[go: up one dir, main page]

Wang et al., 2023 - Google Patents

Decrypting the mechanisms of wicking and evaporation heat transfer on micro-pillars during the pool boiling of water using high-resolution infrared thermometry

Wang et al., 2023

View HTML @Full View
Document ID
13638918797073127779
Author
Wang C
Rahman M
Bucci M
Publication year
Publication venue
Physics of Fluids

External Links

Snippet

Surfaces with micrometer-scale pillars have shown great potential in delaying the boiling crisis and enhancing the critical heat flux (CHF). However, physical mechanisms enabling this enhancement remain unclear. This knowledge gap is due to a lack of diagnostics that …
Continue reading at pubs.aip.org (HTML) (other versions)

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions

Similar Documents

Publication Publication Date Title
Wang et al. Decrypting the mechanisms of wicking and evaporation heat transfer on micro-pillars during the pool boiling of water using high-resolution infrared thermometry
Dhillon et al. Critical heat flux maxima during boiling crisis on textured surfaces
Vadakkan et al. Transport in flat heat pipes at high heat fluxes from multiple discrete sources
Jung et al. Observations of the critical heat flux process during pool boiling of FC-72
Li et al. Parametric study of pool boiling on horizontal highly conductive microporous coated surfaces
Hanlon et al. Evaporation heat transfer in sintered porous media
Rainey et al. Pool boiling heat transfer from plain and microporous, square pin-finned surfaces in saturated FC-72
Nam et al. Characterization and modeling of the heat transfer performance of nanostructured Cu micropost wicks
EP3149425B1 (en) Integrated vapor chamber for thermal management of computing devices
Webb Next generation devices for electronic cooling with heat rejection to air
Shi et al. Performance test of an ultra-thin flat heat pipe with a 0.2 mm thick vapor chamber
Mochizuki Review of various thin heat spreader vapor chamber designs, performance, lifetime reliability and application
Zimmermann et al. Influence of system pressure on pool boiling regimes on a microstructured surface compared to a smooth surface
Yakomaskin et al. Investigation of heat transfer in evaporator of microchannel loop heat pipe
Ghaffari et al. Experimental investigation of the effect of heat spreading on boiling of a dielectric liquid for immersion cooling of electronics
Kim et al. Fundamental issues and technical problems about pulsating heat pipes
Wang et al. An experimental investigation of the transient characteristics on a flat-plate heat pipe during startup and shutdown operations
Bai et al. Evaporative heat transfer analysis of a heat pipe with hybrid axial groove
Xu et al. Adaptative two-phase thermal circulation system for complex-shaped electronic device cooling
Aghel et al. Heat-transfer enhancement of two-phase closed thermosyphon using a novel cross-flow condenser
Choi et al. Enhanced miniature loop heat pipe cooling system for high power density electronics
Chang et al. Evaporative thermal performance of vapor chambers under nonuniform heating conditions
Domiciano et al. Study of a new thin flat loop heat pipe for electronics
Hossain et al. Entropy generation minimization for boiling flow inside evaporator tube with R32 and R410A refrigerants: a comparison of different two-phase flow models
Shi et al. An experimental investigation of thermal performance of a polymer‐based flat heat pipe