Ni et al., 2018 - Google Patents
Miller plateau as an indicator of SiC MOSFET gate oxide degradationNi et al., 2018
- Document ID
- 1876382436363280415
- Author
- Ni Z
- Li Y
- Lyu X
- Yadav O
- Cao D
- Publication year
- Publication venue
- 2018 IEEE Applied Power Electronics Conference and Exposition (APEC)
External Links
Snippet
This paper presents a new indicator of SiC MOSFET gate oxide degradation based on Miller plateau. The physical mechanism of Miller plateau shift with gate oxide electric field is first analyzed. The relationship between Miller plateau and ambient temperature is then …
- 229910003465 moissanite 0 title abstract description 57
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2621—Circuits therefor for testing field effect transistors, i.e. FET's
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
-
- H—ELECTRICITY
- H03—BASIC ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making or -braking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making or -braking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making or -braking characterised by the components used using semiconductor devices
- H03K17/687—Electronic switching or gating, i.e. not by contact-making or -braking characterised by the components used using semiconductor devices using field-effect transistors
- H03K17/693—Switching arrangements with several input- or output-terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
- G01R31/1263—Testing dielectric strength or breakdown voltage; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/27—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements
-
- H—ELECTRICITY
- H03—BASIC ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making or -braking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output circuit to the control circuit
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/02—Testing of electric apparatus, lines or components, for short-circuits, discontinuities, leakage of current, or incorrect line connection
- G01R31/024—Arrangements for indicating continuity or short-circuits in electric apparatus or lines, leakage or ground faults
-
- H—ELECTRICITY
- H03—BASIC ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making or -braking
- H03K17/18—Modifications for indicating state of switch
-
- H—ELECTRICITY
- H03—BASIC ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making or -braking
- H03K17/16—Modifications for eliminating interference voltages or currents
- H03K17/168—Modifications for eliminating interference voltages or currents in composite switches
-
- H—ELECTRICITY
- H03—BASIC ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/0036—Means reducing energy consumption
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Ni et al. | Miller plateau as an indicator of SiC MOSFET gate oxide degradation | |
Farhadi et al. | Temperature-independent gate-oxide degradation monitoring of SiC MOSFETs based on junction capacitances | |
Yang et al. | Experimental evaluation and analysis of switching transient's effect on dynamic on-resistance in GaN HEMTs | |
Wei et al. | Comprehensive investigations on degradations of dynamic characteristics for SiC power MOSFET s under repetitive avalanche shocks | |
Erturk et al. | A method for online ageing detection in SiC MOSFETs | |
Ni et al. | Investigation of dynamic temperature-sensitive electrical parameters for medium-voltage SiC and Si devices | |
Ionita et al. | Short-circuit ruggedness assessment of a 1.2 kV/180 A SiC MOSFET power module | |
Ganesan et al. | Characterisation of 1200V, 35A SiC Mosfet using double pulse circuit | |
Gonzalez et al. | Bias temperature instability and condition monitoring in SiC power MOSFETs | |
Weckbrodt et al. | Monitoring of gate leakage current on SiC power MOSFETs: An estimation method for smart gate drivers | |
Kang et al. | Investigation of off-state stress induced degradation of SiC MOSFETs under short-circuit condition | |
Zu et al. | Review of pulse test setup for the switching characterization of GaN power devices | |
Carrasco et al. | Energy analysis and performance evaluation of GaN cascode switches in an inverter leg configuration | |
Zhou et al. | Dead time optimization for synchronous switching of SiC MOSFETs considering nonlinear gate capacitance | |
Kanale et al. | Enhancing short circuit capability of 1.2 kV SiC power MOSFETs using a gate-source shorted Si depletion-mode MOSFET in series with the source | |
Unger et al. | Influence of the off-state gate-source voltage on the transient drain current response of SiC MOSFETs | |
Kozak et al. | Robustness of GaN gate injection transistors under repetitive surge energy and overvoltage | |
Aeloiza et al. | An experimental demonstration of short circuit protection of SiC Devices | |
Ni et al. | Investigation of dynamic temperature-sensitive electrical parameters for medium-voltage low-current silicon carbide and silicon devices | |
Kanale et al. | Enhancing short circuit capability of 1.2-kV Si IGBT using a gate-source shorted Si depletion mode MOSFET in series with the emitter | |
Kakarla | Short Circuit Behavior of SiC MOSFETs | |
Liang et al. | Observations on Ruggedness Degradation of Planar-gate SiC MOSFETs after Total Ionizing Dose Radiation | |
Mulpuri et al. | Reliability of SiC power MOSFETs under high repetitive pulse current conditions | |
Sun et al. | Repetitive Short Circuit Energy Dependent $ V_ {\text {TH}} $ Instability of 1.2 kV SiC Power MOSFETs | |
Song et al. | GaN MIS-HEMTs in repetitive overvoltage switching: Parametric shift and recovery |