As the enhanced acceleration performance of electric vehicles demands improved mileage
capabilities, 3D packaging is a promising solution for developing high-power-density SiC …

This paper proposes a method for designing a 77 GHz series-fed patch array antenna. Based
on the traditional genetic algorithm, the study explores different array topologies consisting …

Various hollowing substrates have been invented to equipped in the embedded cooling
power modules. Through a lower stress residue, multilayer nanosilver paste ensemble …

In order to detect electricity theft in a timely manner, an ultra wideband large dynamic range
logarithmic linear Schottky diode detector has been designed. By using a voltage doubling …

A band-pass-filter (BPF) based on silicon substrate was designed and simulated. Different
software was applied to design and simulate the character of the filter. A three-order filter was …

In this paper, a novel high sensitive active integrated antenna (AIA) structure for 2.4 GHz
receivers is developed. The antenna is made of a rectangle microstrip probe-fed antenna and a …

In order to meet the requirement of monitoring the strong electromagnetic environment in
space, the design of broadband miniaturized planar spiral antenna is presented in this paper, …

In this paper, we present a complete 700-2600MHz RF SiP for micro base station. This RF
SiP design integrates transmitter, receiver, feedback module, ADC/DAC and CLK module. It …

Increasingly aggressive requirements of active devices have challenged the physical limits
of conventional packaging technologies. Bandwidth-intensive consumer and enterprise …

This paper presents a multichip stack packaging based on flexible substrate. In this structure,
three dummy chips with daisy chain test circuit were flip-chip bonded on a double-layer non…