[go: up one dir, main page]

Chen et al., 2019 - Google Patents

Determination of stability constants of copper (II)–lactate complexes in Cu2O electrodeposition baths by UV-vis absorption spectra factor analysis

Chen et al., 2019

View PDF
Document ID
411837206443866234
Author
Chen T
Kitada A
Fukami K
Murase K
Publication year
Publication venue
Journal of The Electrochemical Society

External Links

Snippet

The stability constants of highly concentrated copper (II)–lactate alkaline aqueous solutions for Cu 2 O electrodeposition were determined by factor analysis of UV-vis absorption spectra. The stability constant is 10 7.05±0.05 for the chemical equilibrium expression CuL …
Continue reading at iopscience.iop.org (PDF) (other versions)

Similar Documents

Publication Publication Date Title
Chen et al. Determination of stability constants of copper (II)–lactate complexes in Cu2O electrodeposition baths by UV-vis absorption spectra factor analysis
Rode et al. Complexation chemistry in copper plating from citrate baths
Schultz et al. Vibrational spectroscopic and mass spectrometric studies of the interaction of bis (3-sulfopropyl)-disulfide with Cu surfaces
Elsen et al. Effects of electrodeposition conditions and protocol on the properties of iridium oxide pH sensor electrodes
Raja et al. CO2 photoreduction in the liquid phase over Pd-supported on TiO2 nanotube and bismuth titanate photocatalysts
Lin et al. Electrodeposition of zinc telluride from a zinc chloride-1-ethyl-3-methylimidazolium chloride molten salt
Chen et al. Identification of copper (II)–lactate complexes in Cu2O electrodeposition baths: deprotonation of the α-hydroxyl group in highly concentrated alkaline solution
Sowers et al. Crystal face dependence of p-Cu2O stability as photocathode
Khedekar et al. Simple electrochemical synthesis of cuprous oxide nanoparticles and their application as a non-enzymatic glucose sensor
Tolosa et al. Electrochemical deposition mechanism for ZnO nanorods: diffusion coefficient and growth models
Chiu et al. Sensitivity enhancement for quantitative electrochemical determination of a trace amount of accelerator in copper plating solutions
Lee et al. Preparation of Au-Bi2O3 nanocomposite by anodic electrodeposition combined with galvanic replacement
Pary et al. Electrochemical reduction of copper complexes with glycine, alanine and valine
Nie et al. The effect of ammonia on the anodic process of gold in copper-free thiosulfate solution
Inguanta et al. Photoelectrochemical characterization of Cu2O-nanowire arrays electrodeposited into anodic alumina membranes
Grabarczyk et al. Ultratrace determination of indium in natural water by adsorptive stripping voltammetry in the presence of cupferron as a complexing agent
Hope et al. Transient adsorption of sulfate ions during copper electrodeposition
Koga et al. Electrochemical Formation and Accumulation of Cu (I) in Copper Sulfate Electroplating Solution
Jin et al. Electrochemistry and coordination behaviors of hypoxanthine-Au (III) ion in the cyanide-free gold electrodeposition
Melamed et al. Electroplating of pure aluminum from [hmim][TFSI]–AlCl3 room-temperature ionic liquid
Myung et al. Facile synthesis of Pt-CuO nanocomposite films for non-enzymatic glucose sensor application
Giner-Sanz et al. Alkali metal salt interference on the salicylate method for quantifying ammonia from nitrogen reduction
Fierro et al. Investigation of formic acid oxidation on Ti∕ IrO2 electrodes using isotope labeling and online mass spectrometry
Alwis et al. Anodically polarized nickel electrodes in DMSO or DMF solutions of pseudohalide ions: IR spectroelectrochemical studies
Bae et al. Oxidation state shift of uranium during U (III) synthesis with Cd (II) and Bi (III) in LiCl–KCl melt