[go: up one dir, main page]

Zhu et al., 2021 - Google Patents

A novel vertical wire-bonding compensation structure adaptively modeled and optimized with GRNN and GA methods for system in package

Zhu et al., 2021

Document ID
16822805949910830713
Author
Zhu H
Zhao Y
Lu J
Publication year
Publication venue
IEEE Transactions on Electromagnetic Compatibility

External Links

Snippet

In this article, a novelvertical wire-bonding interconnect structure is intelligently modeled and optimized with general artificial neural network (GRNN) and genetic algorithm (GA) for multilayered system in package. A compensation structure is constructed with a hybrid …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30107Inductance
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6661High-frequency adaptations for passive devices
    • H01L2223/6677High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Similar Documents

Publication Publication Date Title
Zhu et al. A novel vertical wire-bonding compensation structure adaptively modeled and optimized with GRNN and GA methods for system in package
Xiao et al. Multiparameter modeling with ANN for antenna design
Wu et al. Machine-learning-assisted optimization and its application to antenna designs: Opportunities and challenges
Xu et al. Finite-difference frequency-domain algorithm for modeling guided-wave properties of substrate integrated waveguide
Yang et al. A high-frequency and high spatial resolution probe design for EMI prediction
Kim et al. Application of artificial neural networks to broadband antenna design based on a parametric frequency model
EP3217336A1 (en) Impedance-matched microwave quantum circuit systems
Choo et al. Design of electrically small wire antennas using a pareto genetic algorithm
Ghaneizadeh et al. Analysis, design, and implementation of a new extremely ultrathin 2-D-isotropic flexible energy harvester using symmetric patch FSS
Yang et al. Conformal magnetic composite RFID for wearable RF and bio-monitoring applications
Kovaleva et al. Cross-entropy method for electromagnetic optimization with constraints and mixed variables
Zhu et al. Fractal localized EBG structure intelligently optimized by K-GRNN and GA method for signal and power integrity
Schierholz et al. Parametric S-parameters for PCB based power delivery network design using machine learning
CN113036377B (en) Gold wire interconnection vertical compensation structure in radio frequency micro system and design method thereof
Huang et al. Radiation emission source localization by magnetic near-field mapping along the surface of a large-scale IC with BGA package
Zhang et al. Inverse design of bonding wire array based on multifidelity data-enabled neural networks
Vidal et al. 3D-printed UHF-RFID tag for embedded applications
Varma et al. Modeling of a compact triple band PIFA using knowledge based neural network
Ndip et al. On the radiation characteristics of full-loop, half-loop, and quasi-half-loop bond wire antennas
Namaki et al. An Extended L–2L De-Embedding Method for Modeling and Low Return-Loss Transition of Millimeter Wave Signal Through Silicon Interposer
Li et al. Printed dipole antenna design using artificial neural network modeling for RFID application
Cao et al. Modeling and synthesis of on-chip multi-layer spiral inductor for millimeter-wave regime based on ANN method
Aoad et al. Development of knowledge based response correction for a reconfigurable N-shaped microstrip antenna design
Dubrovka et al. Synthesis of UWB planar antennas by means of natural optimization algorithms
Gay-Balmaz et al. Analysis of multilayer printed arrays by a modular approach based on the generalized scattering matrix