Zou et al., 2005 - Google Patents
Solderability testing with components preheating.Zou et al., 2005
View PDF- Document ID
- 9223998405164973240
- Author
- Zou L
- Hunt C
- Publication year
External Links
Snippet
This note describes a new development of solderability testing with a component preheat which allows testing to be carried out using test temperatures and fluxes which reflect those in use in the reflow assembly industry. Worries about the relevance of the current testing are …
- 229910000679 solder 0 abstract description 23
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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