Ramadas et al., 1993 - Google Patents
Liquid‐metal micro heat pipes incorporated in waste‐heat radiator panelsRamadas et al., 1993
View PDF- Document ID
- 1747095552123047023
- Author
- Ramadas P
- Henderson H
- Badran B
- Gerner F
- Publication year
- Publication venue
- AIP Conference Proceedings
External Links
Snippet
The purpose of this paper is to describe a developing and potentially revolutionary technology for micromachining arrays of micro heat pipes in single crystalline semiconductor silicon in order to fabricate light weight waste‐heat radiator panels. This approach results in …
- 229910001338 liquidmetal 0 title abstract description 23
Classifications
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L35/00—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L35/28—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof operating with Peltier or Seebeck effect only
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