[go: up one dir, main page]

Flanagan et al., 1996 - Google Patents

Laser soldering and inspection of fine pitch electronic components

Flanagan et al., 1996

Document ID
4081724890255183190
Author
Flanagan A
Conneely A
Glynn T
Lowe G
Publication year
Publication venue
Journal of materials processing technology

External Links

Snippet

The increasing miniaturisation of integrated circuits has resulted in devices with lead spacings as small as 0.008 ″. Laser soldering has the potential to overcome many of the problems encountered with these devices by conventional soldering technologies. Nd: YAG …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2201/00—Articles made by soldering, welding or cutting by applying heat locally
    • B23K2201/36—Electric or electronic devices
    • B23K2201/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Similar Documents

Publication Publication Date Title
US4657169A (en) Non-contact detection of liquefaction in meltable materials
US4696104A (en) Method and apparatus for placing and electrically connecting components on a printed circuit board
CA2648768C (en) Thermoconductimetric analyzer for soldering process improvement
Flanagan et al. Laser soldering and inspection of fine pitch electronic components
JP3622714B2 (en) Processing method
CN1729076A (en) A method and a device for laser spot welding
KR20100021969A (en) Laser cleaning apparatus and laser cleaning method
EP0209650A2 (en) Method and apparatus for placing and electrically connecting components on a printed circuit board
PL171130B1 (en) Industrial process control laser device PL PL PL PL
Beckett et al. The application of semiconductor diode lasers to the soldering of electronic components
Nazarudin et al. Effect of different beam distances in laser soldering process: a numerical and experimental study
Bosse et al. High quality laser beam soldering
Ostendorf et al. Laser spot welding of electronic micro parts
Beckett et al. Numerical modelling of scanned beam laser soldering of fine pitch packages
Ermer et al. Qualification of a system technology for selective laser-based quasi-simultaneous soldering with an integrated pyrometric process control
Spletter et al. A laser based system for tape automated bonding to integrated circuits
JP2005085708A (en) Local heating apparatus method
Glynn et al. Reflow Soldering of Fine-pitch devices using a Nd: Yag laser
Glynn et al. Laser soldering of surface mount components and memory chips
Conneely et al. Development of a soldering/inspection workcell for surface mount devices
Toenshoff et al. Laser microwelding of electronic components
KR100299186B1 (en) Joining portion monitoring method and apparatus ina laser soldering
Ostendorf et al. 3D-MID and process monitoring for microjoining applications
Hurtony et al. Metallographic analysis of laser soldered chip resistors
Naveed et al. Diode laser soldering: a lumped parameter mathematical model and comparison of different optical soldering technologies