Kodama et al., 2015 - Google Patents

Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
  • G06F17/50—Computer-aided design
  • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
  • G06F17/5081—Layout analysis, e.g. layout verification, design rule check
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
  • G06F17/50—Computer-aided design
  • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
  • G06F17/5077—Routing
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
  • G06F17/50—Computer-aided design
  • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
  • G06F17/5072—Floorplanning, e.g. partitioning, placement
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
  • G06F17/50—Computer-aided design
  • G06F17/5009—Computer-aided design using simulation
  • G06F17/5036—Computer-aided design using simulation for analog modelling, e.g. for circuits, spice programme, direct methods, relaxation methods
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
  • G06F17/50—Computer-aided design
  • G06F17/5045—Circuit design
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING; COUNTING
  • G06F—ELECTRICAL DIGITAL DATA PROCESSING
  • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
  • G06F2217/12—Design for manufacturability
• • H—ELECTRICITY
  • H01—BASIC ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
  • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
  • H01L23/528—Geometry or layout of the interconnection structure
• • H—ELECTRICITY
  • H01—BASIC ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H01—BASIC ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
  • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
  • H01L27/0203—Particular design considerations for integrated circuits
  • H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
• • H—ELECTRICITY
  • H01—BASIC ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
  • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
  • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
  • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
  • H01L27/118—Masterslice integrated circuits
  • H01L27/11803—Masterslice integrated circuits using field effect technology
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
  • G03F1/14—Originals characterised by structural details, e.g. supports, cover layers, pellicle rings
  • G03F1/144—Auxiliary patterns; Corrected patterns, e.g. proximity correction, grey level masks

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