Kang et al., 1998 - Google Patents
Application of anisotropic conductive films for realization of interconnects in micromechanical structuresKang et al., 1998
- Document ID
- 9897955124233995704
- Author
- Kang I
- Haskard M
- Samaan N
- Publication year
- Publication venue
- 1996 Symposium on Smart Materials, Structures, and MEMS
External Links
Snippet
A new micromachining process, the application of an anisotropic conductive film (ACF) for micromechanical structures as well as interconnection both mechanically and electrically, is reported. The film acts as a spacer and adhesive as well as an electrical conductor in the …
- 238000000034 method 0 abstract description 29
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
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