Su et al., 1995 - Google Patents
Transient power supply current monitoring—A new test method for CMOS VLSI circuitsSu et al., 1995
View PDF- Document ID
- 4134549597995737318
- Author
- Su S
- Makki R
- Nagle T
- Publication year
- Publication venue
- Journal of Electronic Testing
External Links
Snippet
We present a new method for testing digital CMOS integrated circuits. The new method is based on the following premise: monitor the switching behavior of a circuit as opposed to the output logic state. We use the transient power supply current as a window of observability …
- 230000001052 transient 0 title abstract description 24
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequence
- G01R31/318342—Generation of test inputs, e.g. test vectors, patterns or sequence by preliminary fault modelling, e.g. analysis, simulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/30—Marginal testing, e.g. varying supply voltage
- G01R31/3004—Current or voltage test
- G01R31/3008—Quiescent current [IDDQ] test or leakage current test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31712—Input or output aspects
- G01R31/31717—Interconnect testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/305—Contactless testing using electron beams
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/50—Computer-aided design
- G06F17/5009—Computer-aided design using simulation
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
- G11C2029/5006—Current
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F2217/00—Indexing scheme relating to computer aided design [CAD]
- G06F2217/70—Fault tolerant, i.e. transient fault suppression
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Su et al. | Transient power supply current monitoring—A new test method for CMOS VLSI circuits | |
| Jha et al. | Testing of digital systems | |
| Soden et al. | I DDQ testing: a review | |
| Jee et al. | Carafe: An inductive fault analysis tool for CMOS VLSI circuits | |
| Makki et al. | Transient power supply current testing of digital CMOS circuits | |
| Gulati et al. | IDDQ testing of VLSI circuits | |
| Hapke et al. | Defect-oriented cell-internal testing | |
| Li et al. | Diagnosis of resistive-open and stuck-open defects in digital CMOS ICs | |
| Reddy et al. | On testing of interconnect open defects in combinational logic circuits with stems of large fanout | |
| US7219287B1 (en) | Automated fault diagnosis in a programmable device | |
| Chen et al. | A unified fault model and test generation procedure for interconnect opens and bridges | |
| Mao et al. | QUIETEST: a methodology for selecting I DDQ test vectors | |
| Bula et al. | Gross delay defect evaluation for a CMOS logic design system product | |
| Renovell et al. | Detection of defects using fault model oriented test sequences | |
| Rudnick et al. | Methods for Reducing Events in Sequential Circuit Fault Simulation. | |
| Maly et al. | Process monitoring oriented IC testing | |
| Mahlstedt et al. | CURRENT: a test generation system for I/sub DDQ/testing | |
| Seth et al. | Gutting chip-testing costs: Designing VLSI circuits for testability is the most efficient way to reduce the relative costs of assuring high chip reliability | |
| Zhang et al. | Three-stage optimization of pre-bond diagnosis of TSV defects | |
| Wu et al. | A Repair-for-Diagnosis Methodology for Logic Circuits | |
| Alorda et al. | Charge based transient current testing (CBT) for submicron CMOS SRAMs | |
| Cibakova et al. | Hierarchical test generation for combinational circuits with real defects coverage | |
| Hora et al. | On a statistical fault diagnosis approach enabling fast yield ramp-up | |
| Narayanan et al. | A Fault Diagnosis Methodology for the UltraSPARC/sup TM/-I microprocessor | |
| Debany et al. | A method for consistent fault coverage reporting |