[go: up one dir, main page]

Stoukatch et al., 2022 - Google Patents

Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors

Stoukatch et al., 2022

View PDF
Document ID
16030197400679152703
Author
Stoukatch S
Fagnard J
Dupont F
Laurent P
Debliquy M
Redouté J
Publication year
Publication venue
IEEE Access

External Links

Snippet

Metal-oxide (MOX) gas sensors commonly rely on custom packaging solution. With an ever- increasing demand for MOX gas sensors, there is a clear need for a low cost, compact and high-performance package. During normal operation, MOX sensors are heated up to a …
Continue reading at ieeexplore.ieee.org (PDF) (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means

Similar Documents

Publication Publication Date Title
US7965094B2 (en) Packaged die heater
EP1840981A2 (en) Thermoelectric module
CN107615029B (en) Method for producing heat flux sensor and heat flow generating device used for the method
Stoukatch et al. Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors
CN102192921A (en) Semiconductor chip used for evaluation, evaluation system, and repairing method thereof
Gao et al. Two-dimensional mapping of interface thermal resistance by transient thermal measurement
Pape et al. Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods
Zoller et al. Packaging of small-scale thermoelectric generators for autonomous sensor nodes
Welker et al. Design, simulation and fabrication of liquid cooled LTCC devices utilizing integrated channels
JP2012184990A (en) Semiconductor chip for evaluation, evaluation system, and evaluation method for heat radiating material
AboRas et al. Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization
Borthen et al. Testing semiconductor devices at extremely high operating temperatures
Lenger et al. Reliability of Embedded SMD Resistors Realized by Face–down Technology
JP2002174577A (en) Thermal shock test apparatus and thermal shock test method
Ding et al. Parametric study of warpage in printed wiring board assemblies
Jorda et al. Thermal characterization of insulated metal substrates with a power test chip
KR20090003288A (en) Circuit Leads with Thermoelectric Pairs
Lynch et al. The effect of high dissipation components on the solder joints of ceramic chip carriers attached to thick film alumina substrates
Hannila et al. Hybrid thermal modeling to predict LED thermal behavior in hybrid electronics
KR101333309B1 (en) Advanced thermal cycling test system and method for reliability assessment of stack package
Kharbanda et al. Electro-thermal simulation and fabrication of LTCC hotplate with lead-free interconnects
Knoch et al. Ultra-Thin Glass Based Temperature Sensor Package for High Temperature Applications
Sikka Advanced thermal tester for accurate measurement of internal thermal resistance of high power electronic modules
Maierna et al. Electronic Packaging for MEMS Infrared Sensor With Filtered Optical Window
Liu et al. A general Weibull model for reliability analysis under different failure criteria-application on anisotropic conductive adhesive joining technology