[go: up one dir, main page]

Molian et al., 2008 - Google Patents

Thermal stress fracture mode of CO2 laser cutting of aluminum nitride

Molian et al., 2008

Document ID
5833854678207705458
Author
Molian R
Shrotriya P
Molian P
Publication year
Publication venue
The International Journal of Advanced Manufacturing Technology

External Links

Snippet

A thermal stress fracture mode of material removal by laser cutting was conducted in 1-mm thick wafers of aluminum nitride (AlN) using a continuous wave CO2 laser with a defocused beam. In this mode, a thin layer (10–20 μm) of AlN surface was melted in an oxygen …
Continue reading at link.springer.com (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2201/00—Articles made by soldering, welding or cutting by applying heat locally
    • B23K2201/36—Electric or electronic devices
    • B23K2201/40—Semiconductor devices
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses

Similar Documents

Publication Publication Date Title
Hanon et al. Experimental and theoretical investigation of the drilling of alumina ceramic using Nd: YAG pulsed laser
Molian et al. Thermal stress fracture mode of CO2 laser cutting of aluminum nitride
Feng et al. Surface quality evaluation of single crystal 4H-SiC wafer machined by hybrid laser-waterjet: Comparing with laser machining
CN100493815C (en) Laser cutting method for hard brittle non-metallic material
US20150376073A1 (en) Method for machining ceramic matrix composite
Cheng et al. Laser beam induced thermal-crack propagation for asymmetric linear cutting of silicon wafer
Zahrani et al. Investigation of laser-assisted cylindrical grinding of silicon nitride ceramics with controlled damage zone
Radhakrishnan et al. Machining of Ox-Ox (Al2O3/Al2O3) ceramics matrix composites by ultrafast laser
Kalyanasundaram et al. Design and validation of a hybrid laser/water-jet machining system for brittle materials
Molian et al. Novel laser/water-jet hybrid manufacturing process for cutting ceramics
Zhao et al. Fabrication of CaSiO3 LTCC high aspect ratio microstructure by laser chemical assisted micro-milling
Singh et al. Ultrashort pulse laser micromachining of silicon: effect of repetition rate and assessment of surface integrity of microchannels
Radhakrishnan et al. Precision machining of alumina-reinforced ceramic matrix composites by femtosecond laser
Shen et al. Experimental study on operating temperature in laser-assisted milling of silicon nitride ceramics
Tsai et al. The laser shaping of ceramic by a fracture machining technique
Tsai et al. Machining a smooth surface of ceramic material by laser fracture machining technique
Yan et al. CO2 laser high-speed crack-free cutting of thick-section alumina based on close-piercing lapping technique
Yamamoto et al. Thermal stress analysis on laser scribing of glass
Yan et al. CO2 laser peeling of Al2O3 ceramic and an application for the polishing of laser cut surfaces
Murray et al. Nd: YAG laser cutting and drilling of PSTZ—Influence of substrate heating temperature on recast layer microcracking
Brugan et al. Controlled-fracture of prescored alumina ceramics using simultaneous CO 2 lasers
Yu et al. Surface integrity analysis of Si3N4 under cryogenic assisted femtosecond laser ablation
Melaibari et al. Two-dimensional contour cutting of polycrystalline cubic boron nitride using a novel laser/water jet hybrid process
Kalyan-Sundaram et al. CO2 laser/waterjet cutting of polycrystalline cubic boron nitride
CN117564500A (en) A laser cutting method to improve the quality of aluminum nitride cutting surfaces