[go: up one dir, main page]

Romero et al., 2013 - Google Patents

Experimental study of diode laser cutting of silicon by means of water assisted thermally driven separation mechanism

Romero et al., 2013

View PDF
Document ID
15915326173305634682
Author
Romero P
Otero N
Coto I
Leira C
González A
Publication year
Publication venue
Physics Procedia

External Links

Snippet

A novel variant of thermal laser dicing of crystalline silicon has been studied in this paper, by using fluid assistance to improve the reliability, flexibility and operational window of the current process. High quality laser cutting of monocrystalline and polycrystalline silicon is …
Continue reading at www.sciencedirect.com (PDF) (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2201/00—Articles made by soldering, welding or cutting by applying heat locally
    • B23K2201/36—Electric or electronic devices
    • B23K2201/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0054—Working by transmitting the laser beam within the workpiece
    • B23K26/0057—Working by transmitting the laser beam within the workpiece by modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure

Similar Documents

Publication Publication Date Title
CN100487869C (en) Laser processing method
KR101109860B1 (en) Laser processing method, cutting method for work and semiconductor device
CN100487868C (en) Laser processing method and semiconductor chip
EP3012061B1 (en) Laser processing method
US8759948B2 (en) Laser beam machining method and semiconductor chip
US8138450B2 (en) Method for cutting workpiece
KR101283228B1 (en) Laser processing method and object to be processed
US20150151380A1 (en) Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
JP3670267B2 (en) Laser processing method
TWI647187B (en) Method of separating a glass sheet from a carrier
JP5322418B2 (en) Laser processing method and laser processing apparatus
Romero et al. Experimental study of diode laser cutting of silicon by means of water assisted thermally driven separation mechanism
JP4509720B2 (en) Laser processing method
KR20190025721A (en) Laser processing apparatus and method for laser processing a workpiece
JP3935189B2 (en) Laser processing method
JP2007136554A (en) Laser processing method
JP4527098B2 (en) Laser processing method
JP2006082232A (en) Laser processing method
JP3869850B2 (en) Laser processing method
Gobet et al. Implementation of short-pulse lasers for wafer scribing and grooving applications
Savriama Review of laser technologies for dicing microelectronics chips
Mulembo et al. Developments in Silicon Wafer Micromachining
US20240371693A1 (en) Techniques for dicing bonded wafers using laser technologies
Pauchard et al. Advanced micromachining combining nanosecond lasers with water jet-guided laser technology
Fujita et al. Low-stress dicing assisted by pulsed laser for multilayer MEMS