[go: up one dir, main page]

Zhang et al., 2015 - Google Patents

Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints

Zhang et al., 2015

Document ID
6909748779105391997
Author
Zhang Q
Long W
Yu X
Pei Y
Qiao P
Publication year
Publication venue
Journal of Alloys and Compounds

External Links

Snippet

The effects of Ga alloying on melting behaviors of the SnAgCu solder, the interfacial reaction behaviors and mechanical properties of the SnAgCu/Cu solder joints were investigated in this study. The melting behaviors of the Sn3. 5Ag0. 7Cu1. 5Ga solder alloy was analyzed …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin

Similar Documents

Publication Publication Date Title
Zhang et al. Effects of Ga addition on microstructure and properties of Sn–Ag–Cu/Cu solder joints
El-Daly et al. Improved creep resistance and thermal behavior of Ni-doped Sn–3.0 Ag–0.5 Cu lead-free solder
Hu et al. Microstructure evolution and shear fracture behavior of aged Sn3Ag0. 5Cu/Cu solder joints
El-Daly et al. Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0 Ag–0.5 Cu lead-free solder alloy
Shen et al. Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn–Bi-based solder alloys
Hammad Investigation of microstructure and mechanical properties of novel Sn–0.5 Ag–0.7 Cu solders containing small amount of Ni
El-Daly et al. Development of high strength Sn–0.7 Cu solders with the addition of small amount of Ag and In
Li et al. Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders
El-Daly et al. Improved strength of Ni and Zn-doped Sn–2.0 Ag–0.5 Cu lead-free solder alloys under controlled processing parameters
Tunthawiroon et al. Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate
Zhang et al. Effect of Sb content on properties of Sn—Bi solders
Gain et al. Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1 wt% nano-ZrO2 composite solders
Yang et al. Microstructure, interfacial IMC and mechanical properties of Sn–0.7 Cu–xAl (x= 0–0.075) lead-free solder alloy
Chellvarajoo et al. Effects of diamond nanoparticles reinforcement into lead-free Sn–3.0 Ag–0.5 Cu solder pastes on microstructure and mechanical properties after reflow soldering process
Gain et al. Effects of Ni nanoparticles addition on the microstructure, electrical and mechanical properties of Sn-Ag-Cu alloy
Zhang et al. Properties enhancement of SnAgCu solders containing rare earth Yb
Zhao et al. Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples
Kantarcıoğlu et al. Effects of Al and Fe additions on microstructure and mechanical properties of SnAgCu eutectic lead-free solders
Wei et al. Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints
Yang et al. Influence of BaTiO3 nanoparticle addition on microstructure and mechanical properties of Sn-58Bi solder
Zhu et al. Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying
Yonekura et al. Bonding mechanism of lead-free solder and glass plate by ultrasonic assisted soldering method
Zhang et al. In situ observations on shear and creep–fatigue fracture behaviors of SnBi/Cu solder joints
Zhang et al. Fatigue fracture mechanisms of Cu/lead-free solders interfaces
Sabbar et al. Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints