Tribula et al., 1989 - Google Patents
Observations on the mechanisms of fatigue in eutectic Pb-Sn solder jointsTribula et al., 1989
View PDF- Document ID
- 5073351158312641204
- Author
- Tribula D
- Grivas D
- Frear D
- Morris Jr J
- Publication year
External Links
Snippet
Near-eutectic Pb-Sn solders are widely used for joints in electrical devices. These are liable to failure by thermal fatigue during operation of the device. Since the thermal fatigue load is often in shear, mechanisms of thermal fatigue in shear are of particular interest. Recent …
- 229910000679 solder 0 title abstract description 79
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/006—Crack, flaws, fracture or rupture
- G01N2203/0062—Crack or flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
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