipment Immunity Characteristics Limits and
methods of measurement. (European Union)
EN55022:2006
(Class B)
Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22:2005
+A1:2005 +A2:2006
(Class B)
Limits and methods of measurement of Radio Disturbance Characteristics of
Information Technology Equipment. (International)
CISPR 24:1997
+A1:2001 +A2:2002
(Class B)
Information Technology Equipment Immunity Characteristics Limits and
Methods of Measurement. (International)
VCCI V-3/2007.04,
V-4/2007.04, Class B
Voluntary Control for Interference by Information Technology Equipment.
(Japan)

Japanese Kanji statement translation: this is a Class B product based on the standard
of the Voluntary Control Council for Interference from Information Technology
Equipment (VCCI). If this is used near a radio or television receiver in a domestic
environment, it may cause radio interference. Install and use the equipment
according to the instruction manual.

84
Korean Class B statement translation: this is household equipment that is certified to
comply with EMC requirements. You may use this equipment in residential
environments and other non-residential environments.

5.1.5 Product Certification Markings (Board Level)
Intel Desktop Board DG41RQ has the product certification markings shown in
Table 44:
Table 44. Product Certification Markings
Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel Desktop Boards: E210882.

FCC Declaration of Conformity logo mark for Class B equipment. Includes
Intel name and DG41RQ model designation.

CE mark. Declaring compliance to European Union (EU) EMC directive and
Low Voltage directive.

Australian Communications Authority (ACA) and New Zealand Radio Spectrum
Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code
number, N-232.

Japan VCCI (Voluntary Control Council for Interference) mark.

KCC (Korean Communications Commission) EMC certification mark. Includes
adjacent KCC certification number: CPU-DG41RQ (B).

Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Includes adjacent Intel company number, D33025.

Printed wiring board manufacturers recognition mark. Consists of a unique
UL recognized manufacturers logo, along with a flammability rating (solder
side).
V-0
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Desktop Boards and associated collateral. The color
of the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined
to be 10 years.

85
5.2 Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRCAUTION
Risque d'explosion si la pile usage est remplace par une pile de type incorrect. Les
piles usages doivent tre recycles dans la mesure du possible. La mise au rebut des
piles usages doit respecter les rglementations locales en vigueur en matire de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
br om muligt genbruges. Bortskaffelse af brugte batterier br foreg i
overensstemmelse med gldende miljlovgivning.
OBS!
Det kan oppst eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
br kastes i henhold til gjeldende miljlovgivning.
VIKTIGT!
Risk fr explosion om batteriet erstts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljvrdsbestmmelserna.
VARO
Rjhdysvaara, jos pariston tyyppi on vr. Paristot on kierrtettv, jos se on
mahdollista. Kytetyt paristot on hvitettv paikallisten ympristmrysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
86
PRECAUCIN
Existe peligro de explosin si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENO
Haver risco de exploso se a bateria for substituda por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminao de baterias
usadas deve ser feita de acordo com as regulamentaes ambientais da regio.
ACIAROZNA
, .
, , .
.
UPOZORNN
V ppad vmny baterie za nesprvn druh me dojt k vbuchu. Je-li to mon,
baterie by mly bt recyklovny. Baterie je teba zlikvidovat v souladu s mstnmi
pedpisy o ivotnm prosted.

.
.
.
VIGYZAT
Ha a telepet nem a megfelel tpus telepre cserli, az felrobbanhat. A telepeket
lehetsg szerint jra kell hasznostani. A hasznlt telepeket a helyi krnyezetvdelmi
elrsoknak megfelelen kell kiselejtezni.

87
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEENIE
Istnieje niebezpieczestwo wybuchu w przypadku zastosowania niewaciwego typu
baterii. Zuyte baterie naley w miar moliwoci utylizowa zgodnie z odpowiednimi
przepisami ochrony rodowiska.
PRECAUIE
Risc de explozie, dac bateria este nlocuit cu un tip de baterie necorespunztor.
Bateriile trebuie reciclate, dac este posibil. Depozitarea bateriilor uzate trebuie s
respecte reglementrile locale privind protecia mediului.

.
.
, .
UPOZORNENIE
Ak batriu vymente za nesprvny typ, hroz nebezpeenstvo jej vbuchu.
Batrie by sa mali poda monosti vdy recyklova. Likvidcia pouitch batri sa mus
vykonva v slade s miestnymi predpismi na ochranu ivotnho prostredia.
POZOR
Zamenjava baterije z baterijo druganega tipa lahko povzroi eksplozijo.
e je mogoe, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.

.

UYARI
Yanl trde pil takldnda patlama riski vardr. Piller mmkn olduunda geri
dntrlmelidir. Kullanlm piller, yerel evre yasalarna uygun olarak atlmaldr.
O
, .
, .
, .
88

Manual Da Placa HP Dg41rq

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December 2008

Order Number: E58745-001US

Desktop Board DG41RQ Technical Product

Desktop Board DG41RQ with BIOS

G41 Express Chipset ............................................................... 18

Core2 Quad processor in an LGA775 socket

Core2 Duo processor in an LGA775 socket

Dual-Core processor in an LGA775 socket

processor Sequence 400 in an LGA775 socket

G41 Express Chipset, consisting of:

Graphics Media Accelerator X4500 (Intel

BIOS (resident in the SPI Flash device)

Desktop Board products, with specific changes

G41 Express Chipset

Graphics Media Accelerator X4500 Graphics

Desktop Utilities or third-party

splash screen is displayed by default. This splash screen can

software tools http://developer.intel.com/products/motherboard/DG41RQ/tools.htm

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