Meyer, 1969 - Google Patents
Characteristics of ion-implanted contacts for nuclear particle detectors: I. Window thickness of ion-implanted semiconductor detectorsMeyer, 1969
- Document ID
- 17240593268167941033
- Author
- Meyer O
- Publication year
- Publication venue
- Nuclear Instruments and Methods
External Links
Snippet
The thickness of the entrance window of ion-implanted semiconductor counters was experimentally studied by pulse height defect measurements. It was found that the window thickness D strongly depends on the reverse voltage U A. This dependence may be …
- 239000004065 semiconductor 0 title abstract description 4
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L31/00—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
- H01L31/115—Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
- H01L21/0405—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising semiconducting carbon, e.g. diamond, diamond-like carbon
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/479—Application of electric currents or fields, e.g. for electroforming
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device; Multistep manufacturing processes therefor
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Pearton et al. | Formation of thermally stable high‐resistivity AlGaAs by oxygen implantation | |
US3225198A (en) | Method of measuring nuclear radiation utilizing a semiconductor crystal having a lithium compensated intrinsic region | |
Gibson et al. | Electrical and physical measurements on silicon implanted with channelled and nonchanneled dopant ions | |
Bodunrin et al. | Current-voltage characteristics of 4 MeV proton-irradiated silicon diodes at room temperature | |
Maisch et al. | Ion-implanted Si pn-junction detectors with ultrathin windows | |
Meyer | Characteristics of ion-implanted contacts for nuclear particle detectors: I. Window thickness of ion-implanted semiconductor detectors | |
Llacer et al. | Neutron damage and annealing in high purity germanium radiation detectors | |
Gettings et al. | Electrical activity and radiation damage in ion implanted cadmium telluride | |
RU2086043C1 (en) | Power semiconductor resistor and method for its manufacturing | |
Palmetshofer et al. | Ion‐implantation‐induced lattice defects in PbTe | |
Possin et al. | Electron‐beam measurements of minority‐carrier lifetime distributions in ion‐beam‐damaged silicon | |
Bader et al. | CARRIER CONCENTRATION PROFILES OF ION‐IMPLANTED SILICON | |
Olschner et al. | Indium phosphide particle detectors | |
Martin | Integrated E and dE/dχ semiconductor particle detectors made by ion implantation | |
Sarrabayrouse et al. | Electrical properties of MOS radiation dosimeters | |
La Ferla et al. | Implants of 15–50 MeV Boron ions into silicon | |
US3620851A (en) | Method for making a buried layer semiconductor device | |
US3599059A (en) | Ion implanted cadmium sulfide pn junction device | |
Khivrich et al. | High purity silicon as a basic material for manufacturing of radiation detectors and integral neutron radiation dosimeters | |
US3609478A (en) | Buried-layer semiconductor device for detecting and measuring the energy and atomic number of impinging atomic particles | |
Anderson et al. | Shallow Hole Levels in Ion‐Implanted CdS | |
Harper et al. | Effects of irradiation on the electrical and optical properties of PbSnTe | |
Large | Ion implantation: A new method of doping semiconductors—II | |
Ponpon et al. | Boron Implanted Contacts on High Purity Germanium | |
Brotherton et al. | Deep Level Generation Centres In Low Temperature Annealed Pre-Amorphised Silicon |