[go: up one dir, main page]

Merkle et al., 2012 - Google Patents

Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds

Merkle et al., 2012

View PDF
Document ID
3142288726385206010
Author
Merkle L
Sonner M
Petzold M
Publication year
Publication venue
Soldering & surface mount technology

External Links

Snippet

Purpose–The purpose of this paper is to establish a law on the durability of thick aluminium wire bonds in low cycle fatigue for different geometries and wire diameters under a purely mechanical load. Design/methodology/approach–Bond wires with different geometries were …
Continue reading at publica.fraunhofer.de (PDF) (other versions)

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/022—Environment of the test
    • G01N2203/0222—Temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0286—Miniature specimen; Testing on micro-regions of a specimen
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/0202—Control of the test
    • G01N2203/0212—Theories, calculations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/0069—Fatigue, creep, strain-stress relations or elastic constants
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0016—Tensile or compressive
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/006—Crack, flaws, fracture or rupture
    • G01N2203/0062—Crack or flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/025—Geometry of the test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/06—Indicating or recording means; Sensing means
    • G01N2203/0617—Electrical or magnetic indicating, recording or sensing means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/20—Investigating strength properties of solid materials by application of mechanical stress by applying steady bending forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/40—Investigating hardness or rebound hardness
    • G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/003—Generation of the force
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G01N3/04—Chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/32—Investigating strength properties of solid materials by application of mechanical stress by applying repeated or pulsating forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

Similar Documents

Publication Publication Date Title
Schaal et al. Silver sintering in power electronics: the state of the art in material characterization and reliability testing
Dai et al. Adhesion measurement for electronic packaging applications using double cantilever beam method
Merkle et al. Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds
Heilmann et al. Physics of failure based lifetime modelling for sintered silver die attach in power electronics: Accelerated stress testing by isothermal bending and thermal shock in comparison
Merkle et al. Mechanical fatigue properties of heavy aluminium wire bonds for power applications
Faisal et al. Diametral compression test method to analyse relative surface stresses in thermally sprayed coated and uncoated circular disc specimens
Dudek et al. Reliability modelling for different wire bonding technologies based on FEA and nano-indentation
Forndran et al. A parametric simulative study for lifetime prediction of sintered silver die attach under different accelerated testing conditions
Xie et al. Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: Experimental characterization
Scott-Emuakpor et al. As-built geometry and surface finish effects on fatigue and tensile properties of laser fused titanium 6Al-4V
Poshtan et al. An in-situ numerical–experimental approach for fatigue delamination characterization in microelectronic packages
Khatibi et al. Fatigue life time modelling of Cu and Au fine wires
Lee et al. Realistic creep characterization for Sn3. 0Ag0. 5Cu solder joints in flip chip BGA package
Drossel et al. Evaluation of actuator, sensor, and fatigue performance of piezo-metal-composites
Kolluri et al. In-situ characterization of interface delamination by a new miniature mixed mode bending setup
Albrecht et al. Method for assessing the delamination risk in BEoL stacks around copper TSV applying nanoindentation and finite element simulation
Khatibi et al. Characterization of stress–strain response of lead-free solder joints using a digital image correlation technique and finite-element modeling
Czerny et al. Interface characterization of CuCu ball bonds by a fast shear fatigue method
Khatibi et al. A fast mechanical test technique for life time estimation of micro-joints
Naumann et al. Reliability characterization of heavy wire bonding materials
Shaygi et al. Button Shear Fatigue Test: Fracture-Mechanical Interface Characterisation under Periodic Subcritical Mechanical Loading
Heilmann et al. Accelerated reliability testing and modeling of subsystems based on sintered silver thermal interface materials
Shi et al. Determination of fracture toughness of underfill/chip interface with digital image speckle correlation technique
Pin et al. Numerical study of thermomechanical fatigue influence of intermetallic compounds in a lead free solder joint
Elmisteri et al. Mechanical properties evaluation for engineering materials utilizing instrumented indentation: Finite element modelling approach