[go: up one dir, main page]

Mohan et al., 2023 - Google Patents

Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air

Mohan et al., 2023

Document ID
376921593947962355
Author
Mohan N
Ahuir-Torres J
Bhogaraju S
Kotadia H
Elger G
Publication year
Publication venue
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

External Links

Snippet

Cu complex inks offer a facile and cost-effective alternative to commercial nanoparticle inks for printed electronics application. Cu complex inks are prepared by mixing Cu formate tetrahydrate (metal precursor) with amino-2-propanol (complexing agent) in a molar ratio of …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the metallic pattern or other conductive pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles, i.e. inks which are sinterable at low temperatures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
    • B22F1/00—Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
    • B22F1/0003—Metallic powders per se; Mixtures of metallic powders; Metallic powders mixed with a lubricating or binding agent
    • B22F1/0007—Metallic powder characterised by its shape or structure, e.g. fibre structure
    • B22F1/0011—Metallic powder characterised by size or surface area only
    • B22F1/0018—Nanometer sized particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating

Similar Documents

Publication Publication Date Title
Yang et al. Metal particle-free inks for printed flexible electronics
Saidina et al. Recent development of graphene-based ink and other conductive material-based inks for flexible electronics
US11390768B2 (en) Silver-organo-complex ink with high conductivity and inkjet stability
Choi et al. Metal− organic decomposition ink for printed electronics
Jeong et al. Controlling the thickness of the surface oxide layer on Cu nanoparticles for the fabrication of conductive structures by ink‐jet printing
JP6433361B2 (en) Stretchable conductive film based on silver nanoparticles
Zeng et al. Copper inks for printed electronics: a review
JP5735788B2 (en) Ultra-low melting metal nanoparticle composition for pressure film
JP5514485B2 (en) Method for producing silver nanoparticles
Lai et al. Synthesis and characterization of silver nanoparticles and silver inks: review on the past and recent technology roadmaps
JP6083623B2 (en) Silver nanoparticles and silver nanoparticle ink
JP2009144241A (en) Metal nanoparticle stabilized with carboxylic acid-organoamine complex
US20090242854A1 (en) Additives and modifiers for solvent- and water-based metallic conductive inks
US20090214764A1 (en) Metal nanoparticles stabilized with a bident amine
CA2712306C (en) New process to form highly conductive feature from silver nanoparticles with reduced processing temperature
JP2005507452A5 (en)
JP2009275227A (en) Printable composition containing silver nanoparticle, method for producing electrically conductive coating using the composition, and coating produced by the method
JP2015008136A (en) Method of forming metal nanoparticle dispersion and dispersion formed thereby
JP2005507452A (en) Inkjet ink containing metal nanoparticles
Deore et al. Formulation of screen-printable Cu molecular ink for conductive/flexible/solderable Cu traces
Huang et al. Synthesis of colourless silver precursor ink for printing conductive patterns on silicon nitride substrates
CN101993634A (en) Conductive ink, preparation method of metal micropattern using the same and printed circuit board prepared by the method
Mohan et al. Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air
Rahman et al. Realization of thick copper conductive patterns using highly viscous copper oxide (CuO) nanoparticle ink and green laser sintering
Htwe et al. Review on solvent-and surfactant-assisted water-based conductive inks for printed flexible electronics applications