Peng et al., 2021 - Google Patents
Automated box data matching for multi-modal magnetic flux leakage inspection of pipelinesPeng et al., 2021
- Document ID
- 3777723593357069470
- Author
- Peng X
- Liu H
- Siggers K
- Liu Z
- Publication year
- Publication venue
- IEEE Transactions on Magnetics
External Links
Snippet
Magnetic flux leakage (MFL) is one of the most popular in-line inspection techniques to detect pipeline corrosion defects. However, the measurement limitation and random error associated with the individual MFL could introduce observable variations to the inspection …
- 238000007689 inspection 0 title abstract description 27
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/90—Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
- G01N27/9046—Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents by analysing electrical signals
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- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00, e.g. X-rays or neutrons
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00, e.g. X-rays or neutrons by transmitting the radiation through the material
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- G—PHYSICS
- G06—COMPUTING; CALCULATING; COUNTING
- G06F—ELECTRICAL DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
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