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Truong et al., 2020 - Google Patents

Hydrogenation mechanisms of poly‐Si/SiOx passivating contacts by different capping layers

Truong et al., 2020

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Document ID
1385308232257624921
Author
Truong T
Yan D
Chen W
Tebyetekerwa M
Young M
Al-Jassim M
Cuevas A
Macdonald D
Nguyen H
Publication year
Publication venue
Solar RRL

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Herein, posttreatment techniques of phosphorus‐doped poly‐Si/SiOx passivating contacts, including forming gas annealing (FGA), atomic layer deposition (ALD) of hydrogenated aluminum oxide (AlOx: H), and plasma‐enhanced chemical vapor deposition (PECVD) of …
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    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
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    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers
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