Bek et al., 2011 - Google Patents
Kinetics of silver anodic dissolution in thiosulfate electrolytesBek et al., 2011
- Document ID
- 7852107533238044569
- Author
- Bek R
- Shevtsova O
- Publication year
- Publication venue
- Russian Journal of Electrochemistry
External Links
Snippet
The regularities of silver anodic dissolution are studied by using the voltammetry (at the potential scan rates from 5 to 1000 mV/s) on the electrode, which was renewed immediately in the solution by cutting-off a thin surface metal layer, and quartz microgravimetry, for …
- 229910052709 silver 0 title abstract description 60
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in H01L21/20 - H01L21/268
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101600413B1 (en) | Method and apparatus for plating solution analysis and control | |
| Alodan et al. | Effect of thiourea on copper dissolution and deposition | |
| TWI226439B (en) | Plating bath analysis | |
| JP4427452B2 (en) | Measurement of reducing agent concentration in electroless plating bath | |
| Hebert | Role of chloride ions in suppression of copper electrodeposition by polyethylene glycol | |
| Barbosa et al. | Study and development of an alkaline bath for copper deposition containing sorbitol as complexing agent and morphological characterization of the copper film | |
| Bek et al. | Kinetics of silver anodic dissolution in thiosulfate electrolytes | |
| Izatt et al. | Studies on Coördination compounds. XII. Calculation of thermodynamic formation constants at varying ionic strengths | |
| Zeszut et al. | Determination of redox currents in electroless systems: correct application of mixed potential analysis | |
| Beltowska-Lehman et al. | Effect of complex formation on the diffusion coefficient of CuII in citrate solution containing NiII and MoVI | |
| Pauliukaitė et al. | Effect of Cu (II) ligands on electroless copper deposition rate in formaldehyde solutions: An EQCM study | |
| Lambert et al. | Analysis of films on Copper by Coulometric reduction | |
| Survila et al. | Electrochemical processes in weakly acid solutions containing Cu (II)-glycine complexes | |
| Bek et al. | The effect of thallium ions on the gold dissolution rate in thiosulfate electrolytes | |
| Vvedenskii et al. | Copper oxides: kinetics of formation and semiconducting properties. Part I. Polycrystalline copper and copper-gold alloys | |
| JP6063221B2 (en) | Gold concentration determination method and gold concentration determination apparatus in plating solution | |
| Bek | Kinetics of anodic dissolution of gold in cyanide solutions containing thallium ions: Potentiostatic measurements | |
| Bek et al. | Kinetics of gold dissolution in thiosulfate electrolytes | |
| JPH0798296A (en) | Measuring method for concentration of additive in electroless copper plating liquid | |
| Survila et al. | Simultaneous photoelectrochemistry and piezoelectric microgravimetry, with the use of electrochemical quartz crystal microbalance, of surface layers formed at the Cu/Cu (II), β-alanine interface | |
| Bek et al. | Peculiarities of cathodic reduction of gold from sulfite-thiocarbamide electrolytes | |
| Bek et al. | Peculiarities of anodic behavior of gold electrode in thiosulfate electrolytes | |
| Nikitchenko et al. | Peculiarities of electrochemical behavior of copper in alkaline solutions in the presence of alanine | |
| Tur'yan | Studying kinetics of the dehydration reaction of pyruvic acid and ethyl pyruvate using the polarographic kinetic currents | |
| Kuznetsov et al. | Copper electroplating from sulfate electrolytes containing crown ethers |