Bhuiyan et al., 2019 - Google Patents
A hybrid process for printing pure and high conductivity nanocrystalline copper and nickel on flexible polymeric substratesBhuiyan et al., 2019
View HTML- Document ID
- 5288379590398492226
- Author
- Bhuiyan M
- Behroozfar A
- Daryadel S
- Moreno S
- Morsali S
- Minary-Jolandan M
- Publication year
- Publication venue
- Scientific reports
External Links
Snippet
Printing functional devices on flexible substrates requires printing of high conductivity metallic patterns. To prevent deformation and damage of the polymeric substrate, the processing (printing) and post-processing (annealing) temperature of the metal patterns …
- 239000000758 substrate 0 title abstract description 70
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the metallic pattern or other conductive pattern
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