[go: up one dir, main page]

Imanaka et al., 2004 - Google Patents

Integrated RF module produced by aerosol deposition method

Imanaka et al., 2004

Document ID
9533569564765724978
Author
Imanaka Y
Akedo J
Publication year
Publication venue
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No. 04CH37546)

External Links

Snippet

Integrating and embedding various passive components like capacitors, and inductors, in one system module, is one of the attractive ways to achieve down-sizing, cost-reduction and higher performance in RF wireless communication products. Because the unique aerosol …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors

Similar Documents

Publication Publication Date Title
Imanaka et al. Aerosol deposition for post-LTCC
US7579251B2 (en) Aerosol deposition process
Nam et al. Alumina thick films as integral substrates using aerosol deposition method
JP4431747B2 (en) Manufacturing method of semiconductor device
WO2011129360A1 (en) Capacitor and method for producing same
JP5263915B2 (en) Capacitor element manufacturing method
Imanaka et al. Integrated RF module produced by aerosol deposition method
JP2010103474A (en) Method for manufacturing non-contracted multilayer ceramic substrate
JP2004342831A (en) Circuit board, electronic device, and method of manufacturing circuit board
Imanaka et al. Nanoparticulated Dense and Stress‐F ree Ceramic Thick Film for Material Integration
JP7204673B2 (en) Method for producing modified perovskite-type composite oxide
Imanaka et al. Ceramic dielectric film for microwave filter deposited at room temperature
JP5401805B2 (en) Deposition method
US20070289691A1 (en) Method of manufacturing non-shrinkage ceramic substrate
JP5617291B2 (en) Aerosol deposition apparatus and aerosol deposition method
Imanaka et al. Embedded capacitor technology using aerosol deposition
JP2008227153A (en) Dielectric material for multilayer printed wiring board with built-in capacitor, multilayer printed wiring board with built-in capacitor member and capacitor, and method for manufacturing multilayer printed wiring board with built-in capacitor
JP2015147722A (en) Laminate, method for producing laminate, and method for producing powder
JP3554171B2 (en) Circuit board manufacturing method
JP2006248074A (en) Composite substrate with high dielectric constant, composite sheet with high dielectric constant, and methods for producing them
Imanaka Future of LTCCs
KR100890922B1 (en) Highly Integrated 3D Ceramic Module Manufacturing Method
Sundaram et al. Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration
JP4372471B2 (en) Manufacturing method of electronic component built-in substrate
JP4487515B2 (en) Capacitors