Kim et al., 2014 - Google Patents
Stretching silver: printed metallic nano inks in stretchable conductor applicationsKim et al., 2014
- Document ID
- 14942817646928991023
- Author
- Kim J
- Kim W
- Publication year
- Publication venue
- IEEE Nanotechnology Magazine
External Links
Snippet
Stretchable electronics, recently highlighted as novel devices, attempt the biomimicry of humans? stretchable skin while maintaining full functionality. The stretchability of electronic devices overcomes restrictions on applications for flexible electronics and provides even …
- 239000000976 ink 0 title description 34
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L51/00—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
- H01L51/05—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture
- H01L51/0504—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential- jump barrier or surface barrier multistep processes for their manufacture the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or swiched, e.g. three-terminal devices
- H01L51/0508—Field-effect devices, e.g. TFTs
- H01L51/0512—Field-effect devices, e.g. TFTs insulated gate field effect transistors
- H01L51/0545—Lateral single gate single channel transistors with inverted structure, i.e. the organic semiconductor layer is formed after the gate electrode
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L51/00—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
- H01L51/0001—Processes specially adapted for the manufacture or treatment of devices or of parts thereof
- H01L51/0021—Formation of conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the metallic pattern or other conductive pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles, i.e. inks which are sinterable at low temperatures
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L51/00—Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
- H01L51/0096—Substrates
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Kim et al. | Stretching silver: printed metallic nano inks in stretchable conductor applications | |
Cai et al. | Review on flexible photonics/electronics integrated devices and fabrication strategy | |
Martins et al. | Advances in printing and electronics: From engagement to commitment | |
US12336115B2 (en) | Liquid metal fusion with conductive inks and pastes | |
Eshkeiti et al. | Screen printing of multilayered hybrid printed circuit boards on different substrates | |
Zhao et al. | A fast and cost-effective transfer printing of liquid metal inks for three-dimensional wiring in flexible electronics | |
Kwon et al. | Overview of recent progress in electrohydrodynamic jet printing in practical printed electronics: focus on the variety of printable materials for each component | |
Park et al. | Photolithography-based patterning of liquid metal interconnects for monolithically integrated stretchable circuits | |
Andrews et al. | Patterned liquid metal contacts for printed carbon nanotube transistors | |
Tong et al. | Printed thin-film transistors: research from China | |
Sun et al. | Fabricating flexible conductive structures by printing techniques and printable conductive materials | |
Wang et al. | Advances in the development of liquid metal-based printed electronic inks | |
Yu et al. | Materials, mechanics, and patterning techniques for elastomer-based stretchable conductors | |
Madaria et al. | Uniform, highly conductive, and patterned transparent films of a percolating silver nanowire network on rigid and flexible substrates using a dry transfer technique | |
Huang et al. | A transparent, conducting tape for flexible electronics | |
Feng et al. | Highly stretchable patternable conductive circuits and wearable strain sensors based on polydimethylsiloxane and silver nanoparticles | |
Mahajan et al. | Facile method for fabricating flexible substrates with embedded, printed silver lines | |
Zhong et al. | A study of screen printing of stretchable circuits on polyurethane substrates | |
Yin et al. | Highly conductive and flexible thin film electrodes based on silver nanowires wrapped carbon fiber networks for supercapacitor applications | |
CN113421698A (en) | Flexible conductive film capable of being firmly welded and preparation method and application thereof | |
KR20140038141A (en) | Planarizing printed electronic devices and method for manufacturing the same | |
Kim et al. | High-quality microprintable and stretchable conductors for high-performance 5G wireless communication | |
GB2581145A (en) | Method of manufacturing an elastic conductor, elastic conductor and electronic device comprising the elastic conductor | |
Yu et al. | Additive Manufacturing of Sandwich–Structured Conductors for Applications in Flexible and Stretchable Electronics | |
Rahman et al. | Direct writing of stretchable metal flake conductors: improved stretchability and conductivity by combining differently sintered materials |