This paper presents results of tests carried out to investigate a passive technology based on integration of a thermal diode and thermoelectric modules for a novel heat pump. The system is very compact and suitable for incorporation within the building structure. The heat pump uses thermoelectric modules to produce cooling or heating, and a new type of thermal diode to transfer heat into or out of the building, while preventing reverse heat flow in the event of power failure. Following design and construction of a thermoelectric heat pump prototype, its performance was investigated for two different modes, i.e., cooling and heating, under various operating conditions and environmental temperatures. Results showed that reducing the temperature of the thermal diode condenser could provide a significant improvement in the efficiency of the thermal diode and the coefficient of performance (COP) of the system in cooling mode. This can be achieved using the evaporation of water on the heat sink attached to the condenser. The experimental results showed that the new type of thermal diode worked effectively in both cooling and heating modes.
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