[go: up one dir, main page]

Pain et al., 1999 - Google Patents

A low-power digital camera-on-a-chip implemented in CMOS active pixel approach

Pain et al., 1999

View PDF
Document ID
7942547318440822245
Author
Pain B
Yang G
Olson B
Shaw T
Ortiz M
Heynssens J
Wrigley C
Ho C
Publication year
Publication venue
Proceedings Twelfth International Conference on VLSI Design.(Cat. No. PR00013)

External Links

Snippet

The advent of high performance imaging in CMOS technology using active pixel sensors has enabled ultra-low power, miniature, integrated, single-chip camera systems. We report the first fully digital, programmable, 5-wire, large format (512/spl times/512) digital-camera …
Continue reading at citeseerx.ist.psu.edu (PDF) (other versions)

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/335—Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
    • H04N5/369—SSIS architecture; Circuitry associated therewith
    • H04N5/374—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N5/3745—Addressed sensors, e.g. MOS or CMOS sensors having additional components embedded within a pixel or connected to a group of pixels within a sensor matrix, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N5/37457—Addressed sensors, e.g. MOS or CMOS sensors having additional components embedded within a pixel or connected to a group of pixels within a sensor matrix, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, e.g. at least one part of the amplifier has to be on the sensor array itself
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/335—Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
    • H04N5/369—SSIS architecture; Circuitry associated therewith
    • H04N5/374—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N5/3745—Addressed sensors, e.g. MOS or CMOS sensors having additional components embedded within a pixel or connected to a group of pixels within a sensor matrix, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N5/37452—Addressed sensors, e.g. MOS or CMOS sensors having additional components embedded within a pixel or connected to a group of pixels within a sensor matrix, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising additional storage means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/335—Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
    • H04N5/369—SSIS architecture; Circuitry associated therewith
    • H04N5/378—Readout circuits, e.g. correlated double sampling [CDS] circuits, output amplifiers or A/D converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/335—Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
    • H04N5/351—Control of the SSIS depending on the scene, e.g. brightness or motion in the scene
    • H04N5/355—Control of the dynamic range
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N3/00—Scanning details of television systems
    • H04N3/10—Scanning details of television systems by means not exclusively optical-mechanical
    • H04N3/14—Scanning details of television systems by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
    • H04N3/15—Scanning details of television systems by means not exclusively optical-mechanical by means of electrically scanned solid-state devices for picture signal generation
    • H04N3/155—Control of the image-sensor operation, e.g. image processing within the image-sensor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/335—Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
    • H04N5/357—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N5/363—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to reset noise, e.g. KTC noise related to CMOS structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/335—Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
    • H04N5/357—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N5/361—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to dark current
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/222—Studio circuitry; Studio devices; Studio equipment; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225—Television cameras; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14689—MOS based technologies
    • H—ELECTRICITY
    • H03—BASIC ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/12—Analogue/digital converters
    • H03M1/14—Conversion in steps with each step involving the same or a different conversion means and delivering more than one bit
    • H—ELECTRICITY
    • H03—BASIC ELECTRONIC CIRCUITRY
    • H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
    • H03M1/00—Analogue/digital conversion; Digital/analogue conversion
    • H03M1/12—Analogue/digital converters
    • H03M1/50—Analogue/digital converters with intermediate conversion to time interval
    • H03M1/56—Input signal compared with linear ramp

Similar Documents

Publication Publication Date Title
Mase et al. A wide dynamic range CMOS image sensor with multiple exposure-time signal outputs and 12-bit column-parallel cyclic A/D converters
Furuta et al. A high-speed, high-sensitivity digital CMOS image sensor with a global shutter and 12-bit column-parallel cyclic A/D converters
US9154714B2 (en) Solid-state image pickup device and control method thereof
US9503662B2 (en) Solid-state imaging device and camera system
US7297917B2 (en) Readout technique for increasing or maintaining dynamic range in image sensors
Theuwissen CMOS image sensors: State-of-the-art
US8462243B2 (en) Solid-state image sensing device, method for reading signal of solid-state image sensing device, and image pickup apparatus
Kavusi et al. Quantitative study of high-dynamic-range image sensor architectures
US7030921B2 (en) Solid-state image-sensing device
US7321329B2 (en) Analog-to-digital converter and semiconductor device
Theuwissen CMOS image sensors: State-of-the-art and future perspectives
US20050168602A1 (en) Method of controlling semiconductor device, signal processing method, semicondcutor device, and electronic apparatus
Seo et al. A low noise wide dynamic range CMOS image sensor with low-noise transistors and 17b column-parallel ADCs
KR20180134038A (en) Ramp signal generator and image sensor
CN111787250B (en) Comparator circuit, image sensing device and method
JP4157862B2 (en) ANALOG-DIGITAL CONVERTER AND ITS OPERATION METHOD, IMAGING DEVICE, AND LAMP GENERATOR OPERATION METHOD
Fossum Low power camera-on-a-chip using CMOS active pixel sensor technology
Pain et al. A low-power digital camera-on-a-chip implemented in CMOS active pixel approach
Pain et al. A single-chip programmable digital CMOS imager with enhanced low-light detection capability
YusukeOike et al. A 121.8 dB dynamic range CMOS image sensor using pixel-variation-free midpoint potential drive and overlapping multiple exposures
Theuwissen CMOS Image Sensors
Pain et al. A Single-chip Programmable Digital CMOS Imager with Enhanced Low light Detection Capability zyxwvutsrqpon
Waeny et al. High-sensitivity high-dynamic digital CMOS imager
JP4521050B2 (en) Analog-digital converter and operation method thereof, lamp generator and operation method thereof, and imaging apparatus
JP2024528318A (en) PIXEL ARRAY, IMAGE SENSOR, AND METHOD FOR OPERATING A PIXEL ARRAY - Patent application