[go: up one dir, main page]

Wang et al., 2019 - Google Patents

Comparison of lapping performance between fixed agglomerated diamond pad and fixed single crystal diamond pad

Wang et al., 2019

Document ID
491947868527108661
Author
Wang Z
Niu F
Zhu Y
Li J
Wang J
Publication year
Publication venue
Wear

External Links

Snippet

The ability for self-conditioning is the most important characteristic of hydrophilic Fixed Abrasive (FA) pads using in lapping. The failure mode of diamond abrasives embedded in a FA pad greatly impacts its self-conditioning process. In this investigation, three types of FA …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12Dressing tools; Holders therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; MISCELLANEOUS COMPOSITIONS; MISCELLANEOUS APPLICATIONS OF MATERIALS
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; MISCELLANEOUS COMPOSITIONS; MISCELLANEOUS APPLICATIONS OF MATERIALS
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1409Abrasive particles per se

Similar Documents

Publication Publication Date Title
Wang et al. Comparison of lapping performance between fixed agglomerated diamond pad and fixed single crystal diamond pad
KR101503545B1 (en) Synthetic grindstone
Liu et al. Grinding wheels for manufacturing of silicon wafers: a literature review
Wang et al. Friction and wear characteristics of agglomerated diamond abrasives and lapping performance of fixed agglomerated diamond pads
Chen et al. Relationship between mechanical properties and processing performance of agglomerated diamond abrasive compared with single diamond abrasive
Zhang et al. Study on tool wear characteristics in diamond turning of reaction-bonded silicon carbide
Chen et al. Influence of agglomerated diamond abrasive wear on sapphire material removal behavior
WO2019146336A1 (en) Seed crystal for 4h-sic single-crystal growth, and method for processing said seed crystal
CN101249625A (en) Laser Glass Mechanochemical Polishing Method
Pei et al. Finite element analysis for grinding of wire-sawn silicon wafers: a designed experiment
Zhang et al. Surface damage mechanism of WC/Co and RB-SiC/Si composites under high spindle speed grinding (HSSG)
Zhang et al. A systematic investigation on the diamond wear mechanism during the dry scratching of WC/Co
Kang et al. A comparative study of conventional and high speed grinding characteristics of a thin film multilayer structure
Xiong et al. Processing performance of vitrified bonded fixed-abrasive lapping plates for sapphire wafers
CN102407483A (en) A kind of high-efficiency nano-precision thinning method of semiconductor wafer
Wu et al. Diamond parameter design and assessment of a novel 3D printed diamond grinding wheel with linear cooling channels
Wang et al. Preparation of nanotwinned cBN cutting edge by combining mechanical lapping and ion beam polishing
Mao et al. Wear behaviors of electroplated CBN grinding wheel with orderly-micro-grooves in grinding narrow-deep slot
Marinescu et al. Basic research for the UV fixed abrasive lapping plate
Chen et al. In-situ reconditioning mechanism for fixed abrasive pads based on the wear behavior of loose grains
Barylski et al. Finishing of ceramics in a single-disk lapping machine configuration
Gao et al. Ultra-low damage processing of silicon wafer with an innovative and optimized nonwoven grind-polishing wheel
Lu et al. Development of a novel polishing pad with a phyllotactic pattern, and experimental studies
Barylski et al. Microgrinding of flat surfaces on single-disc lapping machine
Shih et al. Analysis of fixed abrasive pads with a nano-sized diamond for silicon wafer polishing