[go: up one dir, main page]

Senturia et al., 1982 - Google Patents

In-situ measurement of the properties of curing systems with microdielectrometry

Senturia et al., 1982

View PDF
Document ID
2616634753535513803
Author
Senturia S
Sheppard Jr N
Lee H
Day D
Publication year
Publication venue
The Journal of Adhesion

External Links

Snippet

This paper addresses the in-situ measurement of various properties of curing systems with a particular dielectric method called Microdielectrometry. We have used integrated circuit technology to develop a miniaturized dielectric probe that combines small size with built-in …
Continue reading at apps.dtic.mil (PDF) (other versions)

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating the impedance of the material
    • G01N27/22—Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating the impedance of the material by investigating capacitance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating the impedance of the material
    • G01N27/04—Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating the impedance of the material by investigating resistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/005—Investigating or analyzing materials by the use of thermal means by investigating specific heat
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Similar Documents

Publication Publication Date Title
Senturia et al. In-situ measurement of the properties of curing systems with microdielectrometry
Day et al. The role of boundary layer capacitance at blocking electrodes in the interpretation of dielectric cure data in adhesives
Senturia et al. Dielectric analysis of thermoset cure
Sheppard et al. Microdielectrometry
Kranbuehl et al. Dynamic dielectric analysis: Nondestructive material evaluation and cure cycle monitoring
US4723908A (en) Dielectric probe; method and apparatus including its use
He DSC and DEA studies of underfill curing kinetics
Lane et al. Dielectric studies of the cure of epoxy matrix systems
Bayer et al. Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation
Koike et al. Dielectric properties above the glass transition for a series of epoxide prepolymers
Han et al. AC impedance function of electrochemical working station as novel curing degree monitor method: A model curing system of epoxy/anhydride/DMP-30
Gotro et al. Simultaneous dielectric and dynamic mechanical analysis of thermosetting polymers
Day et al. A microdielectric analysis of moisture diffusion in thin epoxy/amine films of varying cure state and mix ratio
Sanjana The use of microdielectrometry in monitoring the cure of resins and composites
Twombly et al. Simultaneous dynamic mechanical analysis and dielectric analysis of polymers (DMA-DEA)
EP0516367A2 (en) Method and apparatus for simultaneous differential scanning calorimetry and microdielectrometry
Takahashi AC impedance measurements of moisture in interfaces between epoxy and oxidized silicon
Park Dielectric cure determination of a thermosetting epoxy composite prepreg
Koike Dielectric relaxation during isothermal curing of epoxy resin with an aromatic amine
Friedrich et al. Time-of-flight ion mobility measurements in epoxy-amine systems during curing
Koike Viscoelastic behavior of epoxy resins before crosslinking
Pathmanathan et al. Dielectric studies of the effects of thermal history on secondary relaxation in bisphenol‐a‐polycarbonate
Sanjana et al. Monitoring Cure of Epoxy Resins Using a Microdielectrometer.
Omrani et al. The relationship between composition and electrical properties of brass covered by a nanocomposite coating of glycerol diglycidyl ether: An EIS and DMTA study
Liu et al. Development of epoxy-based electrets