Ein-Eli et al., 2004 - Google Patents
Electrochemical aspects of copper chemical mechanical planarization (CMP) in peroxide based slurries containing BTA and glycineEin-Eli et al., 2004
View PDF- Document ID
- 1775549160072230640
- Author
- Ein-Eli Y
- Abelev E
- Starosvetsky D
- Publication year
- Publication venue
- Electrochimica Acta
External Links
Snippet
The electrochemical behavior of copper was studied in Na2SO4 solutions (pH 4), containing peroxide, benzotriasol (BTA) and glycine. The effect of BTA was initially evaluated in sulfate solution without peroxide and it was established that once BTA is present, copper …
- 239000010949 copper 0 title abstract description 76
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F13/00—Inhibiting corrosion of metals by anodic or cathodic protection
- C23F13/02—Inhibiting corrosion of metals by anodic or cathodic protection cathodic; Selection of conditions, parameters or procedures for cathodic protection, e.g. of electrical conditions
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